• 한국재료학회지
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• 제22권10호
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• pp.526-530
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• 2012

Silica-based ceramic-matrix composites have shown promise as advanced materials for many applications such as chemical catalysts, ceramics, pharmaceuticals, and electronics. $SiO_2$-CuO-$CeO_2$ multi-component powders and their thin film, using an oxalic acid template as a chelating agent, have larger surface areas and more uniform pore size distribution than those of inorganic acid catalysts. $SiO_2$-CuO-$CeO_2$ composite powders were synthesized using tetraethylorthosilicate, copper (II) nitrate hemi (pentahydrate), and cerium (III) nitrate hexahydrate with oxalic acid as template or pore-forming agent. The process of thermal evolution, the phase composition, and the surface morphology of these powders were monitored by thermogravimetry-differential thermal analysis (TG-DTA), X-ray diffractometry (XRD), field-emission scanning electron microscopy (FE-SEM), and energy dispersive X-ray spectrometry (EDXS). The mesoporous property of the powders was observed by Brunner-Emmett-Teller surface (BET) analysis. The improved surface area of this powder template with oxalic acid was $371.4m^2/g$. This multi-component thin film on stainless-steel was prepared by sol-gel dip coating with no cracks.

• 한국분말재료학회지
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• 제26권2호
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• pp.112-118
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• 2019

Infiltration is a popular technique used to produce valve seat rings and guides to create dense parts. In order to develop valve seat material with a good thermal conductivity and thermal expansion coefficient, Cu-infiltrated properties of sintered Fe-Co-M(M=Mo,Cr) alloy systems are studied. It is shown that the copper network that forms inside the steel alloy skeleton during infiltration enhances the thermal conductivity and thermal expansion coefficient of the steel alloy composite. The hard phase of the CoMoCr and the network precipitated FeCrC phase are distributed homogeneously as the infiltrated Cu phase increases. The increase in hardness of the alloy composite due to the increase of the Co, Ni, Cr, and Cu contents in Fe matrix by the infiltrated Cu amount increases. Using infiltration, the thermal conductivity and thermal expansion coefficient were increased to 29.5 W/mK and $15.9um/m^{\circ}C$, respectively, for tempered alloy composite.

• 한국기계기술학회지
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• 제20권6호
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• pp.818-823
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• 2018

In this study, the effect of pre-aging treatment for inhibition of natural aging of Al-4.8Zn-1.3Mg alloy by extrusion process was investigated. Firstly, the as-cast microstructure of Al-4.8Zn-1.3Mg alloy billet and its evolution during homogenization($460^{\circ}C$, $4h+510^{\circ}C$, 5h) were investigated by means of optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), hardness analysis. The as-cast microstructures of Al-4.8Zn-1.3Mg alloy reveal $Mg_2Zn$, $Al_5Cu$, $Al_{13}Cu$ formed between dendrities. After homogenization, MgZn, $Al_4Cu$, $Al_{13}Cu$ phases precipitated into the matrix. In addition, standard deviation of homogenized billet was improved than as-cast billet from 2.62 to 0.99. According to pre-aging($100^{\circ}C$, 1h) Al-4.8Zn-1.3Mg alloy by extrusion process, yield strength and tensile strength deviation improved more than condition by natural aging.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

• Journal of Microbiology and Biotechnology
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• 제26권12호
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• pp.2116-2126
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• 2016

Bacterial biofilms are spatially structured communities that contain bacterial cells with a wide range of physiological states. The spatial distribution and speciation of copper in unsaturated Pseudomonas putida CZ1 biofilms that accumulated 147.0 mg copper per g dry weight were determined by transmission electron microscopy coupled with energy dispersive X-ray analysis, and micro-X-ray fluorescence microscopy coupled with micro-X-ray absorption near edge structure (micro-XANES) analysis. It was found that copper was mainly precipitated in a $75{\mu}m$ thick layer as copper phosphate in the middle of the biofilm, while there were two living cell layers in the air-biofilm and biofilm-medium interfaces, respectively, distinguished from the copper precipitation layer by two interfaces. The X-ray absorption fine structure analysis of biofilm revealed that species resembling $Cu_3(PO_4)_2$ predominated in biofilm, followed by Cu-Citrate- and Cu-Glutathione-like species. Further analysis by micro-XANES revealed that 94.4% of copper were $Cu_3(PO_4)_2$-like species in the layer next to the air interface, whereas the copper species of the layer next to the medium interface were composed by 75.4% $Cu_3(PO_4)_2$, 10.9% Cu-Citrate-like species, and 11.2% Cu-Glutathione-like species. Thereby, it was suggested that copper was initially acquired by cells in the biofilm-air interface as a citrate complex, and then transported out and bound by out membranes of cells, released from the copper-bound membranes, and finally precipitated with phosphate in the extracellular matrix of the biofilm. These results revealed a clear spatial pattern of copper precipitation in unsaturated biofilm, which was responsible for the high copper tolerance and accumulation of the biofilm.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.66-66
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• 2009

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites(diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature 940 $^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.73-73
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• 2011

We will report a few methods to improve the efficiency and stability in small molecule based organic solar cells, including the formation of bulk heterojunctions (BHJs) through alternative thermal deposition (ATD), the use of a micro-cavity structure and interface modifications. By ATD which is a simple modification of conventional thermal evaporation, the thicknesses of alternative donor and acceptor layers were precisely controlled down to 0.1 nm, which is critical to form BHJs. The formation of a BHJ in copper(II) phthalocyanine (CuPc) and fullerene (C60) systems was confirmed by AFM, GISAXS and absorption measurements. From analysis of the data, we found that the CuPc|C60 films fabricated by ATD were composed of the nanometer sized disk shaped CuPc nano grains and aggregated C60, which explains the phase separation of CuPc and C60. On the other hand, the co-deposited CuPc:C60 films did not show the existence of separated CuPc nano grains in the CuPc:C60 matrix. The OPV cells fabricated using the ATD method showed significantly enhanced power conversion efficiency compared to the co-deposited OPV cells under a same composition [1]. We will also present by numerical simulation that adoption of microcavity structure in the planar heterojunction can improve the short circuit current in single and tandem OSCs [2]. Interface modifications also allowed us to achieve high efficiency and high stability OSCs.

• Journal of Welding and Joining
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• 제15권6호
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• pp.96-104
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• 1997

The present study was aimed to correlate the microstructure and the hardness as well as the wear resistance of the metal-ceramic particulated composite layer on the pure Al plate. The composite layers were constructed by the addition of TiC particles on the surface of Al-Cu alloyed layers by PTA overlaying process. Initially, the Al-Cu alloyed layers were achieved by the deposition of Al-(25 ~ 48%) Cu alloys on the pure Al plate by TIG process. It was revealed that TiC particles were uniformly dispersed without any reaction with matrix in the composite layer. The volume fraction of TiC particles (TiC V F) increased from 12% to 55% with increasing the number of pass of composite layer. Hardnesses of (Al-48%Cu + TiC (3&4layers)) composite layer were Hv450 and Hv560, respectively, due to the increase of TiC V/F. Hardnesses of (Al-Cu + TiC) composite layers decreased gradually with insreasing temperature from 100$^{\circ}$C to 400$^{\circ}$C, and hardnesses at 400$^{\circ}$C were then reached to 1/5 - 1/10 of room temperature hardness depending on the construction of composite layers. The Specific wear of (Al + Tic) layer and Al-48%Cu alloyed layer decreased to 1/10 of the of pure Al, while the specific wear of (Al-48%Cu + TiC (4 layers)) composite layer exhibited 1/15 of that of steel such as SS400 and STS304.

• Journal of Welding and Joining
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• 제29권4호
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• pp.85-92
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• 2011

Microstructures and tensile properties in arc brazed joints of ferritic stainless steel, 429EM using Cu-8.6%Al insert metal was investigated as function of brazing current. The brazing speed was fixed at 800mm/min and brazing current varied in the range of 80A to 120A. The initial phase of filler metal was Cu single phase. However, the insert metal structures of brazed joints was composed of Cu matrix and intermetallic compound such as ${\gamma}_1(Al_4Cu_9)$, and flower-shape Fe-Cr. The fraction of ${\gamma}_1(Al_4Cu_9)$ phase was similar with 80A and 100A brazing currents while that of brazed with 120A was decreased. On the other hand, the fraction of Fe-Cr phase increased with increasing of the brazing current. A reaction layer at the base metal/insert metal interface was observed and this reaction layer was thickened with increasing of the brazing current. In the brazed joints with the current lower than 100A, crack was grew up along the interface which was perpendicular to the tensile stress, and then, passed through the insert metal in the final stage of fracture. As the brazing current increased to 120A, fracture occurred at the base metal.

• Journal of Welding and Joining
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• 제28권3호
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• pp.49-58
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• 2010

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites (diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature $940^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.