(Interfacial reaction, IMC morphology and joint reliability of Pb-free Sn-Ag-(Cu) and Sn-Cu solders on electrolytic Ni BGA substrate) (전해 Ni BGA 기판상의 무연 Sn-Ag-(Cu)와 Sn-Cu 솔더의 계면반응, IMC 형상과 접합부 신뢰성에 관한 연구)
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- Proceedings of the International Microelectronics And Packaging Society Conference
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- 2004.11a
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- pp.35-35
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- 2004