• Transactions on Electrical and Electronic Materials
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• v.14 no.5
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• pp.246-249
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• 2013

Graphene was obtained on Cu foil by thermal decomposition method. A gas mixture of $H_2$ and $CH_4$ and an ambient annealing temperature of $1,000^{\circ}C$ were used during the deposition for 30 Min., and for the transfer onto $SiO_2/Si$ and Si substrates. The physical properties of graphene were investigated with regard to the effect ofnitrogen atom doping and the various substrates used. The G/2D ratio decreased when the graphene became monolayer graphene. The graphene grown on $SiO_2/Si$ substrate showed a low intensity of the G/2D ratio, because the polarity of the $SiO_2$ layer improved the quality of graphene. The intensity of the G/2D ratio of graphene doped with nitrogen atoms increased with the doping time. The quality of graphene depended on the concentration of the nitrogen doping and chemical properties of substrates. High-quality monolayer graphene was obtained with a low G/2D ratio. The increase in the intensity of the G/2D ratios corresponded to a blue shift in the 2D peaks.

• Progress in Superconductivity and Cryogenics
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• v.12 no.3
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• pp.7-11
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• 2010

For many large-scale applications of high-temperature superconducting materials, large critical current density($J_c$) in high applied magnetic fields are required. A number of methods have been reported to introduce artificial pinning centers(APCs) in $YBa_2Cu_3O_{7-\delta}$(YBCO) films for enhancement of their $J_c$. In this work, we investigated electric characteristic of YBCO films on $SrTiO_3$ (100) substrates whose surfaces were modified by the introduction of Au nanoparticles (AuNPs). Au nanoparticles were uniformly dispersed on STO substrates with one of typical solution techniques, self assembled monolayer. After heating the STO substrates with Au nanoparticles, the size of Au nanoparticles was around 29~32 nm in height and 41~49 nm in diameter. XRD diffraction patterns taken on the YBCO film with Au nanoparticles show the c-axis orientation. The measured $T_c$ of YBCO /AuNPs films was around 89K and the $J_c$ was 0.75 MA/$cm^2$ at 65 K and 1 T.

• Korean Journal of Materials Research
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• v.6 no.8
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• pp.817-824
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• 1996

Removal of Cu impurities on Si substrates using remote H-plasma was investigated. Si substrates were intentionally contaminated by 1ppm ${CuCI}_{2}$, standard chemical solution. To determine the optimal process condition, remote H-plasma cleaning was conducted varying the parameters of rf power, cleaning time and remoteness(the distance between the center of plasma and the surface of Si substrate). After remote H-plasma cleaning was conducted, Si surfaces were analysed by TXRF(total x-ray reflection fluorescence) and AFM(atomic force microscope). The concentration of Cu impurity was reduced by more than a factor of 10 and its RMS roughness was improved by more than 30% after remote H-plasma cleaning. TXRF analysis results show that remote H-plasma cleaning is effective in eliminating Cu impurity on Si surface when it is performed under the optimal process condition. AFM analysis results also verifies that remote H-plasma cleaning makes no damage to the Si surface. The deposition mechanism of Cu impurity may be explained by the redox potential(oxidation-reduction reaction potential) theory. Based on the XPS analysis results we could draw a conclusion that Cu impurities on the Si substrate are removed together with the oxide by a "lift-off" mechanism when the chemical oxide( which forms when Cu ions are adsorbed on the Si surface) is etched off by reactive hydrogen atoms.gen atoms.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.199-201
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• 2006

The wetting balance test was carried out to compare the wettability of Sn-Xwt%Cu($0{\sim}3$wt%) solders. And, IMCs which were formed at interface between solders and substrates were investigated by using XRD(x-ray diffractometer), SEM(scanning electron microscope) and EDS(energy dispersive spectroscope). The value of ${\gamma}_[fl}$ and(${\gamma}_{fs}-{\gamma}_{ls}$) had a tendency to increase with increasing wetting temperature. The activation energy that was calculated between the bare Cu substrate and flux was increased in the following order Sn-0.7wt%Cu(68.42 kJ/mol);Sn-3.0wt%Cu(72.66 kJ/mol);100wt%Sn solder(94.53 kJ/mol).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.8
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• pp.650-653
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• 2009

Hybrid nanofibers made of $Cu_2O$ and polyvinyl pyrrolidone were fabricated by electrospinning on glass substrates. The current magnitude of the $Cu_2O$-PVP hybrid nanofibers is 10 times larger than that of pure PVP nanofibers. In addition, $Cu_2O$-PVP nanofibers possess high sensitivity to air at room temperature than pure PVP nanifibers.

• Journal of the Speleological Society of Korea
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• no.76
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• pp.15-17
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• 2006

[ $YBa_2Cu_3O_{7-{\delta}}$ ] superconductor films have been prepared on silver substrates by electrophoretic deposition. As silver does not react with $YBa_2Cu_3O_{7-{\delta}}$ compound and has little influence on its superconductivity, it is usually doped in $YBa_2Cu_3O_7$ to improve the strength of the material and eliminate micro cracks. It has been proved that Ag additive can lower the melting temperature of $YBa_2Cu_3O_{7-{\delta}}$ and act as linking bridge among $YBa_2Cu_3O_{7-{\delta}}$ particles, thus in this paper Ag doped $YBa_2Cu_3O_{7-{\delta}}$ thick films are prepared by electrophoretic co deposition. As there are only some referenced experience formula and models for co electrophoretic deposition and does not exist unified explanation, the behavior of Ag particles during co electrophoretic deposition is also studied.

• Korean Journal of Materials Research
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• v.13 no.2
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• pp.133-136
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• 2003

Sn-2.5Cu alloy layers were deposited on the Alloy 42 lead-frame substrates by the electroplating method, and their microstructures, adhesion strength, and electrical resistivity were measured to evaluate the applicability of Sn-Cu alloy as a surface finishing material of electronic parts. The Sn-2.5Cu layers were electroplated in the granular form, and composed of pure Sn and Cu$_{6}$Sn$_{5}$ intermetallic compound. Surfaces of the electroplated Sn-2.5Cu layers were rather rough and also the thickness variance was large. The adhesion strength of the Sn-2.5Cu electroplated layers was highly comparable to that of the electroplated Cu alloy layer and the electrical conductivity was about 10 times higher than the pure Sn. After the 20$0^{\circ}C$ 30 min. annealing of the electroplated Sn-2.5Cu layers, the surface roughness was reduced, and adhesion strength and conductivity were improved. These results showed the Sn-Cu alloys can be used as an excellent surface finishing material.ial.

• Korean Journal of Materials Research
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• v.23 no.1
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• pp.1-6
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• 2013

A simple thermal oxidation of Cu thin films deposited on planar substrates established a growth of vertically aligned copper oxide (CuO) nanorods. DC sputter-deposited Cu thin films with various thicknesses were oxidized in environments of various oxygen partial pressures to control the kinetics of oxidation. This is a method to synthesize vertically aligned CuO nanorods in a relatively shorter time and at a lower cost than those of other methods such as the popular hydrothermal synthesis. Also, this is a method that does not require a catalyst to synthesize CuO nanorods. The grown CuO nanorods had diameters of ~100 nm and lengths of $1{\sim}25{\mu}m$. We examined the morphology of the synthesized CuO nanorods as a function of the thickness of the Cu films, the gas environment, the oxidation time, the oxidation temperature, the oxygen gas flow rate, etc. The parameters all influence the kinetics of the oxidation, and consequently, the volume expansion in the films. Patterned growth was also carried out to confirm the hypothesis of the CuO nanorod protrusion and growth mechanism. It was found that the compressive stress built up in the Cu film while oxygen molecules incorporated into the film drove CuO nanorods out of the film.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.217-217
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• 2003

초전도체 선재를 제작하기위해 YBa$_2$Cu$_3$$O_{7-x}$ (YBCO) 와 Ni substrates사이의 계면 문제를 해결하기 위한 buffer layer로써 CaRuO$_3$ (CRO) thu film이 제안되었는데, 이런 buffer layer의 조건으로는Ni metal과 YBCO superconductor사이의 화학적 반응이 없어야 하고 metal component가 YBCO로 diffusion되는 것을 막아주어야 하며 substrates의 산화를 막아주어야 한다. 이런 조건을 만족시키는 것 중에서 CRO thin film이 가장 적절하였지만, CRO의 orthorhombic구조의 distortion에 의만 lattice mismatch 문제가 발생하였다. 이러한 문제를 해결하기 위해 이론적인 구조 분석을 통한 CRO의superconductor buffer layer로써의 가능성을 검토해 보는 것이 목적이다.

• Journal of Adhesion and Interface
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• v.4 no.2
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• pp.10-20
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• 2003

This paper is relative to the electroless deposition of nickel or copper films on polyimide and polytetrafluoroethylene substrates. First, it is presented an original approach of the electroless process which consists in grafting nitrogenated functionalities on the polymer surfaces via plasma or VUV-assisted treatments operating in a nitrogen-based atmosphere ($NH_3$, $N_2$), and then in catalysing the grafted surfaces in an aqueous tin-free, Pd(+2)-based solution. Adhesion of the Pd(+2) catalytic species on polymer surfaces is explained by the formation of strong covalent bonds between these species and the grafted nitrogenated groups. Second, it is show how a fragmentation test performed in conjunction with electrical measurements can be used to characterize the practical adhesion of the electroless coatings deposited on flexible polymer substrates, and to evidence the influence of some experimental parameters (plasma treatment time and nature of the gas phase).