• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.35-35
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• 2004

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.187-189
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• 2003

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.35-40
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• 2010

In this study, the reliability of thermal shock, thermal cycle, and complex vibration test at high temperature were examined for 3 types of lead-free solder alloys, Sn-3.5Ag, Sn-0.7Cu and Sn-5.0Sb. For the reliability test, daisychained BGA chips with ENIG-finished Cu pad was assembled with the three lead-free solders on OSP-finished PCBs. Among the 3 types solder alloys, Sn-3.5Ag solder alloy showed the highest degradation rate of electrical resistance and joint strength. On the other hand, Sn-0.7Cu solder alloy had high stability after the reliability tests.

• Journal of Welding and Joining
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• v.24 no.6
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• pp.21-27
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• 2006

This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2000.02a
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• pp.85-88
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• 2000

Cu-free Bi-Sr-Ca-O powder mixtures were screen-printed on Cu tapes and heat-treated at 850-$870^{\circ}C$ for several minutes in air, oxygen, nitrogen and low oxygen pressure. Cu-free precursors were composed of Bi_{x}$SrCaO_{y}$ (x=1.2-2). In order to obtain the optimum heat-treatment condition, we studied on an effect of the precursor composition, the printing thickness and the heat-treatment atmosphere on the superconducting properties of Bi2212 films and the reaction mechanism of their rapid formation. Microstructures and phases of thick films were analyzed by optical microscope and XRD. The electric properties of superconducting films were examined by the four probe method. At heat-treatment temperature, the thick films were in a partially molten state by liquid reaction between CuO in the oxidized copper tape and the precursors which were printed on Cu tapes.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.263-265
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• 2009

In this study, ultrafine grained (UFG) oxygen free high conductivity copper (OFHC Cu) having two different grain morphologies, one the severely elongated and the other the equiaxed, was prepared by equal channel angular pressing (ECAP) with routes A and $B_c$, respectively. The results of quasi-static tensile tests at $10^{-1}\;s^{-1}$ and $1\;s^{-1}$ and dynamic compression tests at $10^3\;s^{-1}$ order revealed that the equiaxed UFG Cu exhibited higher strength and less ductility compared to the elongated one. The difference of the plastic flow characteristics between the two were rationalized by considering their dislocation mean free length based on the orientation relationship between the possible slip planes and the loading direction.

• Bulletin of the Korean Chemical Society
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• v.28 no.12
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• pp.2329-2332
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• 2007

Salsolinol, endogenous neurotoxin, is known to be involved in the pathogenesis of Parkinson's disease (PD). In the present study, we have investigated the oxidative damage of DNA induced by the reaction of salsolinol with Cu,Zn-SOD. When plasmid DNA incubated with salsolinol and Cu,Zn-SOD, DNA cleavage was proportional to the concentrations of salsolinol and Cu,Zn-SOD. The salsolinol/Cu,Zn-SOD system-mediated DNA cleavage was significantly inhibited by radical scavengers such as mannitol, ethanol and thiourea. These results indicated that free radicals might participate in DNA cleavage by the salsolinol/Cu,Zn-SOD system. Spectrophotometric study using a thiobarbituric acid showed that hydroxyl radical formation was proportional to the concentration of salsolinol and was inhibited by radical scavengers. These results indicated that hydroxyl radical generated in the reaction of salsolinol with Cu,Zn-SOD was implicated in the DNA cleavage. Catalase and copper chelators inhibited DNA cleavage and the production of hydroxyl radicals. These results suggest that DNA cleavage is mediated in the reaction of salsolinol with Cu,Zn-SOD via the generation of hydroxyl radical by a combination of the oxidation reaction of salsolinol and Fenton-like reaction of free copper ions released from oxidatively damaged SOD.

• 한국신재생에너지학회:학술대회논문집
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• 2007.11a
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• pp.270-273
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• 2007

In this report, Indium-free and Indium-reduced thin film materials for solar absorber were studied in order to search alternative materials for thin film solar cell. The films of $Cu_2ZnSnSe_4$ and $Cu_2ZnSnSe_2$ were deposited using mixed binary chalcogenides powders. From the film bulk analysis result, it is observed that Cu concentration is a function of substrate temperature as well as CuSe mole ratio in the target. Under optimized conditions, $Cu_2ZnSnSe_4$ and $Cu_2ZnSnSe_2$ thin films grow with strong (112), (220/204) and (312/116) reflections. Films are found to exhibit a high absorption coefficient of $10^4$ $cm^{-1}$. $Cu_2ZnSnSe_4$ film shows a 1.5 eV band gap. On the other side, an increasing of optical band gap from 1.0 eV to 1.25 eV ($CuInSnSe_2$) is found to be proportional with an increasing of Zn concentration. All films have a p-type semiconductor characteristic with a carrier concentration in the order of $10^{14}$ $cm^{-3}$, a mobility about $10^1$ $cm^{2{\cdot}-1.}S^{-1}$ and a resistivity at the range of $10^2-10^6$ ${\Omega}{\cdot}m$.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.218-220
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• 2006

Sn-3.0Ag-0.5Cu solder is widely used as micro-joining materials of flip chip package(FCP) because of the fact that it causes less dissolution and has good thermal fatigue property. However, compared with ternary electroplating in the manufacturing process, binary electroplating is still used in industrial field because of easy to make plating solution and composition control. The objective of this research is to fabricate Sn-3.0Ag-0.5Cu solder bumping having accurate composition. The ternary Sn-3.0Ag-0.5Cu solder bumping could be made on a Cu pad by sequent binary electroplating of Sn-Cu and Sn-Ag. Composition of the solder was estimated by EDS and ICP-OES. The thickness of the bump was measured using SEM and the microstructure of intermetallic-compounds(IMCs) was observed by SEM and EDS. From the results, contents of Ag and CU found to be at $2.7{\pm}0.3wt%\;and\;0.4{\pm}0.1wt%$, respectively.

• Bulletin of the Korean Chemical Society
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• v.28 no.2
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• pp.263-270
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• 2007

New mono- and bis-Cu(II)-triazacyclononane(tacn) complex that conjugated with 9-aminoacridine were synthesized, and their binding modes and DNA cleavage activity were investigated in this study. When the classic intercalator, 9-aminoacridine, was conjugated to mono- and bis-Cu(II)-tacn complexes, a significant red-shift and hypochromism in absorption spectrum was apparent in the acridine absorption region upon binding to DNA. Furthermore, the magnitude of the negative reduced linear dichroism signal in the substrate absorption region appeared to be larger than that in the DNA absorption region. These spectral observations indicated that the acridine moiety intercalated when the Cu(II)-tacn complex was conjugated. In contrast, from a close analysis of the circular and linear dichroism spectrum, the aminoacridine-free bis-Cu(II)-tacn complex was concluded to bind at the phosphate groups of DNA. The 9-aminoacridine-free-bis-Cu(II)-tacn complex produces the nicked and linear DNA. On the other hand, 9-aminoacridine conjugated mono-and bis-Cu(II)-tacn complexes showed unspecific binding with negligible DNA cleavage.