• Journal of the Korean Electrochemical Society
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• v.5 no.3
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• pp.125-130
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• 2002

An attempt was made for the application of porous reticular metal to a heat dissipation material in semiconductor process. For this aim, the electrodeposition of Fe/Ni alloy on the porous reticular Cu has been performed to minimize the thermal expansion mismatch between Cu skeleton and electronic chip. Preliminary tests for the electrodeposition of Fe/Ni alloy layer were conducted by using standard Hull Cell to examine the effect of current density on the composition of alloy layer. It seemed that mass transfer affected significantly the composition of Fe/Ni layer due to anomalous codeposition in the electrodeposition of Fe/Ni alloy. A paddle type stirring bath, which was employed to control the mass transfer of electrolyte in the work, was found to allow the electrodeposition Fe/Ni with a precise composition. result showed that the thermal expansion of Fe/Ni alloy layer was much lower than that of pure copper. From the tests of heat dissipation by using the apparatus designed in the work the heat dissipation material fabricated in the work showed the excellent heat dissipation capacity, namely, more than two times as compared to that of pure copper plate.

• Journal of Surface Science and Engineering
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• v.27 no.4
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• pp.223-233
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• 1994

It is well known that compositionally modulated Cu-Ni alloy can be produced by an electrochemical method in Ni sulfate solution containing trace amount of Cu. a mathematical model is presented to describe the current distribution and weight percent of Cu in Ni layer on the rotating disk electrode. The model includes convective-diffusion equation, the Laplace's equation and various overpotentials, and is solved numerically. The thickness of Cu layer is almost uniform whereas the thickness of Ni layer as well as the Ni/Cu weight ratio are increased approaching to the edge of the disk. These results agree well with the experimental values. The ohmic potential drop is suggested as a major cause of a nonuniformity in Ni layer. The optimum plating condition for the fabrication of susperlattice is proposed based on the results of this study.

• Journal of the Korean Magnetics Society
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• v.27 no.4
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• pp.135-139
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• 2017

The magneto-impedance effect (MI effect) has been investigated in metal core/soft magnetic shell composite wires fabricated by electrodeposition of $Ni_{80}Fe_{20}$ on Cu wire (diameter $190{\mu}m$). The diagonal impedances $Z_{zz}$ and $Z_{{\theta}{\theta}}$ in cylindrical coordinate showed strong MI effect for the magnetic field applied along z-axis, while the off-diagonal impedance $Z_{{\theta}z}$ showed very weak MI effect. We have tried to develop the Cu $core/Ni_{80}Fe_{20}$ shell composite wire having strong MI effect in off-diagonal impedance by electrodeposion under torsional strain. The core/shell composite wire electrodeposited under torsional angles above $270^{\circ}$ showed significantly enhanced MI effect in the off-diagonal impedance. The maximum MI effect was observed in the composite wire electrodeposited under torsional angle of $360^{\circ}$. The developed method to enhance off-diagonal MI effect is expected to increase the applicability of the core/shell composite wire to magnetic sensor material.

• Applied Chemistry for Engineering
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• v.8 no.4
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• pp.645-652
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• 1997

Electrochemical characteristics and kinetic parameters of copper ion reduction were investigated with a platinum rotating disk electrode (RDE) in a diffusion controlled region. Reduction of Cu(II) in sulfate had one-step two-xelectron process, while the reduction of Cu(II) in chloride solution was involved two one-electron processes. The transfer coefficient of Cu(II) in sulfate solution was lowest, and the transfer coefficient of Cu(I) in halide solutions had the value of nearly one. In chloride solutions, electrodeposition rate of Cu(II) was about one hundred times faster than Cu(I). Diffusion coefficient increased in the order of Cu(II) in chloride solution, Cu(I) in the iodide, bromide, chloride solution, Cu(II) in sulfate solution. The calculated ionic radii and activation energy for diffusion decreased in the same order as above. Morphological study on the copper electrodeposition indicated that the electrode surface became rougher as both concentration and reduction potential increases, and the roughness of the surface was analyzed with UV/VIS spectrophotometer.

• Journal of Magnetics
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• v.10 no.3
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• pp.118-121
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• 2005

We have investigated the magnetic properties of electroplated thin Cu/Co multilayers by using electrolytes made of copper sulphate and cobalt sulphate and by applying alternating plating voltage. While the multilayers plated with pure electrolyte showed superparamagnetism, those plated with organic additives showed ferromagnetic behavior. These changes are attributed to the so-called 'self-annealing' effect and reduction of grain size caused by the organic additives.

• Journal of Powder Materials
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• v.19 no.5
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• pp.367-372
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• 2012

Single crystalline Cu nanowires with controlled diameters and aspect ratios have been synthesized using electrochemical deposition within confined nanochannels of a porous anodic aluminium oxide(AAO) template. The diameters of nano-sized cylindrical pores in AAO template were adjusted by controlling the anodization conditions. Cu nanowires with diameters of approximately 38, 99, 274 nm were synthesized by the electrodeposition using the AAO templates. The crystal structure, morphology and microstructure of the Cu nanowires were systematically investigated using XRD, FE-SEM, TEM and SAED. Investigation results revealed that the Cu nanowires had the controlled diameter, high aspect ratio and single crystalline nature.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.107-107
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• 2014

p형 자원 친화형 산화물 기반 능동형 층 성장에 대한 연구는 아직 개발 초기 단계이다. $Cu_2O$는 이러한 자원 친화형 저가 p형 산화물 중 하나로서 다양한 광학 응용분야에 있어 적용되고 있으며 특히 저가형 증착법인 전기증착법을 통해 형성시킨다면 가격 절감을 극대화 시킬 수 있다. 하지만 낮은 전도성으로 인해 전자소자에는 적용시키기 어렵다는 단점이 있기 때문에 본 연구팀은 5족 물질인 Antimony 를 $Cu_2O$의 p형 도펀트로 적용시켜 전기적 구조적 특성을 개선시키고자 하였다. 결과적으로 [111] 방향으로 높은 우선배향성을 갖고 전도성이 향상된 Sb-Cu2O 박막을 확인하였다.

• Journal of Surface Science and Engineering
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• v.42 no.4
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• pp.145-151
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• 2009

Nanocrystalline Cu thin films for FCCL were electrodeposited from sulfate baths to investigate systematically the influences of current density, solution pH on current efficiency, residual stress, surface morphology, and microstructure of thin Cu films. Current efficiencies were measured to be approximately 100%, irrespective of the applied current density and solution pH. But these influenced residual stress, surface morphology, XRD pattern, and grain size of electrodeposited Cu thin film. The residual stress decreased with decreasing the surface roughness, but increased with increasing the fcc(111) peak strength of XRD patterns.

• Proceedings of the Membrane Society of Korea Conference
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• 1999.07a
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• pp.111-113
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• 1999

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.10a
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• pp.54-54
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• 2006