• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.6
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• pp.562-567
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• 2022

Novel self-illuminated smart windows were fabricated consisting of Cu-doped ZnS (ZnS:Cu) powder and polymer-dispersed liquid crystal (PDLC). This smart window shows not only switchable transparency but also self-illumination without any attachable luminous body. Its electro-optical characteristics, transmittance, and luminance were investigated in relation to various applied voltages and composition ratios. The optical transmittance and luminous intensity increased with increasing applied voltages. However, the optical transmittance decreased with increasing ZnS:Cu powder content. One of the self-illuminated smart windows, which was fabricated with 9 wt% of ZnS:Cu, achieved the optical transmittance of 60.5% (at 550 nm) and the luminance of 11.0 cd/m² at 100 V. This smart window could be used as a normal switchable smart window in daytime and light-emitting signage at night.

• Progress in Superconductivity and Cryogenics
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• v.26 no.2
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• pp.1-4
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• 2024

We investigated Pb_10-xCu_x(PO₄)₆ (0.9 < x < 1.1) (LK-99) and Cu₂S, presumed to be contained as an impurity in LK-99, in a wide spectral range from far infrared to ultraviolet using optical spectroscopy. The optical conductivity spectra of both samples were obtained from measured reflectance spectra at various temperatures from 80 to 434 K. Both samples showed several infrared-active phonons in the far and mid-infrared regions. LK-99 showed typical insulating features with a band gap of ~1 eV. Cu₂S showed a nonmonotonic temperature-dependent trend and two energy gaps: one energy gap of ~93 meV and a band gap of 2.42 eV. Our results indicate that LK-99 cannot be a superconductor because it is an insulator with a large band gap.

• KSBB Journal
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• v.10 no.5
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• pp.475-481
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• 1995

The effect of metallothionein expression on the metal resistance and removal by recombinant Saccharomyces cerevisiae containing the plasmid pJW9 was investigated. The recombinant strain S. cerevisiae BZ-pJ was constructed by transforming the host strain S. cerevisiae BZ3l-1-7Ba with the gene coding for a metal-binding protein, metallothionein. Introduction of the MT gene yielded an increase in the minimum inhibitory concentration (MIC) of copper more than three times compared with the host strain. The minimum inhibitory concentrations of $Cr^{2+}, Znr^{2+} and Pb^{2+}, $ were not different for the two strains. The recombinant yeast grown in a medium containing 8mM CuSO4 was able to remove copper with a capacity of 18.9mg $Cu^{2+}$/g dry cell. In a mixture of copper and zinc, the presence of copper relieved the toxic effects caused by zinc, resulting in an enhancement of the final cell density and the specific growth rate of the recombinant yeast. The capability to remove copper by the recombinant yeast was linearly proportional to the copper concentrations in the medium. The efficiency of copper removal was rather constant regardless of the initial copper concentrations. The specific removal of zinc was dependent on the zinc concentrations in media, though, and such dependence was not so pronounced as the concentration of copper.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.8
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• pp.622-626
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• 2010

Cu doped $SnO_2$ thick films for gas sensors were fabricated by screen printing method on alumina substrates and annealed at $500^{\circ}C$ in air, respectively. Structural properties of $SnO_2$ by X-ray diffraction showed (110), (101) and (211) dominant tetragonal phase. The effects of catalyst Cu in $SnO_2$-based gas sensors were investigated. Sensitivity of $SnO_2$:Cu sensors to 2,000 ppm $CO_2$ gas and 50 ppm $H_2S$ gas was investigated for various Cu concentration. The highest sensitivity to $CO_2$ gas and $H_2S$ gas of Cu doped $SnO_2$ gas sensors was observed at the 8 wt% and 12 wt% Cu concentration, respectively. The improved sensitivity in the Cu doped $SnO_2$ gas sensors was explained by decrease of electron depletion region in Cu and $SnO_2$ junction, and increase of reactive oxygen and surface area in the $SnO_2$.

• Korean Chemical Engineering Research
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• v.60 no.2
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• pp.175-183
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• 2022

With the expansion of the automobile market, the demand for Nd as an essential rare earth material for automobile motors is rapidly increasing. Research on the calcio-thermic reduction process between Nd₂O₃ and calcium-based alloys has been extensively studied in order to manufacture Nd. In this study, Ca-Cu, as a reducing for Nd₂O₃, was prepared by electrolysis in CaCl₂ molten salt. Cu wire and graphite were employed as a working electrode and a counter electrode for electrolysis reaction, respectively. The reference electrode was manufactured by putting Ag wire in a mixture of AgCl and CaCl₂ at a ratio of 1:99 mol%. The cyclic voltammetry results showed that the deposition of Ca²⁺ on the surface of working electrode was observed from a potential of -1.8 V, and the reduction potential of Ca²⁺ decreased as the reaction temperature increased. The diffusion coefficient of Ca²⁺ calculated by the chronoamperometry experiment was found to be 5.4(±6.8)×10^-6 cm²/s. In addition, Ca-Cu liquid alloy was prepared by applying a constant potential to Cu electrodes. The element ratio of Ca-Cu alloy formed by applying a potential of -2.0 V was found to Ca:Cu=1:4.

• Resources Recycling
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• v.17 no.1
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• pp.51-58
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• 2008

Artificial mattes were prepared with adding pyrite or chalcopyrite as sulfur sources with Cu-Ni-Co-Fe alloy. The major phases identified by X-ray diffraction pattern were $(FeSi)_9S_8$, $CuFeS_2$, FeS, $Co_4S_3$, $Ni_3S_2$ and $Cu_2S$ for both mattes, and the matte prepared by adding chalcopyrite showed the higher peak of $Cu_2S$ due to high content of copper. Under optimum conditions, more than 95% copper, 90% nickel and 90% cobalt were extracted into leaching solution and sulfur concentration in the mattes did not much affect the leaching efficiency of the metals. The increase of the amount of pyrite or chalcopyrite added decreased pH in leaching solution and increased the concentration of iron ion dissolved in the leaching solution and the amount of residue.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.4
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• pp.253-261
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• 1994

Transformation behavior and superelastic behavior of Ti-Ni-Cu alloys with various Cu content has been investigated by means of electrical resistivity measurement, X-ray diffraction, tensile test and transmission electron microscopy. Two types of heat treatment are given to the specimens: i) Solutions treatment. ii) thermo-mechanical treatment. The transformation sequence in solution treated Ti-Ni-Cu Alloys substituted by Cu for Ni up to 5at.% occurs to $B2{\rightleftarrows}B19^{\prime}$ and it proceeds in two stages by addition of 10at.%Cu, i. e, $B2{\rightleftarrows}B19{\rightleftarrows}B19^{\prime}$. Also, it has been found that Ti-30Ni-20Cu alloy transformed in one stage : $B2{\rightleftarrows}B19$. The thermo-mechanically treated Ti-47Ni-3Cu alloy transformed in two stages: B2${\rightleftarrows}$rhomboheral phase${\rightleftarrows}B19^{\prime}$, while transformation sequence in Ti-45Ni-5Cu and Ti-40Ni-10Cu alloy transformed as same as solution treated specimens. The critical stress for inducing slip deformation in solution treated and thermo-mechanically treated Ti-40Ni-10Cu alloy is about 90MPa and 320Mpa respectively.

• Proceedings of the Korean Ceranic Society Conference
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• 2002.10a
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• pp.131.2-131
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• 2002

• Korean journal of food and cookery science
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• v.18 no.1
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• pp.87-93
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• 2002

Effect of copper ions (Cu$\^$+/ and Cu$\^$2+/) on the fermentation of kimchi, especially on their effect on the prevention of over-acidification of kimchi, was investigated. The effect of Cu$\^$2+/ ion on the growth of individual lactic acid bacterium originally isolated from kimchi was also investigated. The addition of Cu$\^$+/($\geq$4.0mM) or Cu$\^$2+/($\geq$3.0mM) ions in kimchi effectively inhibited growth of lactic acid bacteria and maintained a titratable acidity of less than 1.0% for a periods of 14 days. Leuconostoc mesenteroides significantly decreased at the 10th day of fermentation in control kimchi, whereas the group with Cu$\^$+/ and Cu$\^$2+/ showed 10$\^$5/-10$\^$6/ CFU/ml at the 14th day of fermentation. This indicates that the addition of Cu$\^$+/ and Cu$\^$2+/ inhibited the production of excessive acids by inhibiting lactic acid bacteria, and allowed Leu. mesenteroides stay alive longer. Fe$\^$2+/ and SO$_4$$\^$2-/ ions did not have any effect on the fermentation of kimchi. Cu$\^$2+/ inhibited growth of all lactic acid bacteria tested, such as Leu. mesenteroides 6, Streptococcus faecalis 12, Lactobacillus plantarum 14, Lac. brevis 15, Leu. mesenteroides LA 10, and Lac. plantarum LA 97.

• Journal of the Korean institute of surface engineering
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• v.56 no.3
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• pp.180-184
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• 2023

Scholars have proposed wafer-level bonding and three-dimensional (3D) stacked integrated circuit (IC) and have investigated Cu-Cu bonding to overcome the limitation of Moore's law. However, information about quantitative Cu-Cu direct-bonding conditions, such as temperature, pressure, and interfacial adhesion energy, is scant. This study determines the optimal temperature and pressure for Cu-Cu bonding by varying the bonding temperature to 100, 150, 200, 250, and 350 ℃ and pressure to 2,303 and 3,087 N/cm². Various conditions and methods for surface treatment were performed to prevent oxidation of the surface of the sample and remove organic compounds in Cu direct bonding as variables of temperature and pressure. EDX experiments were conducted to confirm chemical information on the bonding characteristics between the substrate and Cu to confirm the bonding mechanism between the substrate and Cu. In addition, after the combination with the change of temperature and pressure variables, UTM measurement was performed to investigate the bond force between the substrate and Cu, and it was confirmed that the bond force increased proportionally as the temperature and pressure increased.