• Journal of Welding and Joining
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• 제20권1호
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• pp.97-102
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• 2002

The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.

• 자원리싸이클링
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• 제23권1호
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• pp.64-69
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• 2014

코발트 정광으로부터 코발트와 구리의 회수를 위한 기초 연구로 Aspergillus균주를 사용하여 당밀 배지에서 Co, Cu, Fe, Mg, Al 등의 미생물 침출 거동을 조사하였다. 실험의 주요 변수로는 균주 종류 및 당밀의 당도, 고액농도(pulp density), 반응시간 등의 영향에 대해 고찰하였다. 실험결과 당밀의 농도가 증가할수록 코발트 및 구리의 침출율이 증가하는 경향을 보였으며 적정 당도는 4%이었다. 한편, Aspergillus niger KCTC 6985의 경우 당도 4%, 고액농도가 10 g/L인 조건에서 21일 경과 후 코발트는 최대 90 %, 구리의 경우는 최대 70%의 침출율을 나타내었고, Aspergillus niger KCTC 6144의 경우는 당도 4%, 고액농도가 5 g/L에서 코발트 및 구리가 각각 90%의 최대 침출율을 나타내었다.

• 대한방사성의약품학회지
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• 제1권1호
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• pp.23-30
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• 2015

Radioisotopes emitting low-range highly ionizing radiation such as ${\beta}$-particles are of increasing significance in internal radiotherapy. Among the ${\beta}$-particle emitting radioisotopes, $^{67}Cu$ is an attractive radioisotope for various nuclear medicine applications due to its medium energy ${\beta}$-particle, gamma emissions, and 61.83-hour half-life, which can also be used with $^{64}Cu$ for PET imaging. The production and application of the ${\beta}$-emitting radioisotope $^{67}Cu$ for therapeutic radiopharmaceutical are outlined, and different production routes are discussed. A survey of copper chelators used for antibody labeling is provided. It has been produced via proton, alpha, neutron, and gamma irradiations followed by solvent extraction, ion exchange, electrodeposition. Clinical studies using $^{67}Cu$-labelled antibodies in lymphoma, colon carcinoma and bladder cancer patients are reviewed. Widespread use of this isotope for clinical studies and preliminary treatments has been limited by unreliable supplies, cost, and difficulty in obtaining therapeutic quantities.

• 한국식품위생안전성학회지
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• 제37권5호
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• pp.323-327
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• 2022

국내산과 수입산 송이에 대한 다량 및 미량 미네랄 함량을 분석하여 원산지 판별 가능성을 비교하고자 하였다. 송이의 미네랄 함량은 원자흡광광도계 및 유도결합플라즈마 질량분석기를 이용하여 분석하였다. 국내산 송이의 Na, Mg, K 및 Ca 함량은 각각 128.12±85.25 mg/kg, 218.52±105.35 mg/kg, 7,534.58±2,691.52 mg/kg, 17.69±7.14 mg/kg으로 분석되었다. 중국 연길산 송이의 Na, Mg, K 및 Ca 함량은 각각 124.89±57.24 mg/kg, 64.07±27.52 mg/kg, 1,439.18±311.04 mg/kg, 10.88±4.52 mg/kg으로 분석되었다. 또한 중국 운남산 송이의 Na, Mg, K 및 Ca 함량은 각각 90.78±23.23 mg/kg, 77.40±28.36 mg/kg, 1,446.29±126.33 mg/kg, 28.42±5.18 mg/kg으로 분석되었고, 중국 티벳산 송이의 Na, Mg, K 및 Ca 함량은 각각 143.50±41.54 mg/kg, 124.64±50.18 mg/kg, 3,530.95±2,714.99 mg/kg, 21.05±8.71 mg/kg으로 분석되었다. 자생지역별 송이의 K, Mg 함량은 국내산 송이에서 높게 나타나 중국산 송이와 유의적 차이를 나타내었다. 국내산 송이의 Cr 및 Cu 함량은 각각 5.42±0.54 mg/kg, 105.43±32.97 mg/kg으로 분석되었으며, 중국 연길산 송이의 Cr 및 Cu 함량은 각각 5.08±1.17 mg/kg, 19.92±8.95 mg/kg으로 분석되었다. 또한 중국 운남산 송이의 Cr 및 Cu 함량은 각각 6.11±1.71 mg/kg, 54.51±16.91 mg/kg으로 분석되었고, 중국 티벳산 송이의 Cr 및 Cu 함량은 각각 6.00±0.44 mg/kg, 64.80±23.01 mg/kg으로 분석되었다. 국내산과 중국산 송이의 Cu 함량은 유의적인 차이를 나타내었다. 따라서 송이의 원산지 판별을 위해 향후 다수의 국내산 및 수입산 송이의 K, Mg 및 Cu 함량 비교분석이 필요한 것으로 판단되었다.

• 한국환경농학회지
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• 제12권2호
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• pp.105-111
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• 1993

경상북도 울진군 북면 덕구동과 칠곡군 동명면 덕명동에 소재한 2개 아연광산 인근 지역에서 채취한 토양과 야생식물체중의 Cd, Cu, Zn의 함량을 조사한 결과는 다음과 같다. 1. 생육기간에 따른 야생식물체중 중금속함량은 Cd는 다년생, 월년생, 1년생의 순위로, Cu는 1년생, 다년생, 월년생의 순위로 낮았으며, Zn은 다년생, 월년생, 1년생 모두 비슷하였다. 2. 중금속함량이 가장 높은 야생식물은 Cd의 경우 고비(다년생)였으며, Cu의 경우는 쇠뜨기(월년생), Zn의 경우는 고마리(1년생)이었지만, 조사된 식물체중 Cd, Cu, Zn 각 함량이 다 높았던 것은 고마리였다. 3. 야생식물의 과별 중금속함량은 Cd는 고사리과에서, Cu는 속새과에서, Zn는 마디풀과에서 가장 높았다. 4. 고마리와 망초의 식물체 부위별로 Cd 와 Zn의 함량은 잎, 줄기, 뿌리의 순위로 낮았는데 반하여, Cu는 뿌리, 잎, 줄기의 순위로 낮았다. 5. 토양중 Cd, Cu, Zn의 평균함량(범위)은 칠곡지역에선 1.27($0.45{\sim}2.75$)ppm, 12.04($3.00{\sim}33.20$)ppm, 64.28($8.14{\sim}209.79$)ppm 이었으며, 울진지역에선 3.30($0.50{\sim}9.52$)ppm, 72.93($47.75{\sim}118.35$)ppm, 194.04($41.37{\sim}520.96$)ppm이었다. 6. 토양중의 중금속(Cd, Cu, Zn 등) 함량과 식물체중 중금속 함량간에는 유의성은 없었으나, 정의 상관관계를 보였다. 7. 고비, 고마리, 쇠뜨기 등은 중금속(Cd, Cu, Zn)의 흡수력이 큰 야생식물로서 중금속 및 Zn 오염토양에서 중금속 제거에 효과가 클 것으로 사료된다.

• Journal of Nutrition and Health
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• 제29권5호
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• pp.528-532
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• 1996

The purpose of this study was to analyse copper intake and effect ofZn(30mg ZnSO4/d) supplementation on plasma copper level of Korean adults. Daily Cu intakes were studied in ninety subjects aging 20-20 years. Among them twenty four subjects participated in 6 weeks Zn supplementation study. The men consumed 1.47($\pm$0.64)mg of Cu and the women consumed 0.98($\pm$0.43)mg of Cu daily. the most abundant sources of Cu was meat, fish, egg and soybean group, the second was cereal and grain group and the third was vegetable group. These three groups supplied about 90% of copper in the subjects. The plasma copper level of the subjects was not changed much until two weeks of Zn supplementation. However, after two weeks of Zn supplementation plasma copper level was reduced continuously during the experiment. There was no significant difference in plasma Cu level between control and supplement group of the men, while the supplemented women showed significantly lower plasma Cu level than control group at week 4(p<0.01) and week 6(p<0.05). Although plasma Cu level of the subjects was slightly changed, its concentration in plasma was still in normal range in all groups and no one showed clinical Cu deficiency. Therefore the Zn supplementation of RDA level doesn't seem to cause any adverse effect on Cu status.

• Bulletin of the Korean Chemical Society
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• 제12권6호
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• pp.606-612
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• 1991

We have carried out an extended Huckel calculation to rationalize the role of $CuO_3$ chains and the size effect of the charged model clusters for the following charged model culsters : ${{Cu_6}{O_{21}}^{28-},\;{{Cu_6}{O_{22}}^{30-}\;,{{Cu_9}{O_{30}}^{39-}\;,{{Cu_9}{O_{32}}^{43-}\;,{{Cu_{12}{O_{38}}^{48-}\;,{{Cu_{15}{O_{50}}^{65-}\;,{{Cu_{18}{O_{54}}^{66-}\;,{{Cu_{18}{O_{55}}^{68-}\;,{{Cu_{24}{O_{70}}^{84-}\;and\;{{Cu_{27}{O_{78}}^{93-}$ for high-$T_c$ superconductor $YBa_2Cu_3O_7$: ${{Cu_6}{O_{18}}^{22-}\;,{{Cu_9}{O_{26}}^{31-}}\;,{{Cu_{12}{O_{32}}^{36-}\;,{{Cu_{15}{O_{42}}^{49-}\;,{{Cu_{18}{O_{46}}^{50-}\;,{{Cu_{24}{O_{60}}^{64-}\;and\;{{Cu_{27}{O_{66}}^{69-}$ for insulator $YBa_2Cu_3O_6$. The results show that the electronic structures and properties of the charged model clusters relating to high-$T_c$ superconductor are very sensitive to the size change of the clusters with various environmental effects, wherease those of the charged model clusters for insulator $YBa_2Cu_3O_6$ are monotonous to the size change. The $CuO_3$ chains along the b-direction may yield cooperative electronic coupling with the $CuO_2$ layers in determining both conducting and superconducting properties of $YBa_2Cu_3O_{7-x}$ system.

• Bulletin of the Korean Chemical Society
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• 제9권5호
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• pp.298-303
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• 1988

Kinetic studies on cupric ion ($Cu^{2+}$) oxidation of 1-benzyl- and 1-aryl-1,4-dihydronicotinamides (XNAH) in aqueous solution were performed. In the presence of dioxygen ($O_2$), the reaction followed first order kinetics with respect to both XNAH and $Cu^{2+}$. The oxidation reaction was found to be independent and parallel to the acid-catalyzed hydration reaction of XNAH. The catalytic role of $Cu^{2+}$ for the oxidation of XNAH in the presence of $O_2$ was attributed to $Cu^{2+}/Cu^+$ redox cycle by the reactions with XNAH and $O_2$. The second order rate constants of the Cu2+ oxidation reaction kCu, and acid-catalyzed hydration reaction $k_H$ were strongly dependent on the nature of the substituents in 1-aryl moiety. The slopes of log $k_{Cu}$ vs log $K_H$ and log $k_{Cu}$ vs ${\sigma}_p$ of the substituents plots were 1.64 and -2.2, respectively. This revealed the greater sensitivity of the oxidation reaction rate to the electron density on the ring nitrogen than the hydration reaction rate. A concerted two-electron transfer route involving XNAH-$Cu^{2+}$ complex was proposed for mechanism of the oxidation reaction.

• Journal of Animal Science and Technology
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• 제64권5호
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• pp.885-896
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• 2022

This experiment was conducted to investigate the effects of three different copper (Cu) sources (one inorganic and two organics) and levels (0, 50, and 100 mg/kg) on the growth performance, Cu digestibility, fecal mineral excretion, serum mineral concentration, jejunal morphology, and serum biochemical profile of growing pigs. A total of 42 male, growing pigs (31.08 ± 1.82 kg) were randomly assigned to seven treatments consisting of one negative control (0 mg/kg of added Cu level) and treatments with copper sulfate (CuSO4), Cu-amino acid complex (CuAA), and Cu-hydroxy-4-methylthio butanoate chelate complex (CuHMB) at 50 and 100 mg/kg each for 28 d. Pigs fed 50 or 100 mg/kg of Cu showed improved (p < 0.05) average daily gain and feed intake. Although Cu excretion decreased (p < 0.01) in pigs fed 100 mg/kg of organic Cu sources compared to those fed CuSO4, there was no difference between the Cu sources in pigs fed 50 mg/kg. However, the apparent total tract digestibility of Cu increased (p < 0.01) in pigs fed organic Cu sources compared with that in pigs fed CuSO4. The addition of CuHMB increased (p < 0.01) serum phosphorus and sulfur concentrations; however, there were no effects of source and level on jejunal morphology and serum biochemical profile. These results suggest that the inclusion (50 mg/kg) of organic Cu sources (CuAA and CuHMB) in the growing pig diet could be beneficial for growth performance and Cu availability and may reduce environmental pollution.

• 마이크로전자및패키징학회지
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• 제21권1호
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• pp.45-50
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• 2014

반도체 미세구리배선 적용을 위하여 구리배선의 습식 표면처리 및 열 사이클에 따른 구리 박막과 실리콘질화막 도포층 사이의 계면접착에너지를 4점굽힘시험을 통해 정량적으로 평가하였다. 구리배선을 화학적 기계적 연마한 후 습식 표면처리를 통하여 구리 박막과 실리콘질화막의 계면접착에너지는 $10.57J/m^2$에서 $14.87J/m^2$로 증가하였다. $-45{\sim}175^{\circ}C$범위에서 250사이클 후, 표면처리를 하지 않은 시편의 계면접착에너지는 $5.64J/m^2$으로, 표면처리를 한 시편은 $7.34J/m^2$으로 감소하였으며, 모든 시편의 박리계면은 구리 박막과 실리콘질화막 계면으로 확인되었다. X-선 광전자 분광법으로 계면 결합 상태를 분석한 결과, 화학적 기계적 연마 공정 후 구리배선의 표면 산화물이 습식표면처리에 의해 효과적으로 제거된 것을 확인하였다. 또한, 열 사이클 처리동안, 구리 박막과 실리콘질화막의 큰 열 팽창 계수 차이로 인한 열응력으로 인하여 구리 박막과 실리콘질화막 계면이 취약해지고, 계면을 통한 산소유입에 따른 구리 산화층이 증가하여 계면접착에너지가 저하된 것으로 판단된다.