• Title/Summary/Keyword: CuCl

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Solvent Extraction of Copper from $CuCl_2-NiCl_2-CoCl_2$ Solutions by Alamine336 and LIX84 ($CuCl_2-NiCl_2-CoCl_2$용액으로부터 Alamine336과 LIX84에 의한 구리의 용매추출)

  • Lee Man-Seung;Ahn Jong-Gwan;Ahn Jae-Woo
    • Resources Recycling
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    • v.11 no.6
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    • pp.12-17
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    • 2002
  • Solvent extraction experiments have been performed to separate copper from $CuCl_2$-$NiCl_2$-$CoCl_2$$ solutions using Alamine336 and LIX84. The complex formation tendency between metal ions and chloride ion had a great effect on the distribution coefficients of Cu, Co and Ni ions and separation factor of Cu to Co and Ni. In the experimental ranges of chloride ion concentration from 0.5 to 4.0 M, LIX84 was superior to Alamine336 in separating copper from cobalt. When the volume percentage of LIX84 and Alamine336 was varied from 5 to 40%, LIX84 was more effective than Alamine336 in separating Cu from Co and Ni in solutions in which the chloride ion concentration was 1.0 M.

Effect of Plasma Etching and $PdCl_2/SnCl_2$ Catalyzation on the Performance of Electroless Plated Copper Layer (플라즈마 에칭 및 $PdCl_2/SnCl_2$ 촉매조건이 무전해 동도금 피막의 성능에 미치는 영향)

  • 오경화;김동준;김성훈
    • Journal of the Korean Society of Clothing and Textiles
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    • v.27 no.7
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    • pp.843-850
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    • 2003
  • Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless plated Cu layer and polyester (PET) film, the effect of pretreatment conditions such as etching method, mixed catalyst composition were investigated. Chemical etching and plasma treatment increased surface roughness in decreasing order of Ar>HCl>O$_2$>NH$_3$. However, adhesion of Cu layer on PET film increased in the following order: $O_2$<Ar<HCl<NH$_3$. It indicated that appropriate surface roughness and introduction of affinitive functional group with Pd were key factors of improving adhesion of Cu layer. PET film was more finely etched by HCI tolution, resulting in an improvement in adhesion between Cu layer and PET film. Plasma treatment with NH$_3$produced nitrogen atoms on PET film, which enhances chemisorption of Pd$^{2+}$ on PET film, resulting in improved adhesion and shielding effectiveness of Cu layer deposited on the Pd catalyzed surface. Surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$; SnCl$_2$from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, adhesion and shielding effectiveness of Cu plated PET film were increased.d.

Solvent Extraction of Cuprous and Cupric Chloride from Hydrochloric Acid Solutions by Alamine336 (염산용액에서 Alamine336에 의한 염화 제1, 2구리의 용매추출)

  • Lee, Man-seung;Lee, Jin-Young
    • Korean Journal of Metals and Materials
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    • v.47 no.5
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    • pp.297-303
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    • 2009
  • Solvent extraction experiments of cupric and cuprous chloride with Alamine336 have been performed from HCl solution. In order to identify the solvent extraction reaction, distribution diagram of cupric and cuprous species with HCl concentration was obtained by considering complex formation reaction and the activity coefficient of solutes with Pitzer equation. Analysis of the solvent extraction data by graphical method together with the distribution diagram of copper indicated that solvent extraction reaction of copper with Alamine336 depends on HCl concentration. In strong HCl solution of 3 and 5 M, ${CuCl_4}^{2-}$ and ${CuCl_3}^{2-}$ took part in the solvent extraction reaction as Cu(II) and Cu(I), respectively. When HCl concentration was 1 M, ${CuCl_2}^-$ was extracted into the organic phase in the case of Cu(I) while adduct formation between $Cu^{2+}$ and Alamine336 was responsible for the solvent extraction reaction of Cu(II).

Ionic Equilibria in Mixed Solutions of Cuprous and Cupric Chloride (염화 제1구리와 제2구리 혼합용액의 이온평형)

  • Lee, Man Seung;Nicol, M.J.
    • Korean Journal of Metals and Materials
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    • v.46 no.1
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    • pp.20-25
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    • 2008
  • The ionic equilibira in mixed solutions of cuprous and cupric chloride were analyzed by considering chemical equilibria, mass and charge balance equations. The activity coefficients of solutes were calculated by using Bromley equation. Required thermodynamic constants and interaction parameters were evaluated from the data reported in the literature. The effect of NaCl and CuCl concentrations on the pH and potential of the mixed solutions was explained in terms of the variation in the concentration of solutes and in the activity of hydrogen ion. The calculated pH values of the mixed solutions agreed well with the measured values. However, the calculated values for the potential of the mixed solutions were lower than the measured values, indicating the necessity of considering the complex formation between cuprous and chloride ion, such as $Cu^2Cl{_4}^{2-}$ and $Cu_3Cl{_6}^{3-}$.

Photoelectronic Properties of CdTe Films Sintered with $CdCl_2$ and $CuCl_2$ ($CdCl_2$$CuCl_2$ 양에 따른 CdTe 소결막의 광전기적 성질)

  • Im, Ho-Bin;Sohn, Dong-Kyun
    • Proceedings of the KIEE Conference
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    • 1987.11a
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    • pp.257-259
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    • 1987
  • The photoelectronic properties of CdTe films sintered with various amounts of $CdCl_2$ and $CuCl_2$ have been investigated by measurements of dark electrical resistivity, photocurrent, thermoelectric power, optical transmission and by observation of microstructure. The grain size and optical transmission of sintered CdTe films increase with increasing amount of $CdCl_2$ indicating that $CdCl_2$ acts as a sintering aid. The photoconductivity gain(A-$cm^2/W$) increases and resistivity($\Omega$-cm) decreases with increasing amount of $CuCl_2$ up to 100ppm due to the occurance of Cu-doping during sintering. The dark resistivity could be reduced farther by post heat treatments. The dark resistivity was still high($10^3{\Omega}$-cm) so that the accurate determination of the hole concentration by Hall measurement or by thermoelectric power measurement was not possible. From the analysis of electrical activation energy, however it can be concluded that the hole concentration is less than $10^{14}/cm^3$ and all grains are depleted of carrier by the trapping centers at grain boundaries.

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Electrochemical Deposition Characteristics of Ca2+ on Cu Wire Electrode in CaCl2 Molten Salt (CaCl2 용융염에서 Ca2+의 Cu 전극에 대한 전기화학적 증착 특성평가)

  • Hwang, Dong Wook;Lee, Jong Hyeon;Jeong, Sang Mun
    • Korean Chemical Engineering Research
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    • v.60 no.2
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    • pp.175-183
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    • 2022
  • With the expansion of the automobile market, the demand for Nd as an essential rare earth material for automobile motors is rapidly increasing. Research on the calcio-thermic reduction process between Nd2O3 and calcium-based alloys has been extensively studied in order to manufacture Nd. In this study, Ca-Cu, as a reducing for Nd2O3, was prepared by electrolysis in CaCl2 molten salt. Cu wire and graphite were employed as a working electrode and a counter electrode for electrolysis reaction, respectively. The reference electrode was manufactured by putting Ag wire in a mixture of AgCl and CaCl2 at a ratio of 1:99 mol%. The cyclic voltammetry results showed that the deposition of Ca2+ on the surface of working electrode was observed from a potential of -1.8 V, and the reduction potential of Ca2+ decreased as the reaction temperature increased. The diffusion coefficient of Ca2+ calculated by the chronoamperometry experiment was found to be 5.4(±6.8)×10-6 cm2/s. In addition, Ca-Cu liquid alloy was prepared by applying a constant potential to Cu electrodes. The element ratio of Ca-Cu alloy formed by applying a potential of -2.0 V was found to Ca:Cu=1:4.

Chlorine effect on ion migration for PCBs under temperature-humidity bias test (고온고습 전원인가 시험에서 Cl에 의한 이온 마이그레이션 불량)

  • Huh, Seok-Hwan;Shin, An-Seob
    • Journal of Welding and Joining
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    • v.33 no.3
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    • pp.47-53
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    • 2015
  • By the trends of electronic package to be more integrative, the fine Cu trace pitch of organic PCB is required to be a robust design. In this study, the short circuit failure mechanism of PCB with a Cl element under the Temperature humidity bias test ($85^{\circ}C$/85%RH/3.5V) was examined by micro-structural study. A focused ion beam (FIB) and an electron probe micro analysis (EPMA) were used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $CuCl_x$ were formed and grown on Cu trace during the $170^{\circ}C$/3hrs and that $CuCl_x$ was decomposed into Cu dendrite and $Cl_2$ gas during the $85^{\circ}C$/85%RH/3.5V. It is suggested that Cu dendrites formed on Cu trace lead to a short circuit failure between a pair of Cu traces.

Nonlinear Optical Properties and Photoluminescence of CuCl Nanocrystals Embedded in Silica Glass

  • 이민영
    • Bulletin of the Korean Chemical Society
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    • v.16 no.2
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    • pp.126-129
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    • 1995
  • Linear and nonlinear optical properties of CuCl nanocrystals in silica glass have been studied using low temperature absorption, degenerate four wave mixing (DFWM), and time-resolved photoluminescence spectroscopy. Assuming a spherical shape, effective radius of the CuCl quantum dots was estimated to be 2.5 nm, which is obtained from low temperature absorption data. The DFWM experiment was performed in 380-386 nm wavelength region, and the diffracted signal was measured as a function of wavelength with 1.0 nm interval. Time-resolved photoluminescence measurement was also carried out at 77 K to obtain the time response of CuCl nanocrystals. The experimental results on the large third order nonlinear optical of CuCl quantum dots are explained in terms of crystal size and oscillator strength of quantum spheres.

A Study on the Surface Properties of Al Alloys after Reactive Ion Etching (Al 합금의 반응성 이온 식각후 표면 특성 연구)

  • Kim, Chang-Il;Kwon, Kwang-Ho;Park, Hyung-Ho
    • Proceedings of the KIEE Conference
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    • 1995.11a
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    • pp.338-341
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    • 1995
  • The surface properties after plasma etching of Al(Si, Cu) solutions using the chemistries of chlorinated and fluorinated gases with varying the etching time have been investigated using X-ray Photoelectron Spectroscopy. Impurities of C, Cl, F and O etc are observed on the etched Al(Si, Cu) films. After 95% etching, aluminum and silicon show metallic states and oxized (partially chlorinated) states, copper shows Cu metallic states and Cu-Clx(x$CuCl_x$ (x$CuCl_x$ (1

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Effect of Cu concentration on the luminescence of ZnS:Cu,Cl blue-green phosphor

  • Cho, Tai-Yeon;Lee, Hak-Soo;Han, Sang-Do;Gwak, Ji-Hye;Shin, Dong-Hyuk;Han, Chi-Hwan
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08b
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    • pp.1537-1538
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    • 2007
  • ZnS:Cu,Cl phosphor was synthesized by solid-liquid state reaction with two firing steps. Each stage of the process was carefully monitored so that the final product was comparable to commercially-available phosphor. The effect of $Cu^{2+}-doping$ concentration has been investigated on the luminescence characteristics of ZnS:Cu,Cl blue-green phosphors for inorganic electroluminescent device.

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