• Journal of Korea Foundry Society
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• v.28 no.1
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• pp.31-36
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• 2008

Ti-Ni-Cu alloys are very attractive shape memory alloys for applications as actuators because of a large transformation elongation and a small transformation hysteresis. Rapidly solidified Ti-Ni alloy ribbons have been known to have the shape memory effect and superelasticity superior to the alloy ingots fabricated by conventional casting. In this study, solidification structures and shape memory characteristics of $Ti-Ni_{30}-Cu_{20}$ alloy ribbons prepared by melt spinning were investigated by means of DSC and XRD. Operating parameters to fabricate the amorphous ribbons were the wheel velocity of 55 m/s and the melt spinning temperature of $1500^{\circ}C$. The crystallization temperature was measured to be $440^{\circ}C$. The crystallized ribbons exhibited very fine microstructure after annealing at $440^{\circ}C$ for 10 minutes and $460^{\circ}C$ for 5 minutes and was deformed up to about 6.8% and 6.23% in ductile manner, respectively. Stress-strain curve of the ribbon exhibited a flat stress-plateau at 64 MPa and this is associated with the stress-induced a B2-B19 martensitic transformation. During cycle deformation with the applied stress of 220 MPa, transformation hysteresis and elongation associated with the B2-B19 transformation were observed to be $4.3^{\circ}C$ and 3.6%.

• Journal of the Korean Society for Heat Treatment
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• v.4 no.3
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• pp.1-6
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• 1991

In this study, intermediate thermo-mechanical treated Al-2.0 wt%Li, and Al-2.0 wt%Li-1.2 wt%Cu-1.0 wt%Mg-0.12 wt%Zr alloys were tested in tension at $10^{\circ}C$ and elevated temperature(100, 200 and $300^{\circ}C$). The results are follows : The tensile strength of Al-Li-Cu-Mg-Zr alloy is the highest but the elongation of Al-Li alloy is the highest(106%) among the all alloys in tension at $300^{\circ}C$. The Portervin-LeChartlier effect is showed in AI-Li-Cu-Mg-Zr alloy at 10 and $100^{\circ}C$, because of tangled dislocation by Mg and Cu. In the true stress-strain curves of all alloy, the peaks of stress at $300^{\circ}C$ are showed at the strain less than 0.1. In the binary alloy, the dynamic restoration process at 200 and $300^{\circ}C$ is nearly similar to dynamic recovery type. The hot deformation stress is decreased with increase of dynamic recovery degree, but the elongation is increased. When the strain the strain rate are constant, the temperature dependence of hot deformation stress is increased with increase of deformation temperature. The elongation and degree of dynamic recovery are decreased with increase of hot deformation activation energy, but the deformation stresses slightly increased.

• Progress in Superconductivity and Cryogenics
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• v.20 no.4
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• pp.36-40
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• 2018

In this study, the electromechanical properties in Sn-Cu double layer stabilized GdBCO coated conductor (CC) tapes with and without external lamination under uniaxial tension were examined at 77 K and self-field. Their irreversible stress and strain limits were determined using a loading-unloading scheme based on different critical current ($I_c$) recovery criteria. The repeated tests were performed and statistical estimation was done to check the reproducibility depending on the criterion adopted in evaluating the electromechanical properties. From the results, it showed that the Sn-Cu double-layer stabilized CC tapes have the higher irreversible stress limit, but lower irreversible strain limit as compared to brass laminated ones. Through the repeated tests, it can be found that a small scattering of irreversible limits existed in both CC tape samples. Finally, similar strain sensitivity of $I_c$ in both CC tapes was obtained.

• Journal of the Korean Electrochemical Society
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• v.16 no.1
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• pp.19-29
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• 2013

Effects of current density, electrodeposition temperature and solution pH on properties of Cu thin films electrodeposited from pyrophosphate bath were investigated. Current efficiency was decreased with increasing current density and increased with increasing temperature. But solution pH slightly influenced on current efficiency and current efficiency was measured to be above 90% at both room temperature and $55^{\circ}C$. Residual stress of Cu thin film electrodeposited at room temperature was decreased with increasing current density, while current density reaches to 60 $mA/cm^2$ or more, stress became close to zero. Cu thin films electrodeposited at $55^{\circ}C$ exhibited the residual stress range of 0~40 MPa. At room temperature, dendritic surface morphology was observed above the current density of 30 $mA/cm^2$ and at $55^{\circ}C$, above the current density of 100 $mA/cm^2$. Cu thin films electrodeposited from bath solution with room temperature and $55^{\circ}C$ mainly consisted of (111) peaks. Specially, Cu thin film electrodeposited at 30 $mA/cm^2$ and $55^{\circ}C$ exhibited strong preferred orientation of (111) peaks.

• Journal of the Korean Electrochemical Society
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• v.18 no.1
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• pp.7-16
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• 2015

Effects of chemical composition ($Cu^{2+}$, $K_4P_2O_7$ and additive concentrations) of baths on properties of Cu thin films electrodeposited from pyrophosphate copper bath were investigated. Current efficiency was increased to be near 100% with increasing $Cu^{2+}$ concentrations from 0.02 to 0.3M. Decrease of current efficiency was observed in the range of 1.5~1.8M $K_4P_2O_7$ concentration, but current efficiency of about 100% was measured in the ranges of both 0.9~1.3M and 2.1~2.4M. The change of additive concentration did not influenced current efficiency. Residual stress of electrodeposited Cu thin films was measured to be about 20 MPa below 0.15 M $Cu^{2+}$ concentration and increased with the increase of it to 0.25 M. Maximum residual stress of 120MPa was observed at 0.25M $Cu^{2+}$ concentration. On the other hand, residual stress decreased from 80 to near 0 MPa as $K_4P_2O_7$ concentration varied from 0.9 to 2.4M and but The change of additive concentration did not affected on residual stress. $Cu^{2+}$ and $K_4P_2O_7$ concentrations significantly affect on surface morphology of electrodeposited Cu thin films, but additive concentration slightly affected. From XRD analysis, the microstructures of electrodeposited Cu thin film was affected from the changes of $Cu^{2+}$ and $K_4P_2O_7$ concentrations, but not from that of additive concentration. Strong preferred orientation of (111) peak was observed with increasing $Cu^{2+}$ and $K_4P_2O_7$ concentrations.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.3
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• pp.114-121
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• 2003

Through comparing stress state of TEOS and SiLK-embedded structures, the effect of low-k materials on stress and stress distribution in via-line structures were investigated using three-dimensional finite element analyses. In the case of TEOS-embedded via-line structures, hydrostatic stress was concentrated at the via and the top of the lines, where the void was suspected to nucleate. On the other hand, in the via-line structures integrated with SiLK, large von-Mises stress is maintained at the via, thus deformation of via is expected as the main failure mode. A good correlation between the calculated results and experimentally observed failure modes according to dielectric materials was obtained.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.1
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• pp.61-71
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• 1994

This study is to investigate the stress distributions, crystal orientations and magnetic properties during die-upsetting according to working temperature of Nd-Fe-B-Cu alloys. The stress distributions in the specimens during compressing process were calculated by a finite element method program(SPID). The calculated stresses were effective stress (${\sigma}_{eff}$), compression stress(${\sigma}_z$), radial direction stress(${\sigma}_r$) rotational direction stress(${\sigma}_e$) and shear stress(${\tau}_{rz}$). The stress distributions of ${\sigma}_z$, obtained by a computer simulation showed that the stress components causing the magnetic alignment during die-upsetting of the cast magnets were very high at the center-part of a specimen, and decreased toward the periphery-part of a specimen. In view of the above results the magnetic properties should be better at the center-part of a specimen than any other parts. But the measured magnetic properties were better at the mid-part. These results should be due to the fact that the specimens were casted. Normally the magnetic properties are affected by the casting process as well as by the stress levels. ${\sigma}_r$, ${\sigma}_e$ are thought to affect the liquid phase flowing and domain patterns, respectively. The influence of ${\tau}_{rz}$ was trivial, ${\sigma}_{eff}$ distributed similar throughout the specimen. The Nd-rich phase appeared at the peripheral of the specimen where the stress level of ${\sigma}_r$, ${\sigma}_z$, was low or the stress level of ${\sigma}_e$ was high. The Nd-rich phase was squeezed out during die-upsetting. This phase had an effect on the crystal orientation and grain growth. The stress distributions of alloy were irregular at the parts of the specimen where the die contacted with specimen.

• Journal of the Korean institute of surface engineering
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• v.53 no.4
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• pp.190-199
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• 2020

Copper pyrophosphate baths were employed in order to study the dependencies of current efficiency, residual stress, surface morphology and microstructure of electrodeposited Cu thin layers on applied current density. The current efficiency was obtained to be more than about 90 %, independent of the applied current density. Residual stress of Cu electrodeposits was measured to be in the range of -30 MPa and 25 MPa with the increase of applied current density from 0.5 to 15 mA/㎠. Relatively smooth surface morphologies of the electodeposited Cu layers were obtained at an intermediate current range between 3 and 4 mA/㎠. The Cu electrodeposits showed FCC(111), FCC(200), and FCC(220) peaks and any preferred orientation was not observed in this study. The average crystalline size of Cu thin layers was measured to be in the range of 44~69 nm.

• Journal of Welding and Joining
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• v.14 no.3
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• pp.48-57
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• 1996

A study was made to examine the characteristics of base metal and stress relief cracking(SRC) of heat affected zone(HAZ) for HY-100 and Cu-bearing HSLA-100 steels. The Gleeble thermal/mechanical simulator was used to simulate the SRC/HAZ. The details of mechanical properties of base plate and SRC tested specimens were studied by impact test, optical microscopy and scanning electron microscopy. The specimens were aged at $650^{\circ}C$ for HSLA-100 steel and at $660^{\circ}C$ for HY-100 steel and thermal cycled from $1350^{\circ}C$ to $25^{\circ}C$ with a cooling time of $\Delta$t_${800^{circ}C/500^{circ}C}$=21sec. corresponds to the heat input of 30kJ/cm. The thermal cycled specimens were stressed to a predetermined level of 248~600MPa and then reheated to the stress relief temperatures of $570~620^{\circ}C$. The time to failure$(t_f)$ at a given stress level was used as a measure of SRC susceptibility. The strength, elongation and impact toughness of base plate were greater in HSLA-100 steel than in HY-100 steel. The time to failure was decreased with increasing temperature and/or stress. HSLA-100 steel was more susceptible to stress relief cracking than HY-100 steel under same conditions. It is thought to be resulted from the precipitation of $\varepsilon$-Cu phase by dynamic self diffusion of solute atoms. By the precipitation of $\varepsilon$-Cu phase, the differential strengthening of grain interior relative to grain boundary may be greater in the Cu-bearing HSLA-100 steel than in HY-100 steel. Therefore, greater strain concentration at grain boundary of HSLA-100 steel results in the increased SRC susceptibility. The activation energies for SRC of HSLA-100 steel are 103.9kcal/mal for 387MPa and 87.6kcal/mol for 437MPa and that of HY-100 steel is 129.2kcal/mol for 437MPa.

• Korean Journal of Materials Research
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• v.16 no.4
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• pp.257-263
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• 2006

We have investigated the effect of silver added to Cu films on the microstructure evolution, resistivity, surface morphology, stress relaxation temperature, and adhesion properties of Cu(Ag) alloy thin films deposited on Mo glue layer upon annealing. In addition, pure Cu films deposited on Mo has been annealed and compared. The results show that the silver in Cu(Ag) thin films control the grain growth through the coarsening of its precipitates upon annealing at $300^{\circ}C{\sim}600^{\circ}C$ and the grain growth of Cu reveals the activation energy of 0.22 eV, approximately one third of activation energy for diffusion of Ag dopant along the grain boundaries in Cu matrix (0.75 eV). This indicates that the grain growth can be controlled by Ag diffusion along the grain boundaries. In addition, the grain growth can be a major contributor to the decreased resistivity of Cu(Ag) alloy thin films at the temperature of $300^{\circ}C{\sim}500^{\circ}C$, and decreases the resistivity of Cu(Ag) thin films to $1.96{\mu}{\Omega}-cm$ after annealing at $600^{\circ}C$. Furthermore, the addition of Ag increases the stress relaxation temperature of Cu(Ag) thin films, and thus leading to the enhanced resistance to the void formation, which starts at $300^{\circ}C$ in the pure Cu thin films. Moreover, Cu(Ag) thin films shows the increased adhesion properties, possibly resulting from the Ag segregating to the interface. Consequently, the Cu(Ag) thin films can be used as a metallization of advanced TFT-LCDs.