• 열처리공학회지
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• 제16권2호
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• pp.90-96
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• 2003

The effect of betatizing temperature on microstructure and transformation characteristics in a Cu-AI-Ni based pseudoelastic alloy fabricated by heated mold continuous casting by using metallography, XRD and calorimetry. The microstructure of cast rod betatized at $600^{\circ}C$ revealed a ${\beta}_1$ parent phase and a ${\gamma}_2$ phase precipitated along the casting direction. When the cast rod was betatized at the elevated temperature above $600^{\circ}C$, the ${\gamma}_2$ phase is completely dissolved into the matrix so that the volume fraction of the ${\gamma}_2$ phase was decreased. The parent phase was stabilized by betatizing at $600^{\circ}C$. However, the ${\beta}_1$ parent phase was transformed to both ${{\beta}_1}^{\prime}$ and ${{\gamma}_1}^{\prime}$ martensites with increasing betatizing temperatures above $600^{\circ}C$, while $M_s$ and $A_s$ temperatures were decreased. The stress-strain curves for compression test were not same with betatizing temperature; the stress-strain curves of the specimen betatized at $600^{\circ}C$ and $700^{\circ}C$ were linear but those of the specimen betatized at $800^{\circ}C$ and $900^{\circ}C$ were not linear.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권12호
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• pp.607-613
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• 2001

Molybdenum thin films were deposited on the soda lime glass(SLG) substrates by direct-current planar magnetron sputtering, with a sputtering power density of $4.44W/cm^2$. The working pressure was varied from 0.5 mtorr to 20 mtorr to gain a better understanding of the effect of sputtering pressure on the morphology and microstructure of the Mo film. Thin films of $CU(InGa)Se_2$ (CIGS) were deposited on the Mo-coated glass by three stage co-evaporation process. The highest efficiency device was obtained at the maximum value of the tensive stress. The morphology of Mo-coated films were examined by using scanning electron microscopy The film's microstructure, such as the preferred orientation, the full width at half-maximum(FWHM), and the residual intrinsic stress were examined by X-ray diffraction.

• 한국약용작물학회지
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• 제13권5호
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• pp.270-275
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• 2005

Superoxide dismutases (SOD) are metalloenzymes that convert $O_2^-\;to\;H_2O_2$. Rehmannia glutinosa is highly tolerant to paraquat-induced oxidative stress. The primary objective of this study was to characterize regulation of SOD gene expression in R. glutinosa in response to oxidative stresses and hormones. A full-length putative SOD clone (RgCu-ZnSOD1) was isolated from the leaf cDNA library of R. glutinosa using an expressed sequence tag clone as a probe. RgCu-ZnSOD1 cDNA is 777 bp in length and contains an open reading frame for a polypeptide consisted of 152 amino acid residues. The deduced amino acid sequence of the clone shows highest sequence similarity to the cytosolic Cu-ZnSODs. The two to three major bands with several minor ones on the Southern blots indicate that RgCu-ZnSOD1 is a member of a small multi-gene family. RgCuZnSOD1 mRNA was constitutively expressed in the leaf, flower and root. The expression of RgCu-ZnSOD1 mRNA was increased about 20% by wounding and paraquat, but decreased over 50% by ethylene and $GA_3$. This result indicates that the RgCu-ZnSOD1 expression is regulated differentially by different stresses and phytohormones at the transcription level. The RgCu-ZnSOD1 sequence and information on its regulation will be useful in investigating the role of SOD in the paraquat tolerance of R. glutinosa.

• 센서학회지
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• 제22권1호
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• pp.89-94
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• 2013

In this paper, we developed a beam of MEMS probe card using a BeCu sheet. Silicon wafer thickness of $400{\mu}m$ was fabricated by using deep reactive ion etching (RIE) process. After forming through silicon via (TSV), the silicon wafer was bonded with BeCu sheet by soldering process. We made BeCu beam stress-free owing to removing internal stress by using joule heating. BeCu beam was fused by using joule heating caused by high current. The fabricated BeCu beam measured length of 1.75 mm and width of 0.44 mm, and thickness of $15{\mu}m$. We measured fusing current as a function of the cutting planes. Maximum current was 5.98 A at cutting plane of $150{\mu}m^2$. The proposed low-cost and simple fabrication process is applicable for producing MEMS probe beam.

• 한국주조공학회지
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• 제29권5호
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• pp.187-191
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• 2009

Microstructures and shape memory characteristics of $Ti_{50}Ni_{20}Cu_{30}$ alloy strips fabricated by arc melt overflow have been investigated by means of XRD, optical microscopy and DSC. The microstructure of as-cast strips exhibited columnar grains normal to the strip surface. X-ray diffraction analysis showed that one-step martensitic transformation of B2-B19 occurred in the alloy strips. According to the DSC analysis, it was known that the martensitic transformation temperature ($M_s$) of B2 $\rightarrow$ B19 in $Ti_{50}Ni_{20}Cu_{30}$ strip is $57^{\circ}C$. During thermal cyclic deformation with the applied stress of 60 MPa, transformation hysteresis and elongation associated with the B2-B19 transformation were observed to be $3.7^{\circ}C$ and 1.6%, respectively. The as-cast strip of $Ti_{50}Ni_{20}Cu_{30}$ alloy also showed a superelasticity and its stress hysteresis was as small as 14 MPa. These mechanical properties and shape memory characteristics of the alloy strips were ascribed to B2-B19 transformation and the controlled microstructures produced by rapid solidification of the arc melt overflow process.

• 한국재료학회지
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• 제31권12호
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• pp.690-696
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• 2021

The purpose of this study is to develop a zirconium-based alloy with low modulus and magnetic susceptibility to prevent the stress-shielding effect and the generation of artifacts. Zr-7Cu-xSn (x = 1, 5, 10, 15 mass%) alloys are prepared by an arc melting process. Microstructure characterization is performed by microscopy and X-ray diffraction. Mechanical properties are evaluated using micro Vickers hardness and compression test. The magnetic susceptibility is evaluated using a SQUID-VSM. The average magnetic susceptibility value of the Zr-7Cu-xSn alloy is 1.176 × 10^-8 cm³g^-1. Corrosion tests of zirconium-based alloys are conducted through polarization test. The average Icorr value of the Zr-7Cu-xSn alloy is 0.1912 ㎂/cm². The elastic modulus value of 14 ~ 18 GPa of the zirconium-based alloy is very similar to the elastic modulus value of 15 ~ 30 GPa of the human bone. Consequently, the Sn added zirconium alloy, Zr-7Cu-xSn, is very interesting and attractive as a biomaterial that reduces the stress-shielding effect caused by differences of elastic modulus between human bone and metallic implants. In addition, this material has the potential to be used in metallic dental implants to effectively eliminate artifacts in MRI images due to low magnetic susceptibility.

• 한국분말재료학회지
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• 제6권4호
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• pp.270-276
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• 1999

Ti-Ni-Cu alloy powders were fabricated by ball milling, and the properties of these powders were characterized. Mixed 50Ti-(50-x)Ni-xCu powders of 5 to 10at.%Cu composition were milled for 100 hours using SUS 1/4" balls in argon atmosphere. Ball to powder ratio was 20:1 and rotating speed was 100 rpm. Tensile strength, microstructure and phase transformation of ball milled Ti-(50-x)Ni-xCu powders were studied. After 100 hours milling, Ti, Ni and Cu elements were alloyed completely and an amorphous phase was formed. Amorphous phase was crystallized to martensite(B 19') and austenite(B2) after heat treatment for 1 hour at $850^{\circ}C$. As the Cu contents were increased, tensile strength of extruded 6061Al/TiNiCu was decreased, and B19'martensite phases In the TiNi particles were the causes of high tensile stress of extruded 6061Al/TiNiCu.NiCu.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1996년도 추계학술강연 및 발표대회 강연 및 발표논문 초록집
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• pp.17-17
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• 1996

• 한국재료학회:학술대회논문집
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• 한국재료학회 1999년도 춘계학술발표강연 및 눈문개요집
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• pp.99-99
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• 1999

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.29-33
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• 2011

솔더와 PCB Cu 패드와 솔더 경계면에서 발생하는 수직응력과 수평응력을 분석하여 PGA 패키지의 신뢰성 향상을 위한 리드핀의 형상설계에 대한 연구를 수행하였다. 이와 같은 연구를 위해 리드핀의 $20^{\circ}$ 각도 굽힘 변형과 50 ${\mu}m$ 인장조건에서 4인자 3수준의 다구찌 최적설계와 유한요소해석을 수행하였다. 해석결과에 의하면 리드핀의 헤드곡면과 PCB Cu 패드가 접촉하는 폭(d2)이 솔더에서 발생하는 응력감소에 가장 큰 영향을 미치는 인자로 계산되었다. 또한, 다 구찌법의 파라메타 설계에 의해 기존 리드핀 형상모델에 비해 약 18.7%의 등가 von Mises 응력이 감소하는 형상을 도출하였다. 한편, 최대 수직응력이 발생하는 위치가 PCB의 Cu 패드와 솔더의 외곽이 접촉하는 위치이고 최대 수평응력이 발생하는 위치가 SR 층과 솔더의 외곽표면이 접촉하는 위치임을 파악하여, PGA 패키지의 박리 불량은 솔더의 외곽부터 발생하여 내부로 진행될 것으로 예측되었다.