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http://dx.doi.org/10.12656/jksht.2013.26.5.225

Mechanical and Physical Property Changes of Cu-Ni-Si-Sn-Fe-P Copper Alloy System According to the Heat Treatment Conditions  

Kim, Seung-Ho (School of Mechanical Engineering, University of Ulsan)
Yum, Young-Jin (School of Mechanical Engineering, University of Ulsan)
Publication Information
Journal of the Korean Society for Heat Treatment / v.26, no.5, 2013 , pp. 225-232 More about this Journal
Abstract
The influence of aging treatment, addition elements and rolling reduction ratio on the microstructure, mechanical, electrical and bendability properties of Cu-Ni-Si-P-x (x = Fe, Sn, Zn) alloys for connector material application was investigated. SEM/EDS analysis exhibited that Ni2-Si precipitates with a size of 20~100 nm were distributed in grains. Fe, Sn, Zn elemnets in Cu-Ni-Si-P alloy imporved the mechanical strength but it was not favor in increasing of electrical conductivity. As higher final rolling reduction ratio, the strength and electrical conductivity is increased after aging treatment, but it indicated excellent bendability. Especially, Cu-2Ni-0.4Si-0.5Sn-0.1Fe-0.03P alloy show the tensile strength value of 700MPa and the electrical conductivity was observed to reach a maximum of 40%IACS. It is optimal for lead frame and connector.
Keywords
Precipitation; Aging treatment; Bendability; Softening resistance;
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