• 한국진공학회지
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• 제3권2호
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• pp.203-206
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• 1994

동시증착법으로 성장한 CuIn3Se5 박막의 구조 및 광학적 특성을 XRD, SEM 광투과 및 광반사 측정으로부터 조사하였다. XRD 측정에 의하면 CuIn3Se5 는 정열된 Cu 빈자리와 Cuqls자리에 in으로 대 치되는 defect chalcopyrite 구조임이 확인디었다. 또한 광흡수 측정으로부터 CuIn3Se5 는 금지대내에서 직접 전이에 의한 광흡수 특성을 보여주며 이때 에너지띠 간격은 1.27ev 이었다. CuIn3Se5 박막에 대한 연구결과들은 CuInSe2 의 결과들과 비교하여 논의하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.193-196
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• 2001

Single phase CuInS$_2$ thin film with the highest diffraction peak (112) at diffraction angle (2$\theta$) of 27.7$^{\circ}$ and the second highest diffraction peak (220) at diffraction angle (2$\theta$) of 46.25$^{\circ}$ was well made with chalcopyrite structure at substrate temperature of 70 $^{\circ}C$, annealing temperature of 25$0^{\circ}C$, annealing time of 60 min. The CuInS$_2$ thin film had the greatest grain size of 1.2 ${\mu}{\textrm}{m}$ and Cu/In composition ratio of 1.03. Lattice constant of a and c of that CuInS$_2$ thin film was 5.60 $\AA$ and 11.12 $\AA$ respectively. Single phase CuInS$_2$ thin films were accepted from Cu/In composition ratio of 0.84 to 1.3. P-type CuInS$_2$ thin films were appeared at over Cu/In composition ratio of 0.99. Under Cu/In composition ratio of 0.96, conduction types of CuInS$_2$ thin films were n-type. Also, fundamental absorption wavelength, the absorption coefficient and optical energy band gap of p-type CuInS$_2$ thin film with Cu/In composition ratio of 1.3 was 837 nm, 3.0x10 $^4$ $cm^{-1}$ / and 1.48 eV respectively. When CuAn composition ratio was 0.84, fundamental absorption wavelength, the absorption coefficient and optical energy band gap of n-type CuInS$_2$ thin film was 821 nm, 6.0x10$^4$ $cm^{-1}$ / and 1.51 eV respectively.

• 한국재료학회지
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• 제14권12호
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• pp.829-834
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• 2004

Annealing of $Cu(B)/Ti/SiO_2$ in vacuum has been carried out to investigate the effects of Ti underlayer on microstructure in $Cu(B)/Ti/SiO_2$ structures. For comparison, $Cu(B)/Ti/SiO_2$ structures was also annealed in vacuum. Three different temperature dependence of Cu growth can be seen in $Cu(B)/Ti/SiO_2$; B precipitates- pinned grain growth, abnormal grain growth, normal grain growth. The Ti underlayer having a strong affinity for B atoms reacts with the out-diffused B to the Ti surface and forms titanium boride at the Cu-Ti interface. The formation of titanium boride acts as a sink for the out-diffusion of B atoms. The depletion of boron in grain boundaries of Cu films, as results of the rapid diffusion of B along the grain boundaries and the insufficient segregation of B to the grain boundaries, induces grain boundaries to migrate and causes the abnormal grain growth. The increased bulk diffusion coefficient of B within Cu grains can be responsible for the normal grain growth occurring in the annealed $Cu(B)/Ti/SiO_2\;at\;600^{\circ}C$. In contrast, the $Cu/SiO_2$ structures show only the abnormal growth of grains and their sizes increasing as the temperature increases above $400^{\circ}C$.

• 한국토양비료학회지
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• 제32권4호
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• pp.412-420
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• 1999

하수오니 처리 석회질 토양에서의 Cd, Cu 및 Zn의 수송 특성을 조사하기 위하여 하수오니 무처리 토양, 하수오니 50과 100 ton $ha^{-1}$ 처리 토양 및 하수 오니를 대상으로 용출현상 (elution development)과 혼성치환 (miscible displacement) 기술을 이용하여 실험을 수행하였다. 하수오니 50과 100 ton $ha^{-1}$처리 토양의 Cd, Cu 및 Zn 의 용출곡선 (elution curve)과 출현곡선 (breakthrough curve)은 하수오니 무처리 토양의 Cd, Cu 및 Zn의 용출곡선 및 출현곡선과 거의 비슷하였다. Cd, Cu, 및 Zn 10 mg을 처리한 Cd, Cu 및 Zn의 용출곡선은 Cd, Cu 및 Zn을 처리하지 않았을 때의 용출곡선과는 거의 비슷하였으나, Cd, Cu 및 Zn의 50 mg을 처리한 용출곡선과는 크게 달랐다. Cd, Cu 및 Zn 혼합용액 500과 $1000mg\;L^{-1}$을 이용한 Cd, Cu 및 Zn의 출현곡선은 서로 비슷하였으나, Cd, Cu 및 Zn 혼합용액 $100mg\;L^{-1}$을 이용한 출현곡선과는 크게 달랐다. 실험에 사용한 석회질 토양에서 하수오니 50과 100 ton $ha^{-1}$ 처리량은 Cd, Cu 및 Zn의 수송특성에 큰 영향을 주지 못하였으며, Cd와 Zn의 수송특성은 서로 비슷하였으나 Cu의 수송특성은 Cd 과 Zn의 수송 특성과는 크게 달랐다.

• 대한화학회지
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• 제50권1호
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• pp.60-64
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• 2006

구조의 유기-무기 혼성화합물 Cu2(OH)3(CH3COO)·H2O를 선구물질로 사용하여 Cu2O를 합성하였다. 75oC의 수용액에서 Cu2(OH)3(CH3COO)·H2O를 글루코오스로 환원시켜서 정육면체 Cu2O를 합성하였다. 선구물질과 글루코오스의 효과를 조사하였다. Cu2(OH)3(CH3COO)·H2O의 구조는 균일한 크기의 Cu2O를 만드는데 중요한 역할을 한다.

• 한국표면공학회지
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• 제52권4호
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• pp.227-232
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• 2019

Mo-N based coatings have been studied for enhancing mechanical characteristics of thin films. In the case of Mo-X-N coatings, the microstructure and mechanical properties can be affected by the addition of the third element. In this work, Mo-Cu-N coatings were successfully fabricated with varying the Cu content from 4.5 at% to 31 at% by the co-sputtering method. Thus, properties of the coatings were analyzed by EDS, SEM, XRD, AFM, nano indentation and scratch test techniques. From observed results, MoxN bonds were made in a nitrogen atmosphere and Cu elements were present at grain boundaries. In addition, coatings with the Cu content above 14 at% had a Cu3N peak in the XRD results. Thus, it is suggested that the formation of Cu3N phase affected the microstructure and mechanical properties of Mo-Cu-N coatings. Mechanical properties of Mo-Cu-N coatings were found to be relatively better at Cu content of about 12 at%.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 추계학술대회 논문집
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• pp.109-112
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• 1995

CuInS$_2$thin film was prepared by heat treatment at vacuum 10$\^$-3/ Torr of S/In/Cu stacked layer which was deposited by sequential. And so, the polycrystalline CuInS$_2$with chalcopyrite structure was well made at heat treatment temperature of 250$^{\circ}C$ and heat treatment time of 60 min. Single phase of CuInS$_2$was formed from Cu/In composition ratio of 0.84 to 1.3. p conduction type of CuInS$_2$thin film was appeared from Cu/In competition ratio of 0.99. The highest resistivity of CuInS$_2$with p type was 1.608${\times}$10$^2$$\Omega$cm at Cu/In composition ratio of 0.99 and The lowest resistivity was 5.587${\times}$10$\^$-2/$\Omega$cm at Cu/In composition ratio of 1.3.

• 한국세라믹학회지
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• 제34권8호
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• pp.886-896
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• 1997

To investigate an effect of phase separation on precipitation characteristics of CuCl nanocrystals in CuCl doped nonlinear optical glasses, borosilicate glass systems with 9 different compositions with ~2wt% of CuCl were selected and CuCl doped glasses were prepared by melting and precipitation method. Microstructural properties of the CuCl doped glasses were analyzed by optical absorption spectroscopy, acid elution test, TEM, and EDXS. While phase separation did not occur in Glass A~D, interconnected and droplet microstructures due to phase separation were found in Glass E, F and Glass G~I, respectively. In the particular composition of the matrix glasses in this study, the precipitation of the CuCl particles was observed in the phase separable glasses, not in phase non-separable glasses. The CuCl particles were precipitated in both silica-rich phase region and boronrich phase region of the glass matrix. In the case of 7.7Na2O-36.6B2O3-52.7SiO2(mole%) glass, the larger CuCl particles than those in the silica-rich phase region were observed in the boron-rich phase region.

• Journal of Welding and Joining
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• 제12권1호
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• pp.80-93
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• 1994

The microstructure and fractography of the friction welded joint of Al to Cu have been investigated in order to understand the formation of intermetallic compounds and their effects on the failure in tensile test of the joint. The variation of welding pressure did not affect significantly the tensile strength of joint. However, the tensile strength of joint decreaed as welding time increased. The thickness of reaction layers of welded joints was several micro-meters and mainly composed of intermetallic compounds of $CuAl_2$, $Cu_9Al_4$ and Al+$CuAl_2$. The thickness of $CuAl_2$, $Cu_9Al_4$ was increased with welding time. However, $CuAl_2$ was gradually changed to $Cu_9Al_4$ which caused the decrease of tensile strength . Even though the morphology of fractured surfaces depended upon the welding time, the failure occurred along $CuAl_2$ intermetallic compound itself or between $CuAl_2$ and $Cu_9Al_4$ in most cases.

• 한국가금학회지
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• 제41권4호
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• pp.241-247
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• 2014

본 실험은 Cu-sulfate와 Cu-soy proteinate(Cu-SP)가 산란계의 생산성과 소장 내 미생물 균총에 미치는 영향에 대하여 조사하기 위해 실시하였다. 사양 시험은 35주령의 산란계(Hy-Line Brown) 1,000수를 선별하여 A형 2단 4열 케이지에 대조구 포함 총 5처리구로 구성하여 처리당 4반복, 반복당 50수씩(2수 수용 케이지 25개) 난괴법으로 임의 배치하였다. 시험 기간 동안 물과 사료는 자유 섭취하게 하였으며, 일반적인 점등관리(자연일조 + 조명; 16 hr)를 실시하였다. 시험구는 대조구, Cu-Sulfate 50(Cu-sulfate로 Cu 50 ppm), Cu-sulfate 100(Cu-sulfate로 Cu 100 ppm), Cu-SP 50(Cu-soy proteinate로 Cu 50 ppm), Cu-SP 100(Cu-soy proteinate로 Cu 100 ppm) 총 5처리였다. 일계 산란율(Hen-day egg production)은 구리 첨가구들이 대조구와 비교하여 유의적(P<0.05)으로 높았으나. 사료 섭취량은 처리 간에 유의적인 차이는 나타나지 않았다. 사료 요구량은 처리구 간에 유의적인 차이는 나타나지 않았지만, 구리 첨가구들이 낮은 경향(P=0.08)을 보여 주었으며, 연파란율은 처리구 간에 유의적인 차이는 나타나지 않았으나, 난각 강도는 구리 첨가구들이 대조구와 비교하여 유의적(P<0.05)으로 증가하였다. 간 내 Cu 함량은 Cu-sulfate 100과 Cu-SP 100 첨가구가 대조구와 Cu-sulfate 50과 Cu-SP 50 첨가구와 비교하여 유의적(P<0.01)으로 높았으며, Cl. perfringens는 구리 첨가구들이 대조구와 비교하여 유의적(P<0.01)으로 감소하였으나, 유익균인 Lactobacillus는 Cu-sulfate, Cu-SP 50 ppm 첨가구들이 대조구와 Cu-sulfate, Cu-SP 100 ppm 첨가구와 비교하여 유의적(P<0.05)으로 높았다. 결론적으로 Cu-sulfate와 Cu-SP는 산란계 산란율 개선에 있어서 비슷한 효과를 나타내었다.