• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.193-200
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• 2007

Micro forming is a suited technology to manufacture very small metallic parts(several $mm{\sim}{\mu}m$). Al5083 superplastic alloy with very small grains has a great advantage in achieving micro deformation under low stress due to its relatively low strength at a specific high temperature range. Micro forming of $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk Metallic glass(BMG) as a candidate material for this developing process are feasible at a relatively low stress in the supercooled liquid state without any crystallization during hot deformation. In this study, the micro formability of Al5083 superplastic alloy and bulk metallic glass, $Zr_{62}Cu_{17}Ni_{13}Al_8$, was investigated with the specially designed micro vibration forming system using pyramid-shape, V-shape and U-shape micro die pattern. With these dies, micro vibration forming was conducted by varying the applied load, time. Micro formability was estimated by comparing the hight of formed shape using non-contact surface profiler system. The vibration load effect to metal flow in the micro die and improve the micro formability of Al5083 superplastic alloy and $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk Metallic glass(BMG).

• Journal of Surface Science and Engineering
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• v.46 no.6
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• pp.248-257
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• 2013

It is generally recognized that thin Pd-Cu alloy films fabricated by sputtering show a wide range of microstructures and properties, both of which are highly dependent on the sputtering conditions. In view of this, the present study aims to investigate the relationship between the performance of hydrogen separation membranes and the microstructure of Pd alloy films depending on sputtering deposition conditions such as substrate temperature, working pressure, and DC power. We fabricated thin and dense Pd-Cu alloy membranes by the micro-polishing of porous Ni support, an advanced Pd-Cu sputtered multi-deposition under the conditions of high substrate temperature / low working pressure / high DC power, and a followed by Cu-reflow heat-treatment. The result of a hydrogen permeation test indicated that the selectivity for $H_2/N_2$ was infinite because of the void-free and dense surface of the Pd alloy membranes, and the hydrogen permeability was 10.5 $ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ for a 6 ${\mu}m$ membrane thickness.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.57-57
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• 2000

Brazing characteristics of the LTCC(Low Temperature Co-fired Ceramics)/ Kovar(Fe-Ni-Co alloy) was investigated. Kovar is one of the typical material for the lid of MCM and packages. In case of alumina package, Brazing process is done by higher temperature profile than 800 $^{\circ}C$ and Ag-Cu alloy. But, LTCC has sintering temperature near 850 $^{\circ}C$. So, it is difficult to use the same process as alumina brazing. The adhesion strength of the brazed part is affected by brazing alloy and metallization properties between conductor pattern and LTCC material. We investigated brazing characteristics of the LTCC/Kovar using various brazing alloys(Ag-Cu, Au-Sn) and process conditions. And, we examined the influence of the glass contents in conductor on the brazing characteristics of the LTCC/Kovar.

• The Journal of Advanced Prosthodontics
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• v.6 no.3
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• pp.215-223
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• 2014

PURPOSE. This study aimed to develop a copper-aluminium-nickel alloy which has properties comparable to that of dental alloys used for dental post and core applications with the reasonable cost. MATERIALS AND METHODS. Sixteen groups of experimental copper alloys with variants of 3, 6, 9, 12 wt% Al and 0, 2, 4, 6 wt% Ni were prepared and casted. Their properties were tested and evaluated. The data of thermal, physical, and mechanical properties were analyzed using the two-way ANOVA and Tukey's test (${\alpha}$=0.05). The alloy toxicity was evaluated according to the ISO standard. RESULTS. The solidus and liquidus points of experimental alloys ranged from $1023^{\circ}C$ to $1113^{\circ}C$ and increased as the nickel content increased. The highest ultimate tensile strength ($595.9{\pm}14.2$ MPa) was shown in the Cu-12Al-4Ni alloy. The tensile strength was increased as the both elements increased. Alloys with 3-6 wt% Al exhibited a small amount of 0.2% proof strength. Accordingly, the Cu-9Al-2Ni and Cu-9Al-4Ni alloys not only demonstrated an appropriate modulus of elasticity ($113.9{\pm}8.0$ and $122.8{\pm}11.3$ GPa, respectively), but also had a value of 0.2% proof strength ($190.8{\pm}4.8$ and $198.2{\pm}3.4$ MPa, respectively), which complied with the ISO standard requirement (>180 MPa). Alloys with the highest contents of nickel (6 wt% Ni) revealed a widespread decolourisation zone (5.0-5.9 mm), which correspondingly produced the largest cell response, equating positive control. CONCLUSION. The copper alloys fused with 9 wt% Al and 2-4 wt% Ni can be considered for a potential use as dental post and core applications.

• Journal of Korea Foundry Society
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• v.22 no.3
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• pp.109-113
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• 2002

A good fluidity of high strength Al-alloys is required to cast thin wall castings needed to reduce the weight of cast parts. The fluidity, measured as the length to which the metal flows in a standard channel, is affected by many factors, such as the pouring temperature, solidification type of the alloy, the channel thickness, melt head, mold materials and temperature, coating etc. Therefore the experimentally measured fluidity scatters very much and makes it difficult to estimate the fluidity of a melt with a few measurements. The effect of Ti content and grain refinement on the fluidity of high strength aluminum alloy was investigated with a test casting with 8 thin flow channels to reduce the scattering of the fluidity results. The fluidity of Al-4.8%Cu-0.6%Mn Al-6.2%Zn-1.6%Mg-1.0%Cu and well-known commercial aluminum alloy, A356 was tested. Initial content of Ti was varied from 0 to 0.2wt% and Al-5Ti-B master alloy was added for grain refinement. The flow length varied linearly with superheat. By adding Ti and Al-5Ti-B, the fluidity increased. The grain size decreased by adding grain refiner at the same time. The fluidity depended on the degree of grain refinement. The fluidity of the alloy solidifying in mushy type is improved by grain refinement, because grain refinement increases the solid fraction at the time of flow stoppage.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.51-57
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• 2008

In this paper, wetting and interfacial reaction properties for low Ag containing Sn-Ag-Cu Pb-free solder alloy, i.e., Sn-0.3Ag-0.7Cu were investigated and compared with those of Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu. Melting behavior and stress-strain curves of some Sn-xAg-xCu alloys were also measured using a differential scanning calorimeter(DSC) and a tensile test machine, respectively. In order to enhance insufficient wetting properties of Sn-0.3Ag-0.7Cu alloy, the improvement of wetting properties were analyzed by applying fluxes containing higher content of halide or indium adding of 0.2wt.% into the solder alloy. It was concluded that the small addition of indium is more effective for the improvement of wettability in low temperature range of $230{\sim}240^{\circ}C$ than applying flux containing higher content of halide.

• Journal of the Korean Society for Heat Treatment
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• v.5 no.3
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• pp.149-156
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• 1992

Transformation behavior and reversible shape memory effct of Ti-Ni-Cu alloys with various Cu content has been investigated by means of electrical resistivity measurement, differential scanning calorimetry. X-ray diffraction and strain gage sensor. The transformation sequence in Ti-Ni-Cu alloys substituted by Cu for Ni up to 5at.% occurs to $B2{\leftrightarrow}B19^{\prime}$ and it proceeds in two stages by addition of 10 at.%Cu. i.e. $B2{\leftrightarrow}B19{\leftrightarrow}B19^{\prime}$. But the content of Cu increases up to 20at.%, it has been transformed in one stage ; $B2{\leftrightarrow}B19$. The shape change of Ti-40Ni-10Cu alloy which was constrain aged in circular form bended in $B2{\leftrightarrow}B19$ transformation but it spreaded out in $B19{\leftrightarrow}B19^{\prime}$ transformation. The amount of reversible shape change (${\Delta}{\varepsilon}$) of Ti-47Ni-3Cu alloy constrain aged at $400^{\circ}C$ after solution treatment has a maximum value of about $5.6{\times}10^{-3}$, but that of cold rolled and constrain aged specimens exhibits a little value independent of Cu concentrations.

• Journal of Korea Foundry Society
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• v.41 no.6
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• pp.528-534
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• 2021

To confirm effects of natural and artificial aging of precipitate on thermal diffusivity and hardness, the studied Al-Mg-Si alloy were manufactured by gravity casting method with 0.6 wt% and 1.0 wt% additional Cu element. The samples were used for measuring thermal diffusivity and hardness. The addition of Cu, promoted by intermediates such as Q'' and θ'' phases, contributing to the improvement of hardness and high-temperature thermal diffusivity. The natural aging decreased the hardness of the Al-Mg-Si-Cu alloys with increasing time, but did not affect the thermal diffusivity.

• Proceedings of the KWS Conference
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• 1994.10a
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• pp.173-176
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• 1994

• Journal of the Korean Society for Heat Treatment
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• v.26 no.5
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• pp.225-232
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• 2013

The influence of aging treatment, addition elements and rolling reduction ratio on the microstructure, mechanical, electrical and bendability properties of Cu-Ni-Si-P-x (x = Fe, Sn, Zn) alloys for connector material application was investigated. SEM/EDS analysis exhibited that Ni2-Si precipitates with a size of 20~100 nm were distributed in grains. Fe, Sn, Zn elemnets in Cu-Ni-Si-P alloy imporved the mechanical strength but it was not favor in increasing of electrical conductivity. As higher final rolling reduction ratio, the strength and electrical conductivity is increased after aging treatment, but it indicated excellent bendability. Especially, Cu-2Ni-0.4Si-0.5Sn-0.1Fe-0.03P alloy show the tensile strength value of 700MPa and the electrical conductivity was observed to reach a maximum of 40%IACS. It is optimal for lead frame and connector.