[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.4283/JMAG.2005.10.3.118

Magnetic Properties of Thin Cu/Co Multilayers Made by Electrodeposition

Lee, Jung-Ju (Department of Physics, Chungnam National University)
Lee, Jin-Han (Department of Physics, Chungnam National University)
Hong, Kim-In (Department of Physics, Chungnam National University)

Publication Information

Journal of Magnetics / v.10, no.3, 2005 , pp. 118-121 More about this Journal

Abstract

We have investigated the magnetic properties of electroplated thin Cu/Co multilayers by using electrolytes made of copper sulphate and cobalt sulphate and by applying alternating plating voltage. While the multilayers plated with pure electrolyte showed superparamagnetism, those plated with organic additives showed ferromagnetic behavior. These changes are attributed to the so-called 'self-annealing' effect and reduction of grain size caused by the organic additives.

Keywords

Copper; Cobalt; Electroplating; Multilayer; Organic additive;

Citations & Related Records

Reference

1	L. Piraux, J. M. George, J. F. Desperes, C. Leroy, E. Ferain, R. Legras, K. Ounadjela, and A. Fert, Appl. Phys. Lett. 65, 2484 (1994)
2	A. Blondel, J. P. Meier, B. Doudin, and J.-Ph. Ansermet, Appl. Phys. Lett. 65, 3019 (1994)
3	K. Liu, K. Nagodawithana, P. C. Searson, and C. L. Chien, Phys. Rev. B. 51, 7381 (1995)
4	Kimin Hong, Jin-Kyu Kim, Seung-Kwon Lee, Sanghun Park, Byunggyu Gyun, Young-Dong Ko, Narn-Jin Jeon, and Jin-Seok Chung, Phys. Stat. Sol. (b) 241, 1681 (2004)
5	G. B. McFadden, S. R. Coriell, T. P. Moffat, D. Josell, D. Wheeler, W. Schwarzacher, and J. Mallett, J. Electrochem. Soc. 150, C591 (2003) DOI
6	Cao, P. Taephaisitphongse, R. Chalupa, and A. West, J Electrochern. Soc. 148, C466 (2001)
7	J. Reid and S. Mayer, Proc. Adv. Metallization Conf., 53 (2000)
8	T. Moffat, J. Bonevich, W. Huber, A. Stanishevsky, D. Kelly, G. Stafford, and D. Josell, J. Electrochern. Soc. 147, 4524 (2000)
9	J. Reid, S. Mayer, E. Broadbent, E. Klawuhn, and K. Ashtiani, Solid State Tech. 43, 86 (2000)
10	M. J. Besnus, A. J. P. Meyer, and R. Berninger, Phys. Lett. 32A, 192 (1970)
11	Nguyen Anh Tuan, Nguyen Hoang Luong, Nguyen Chau, Vuong Van Hiep, and Nguyen Minh Ha, Physica B 327, 400 (2003)
12	W. H. The, L. T. Koh, S. M. Chen, J. Xie, C. Y. Li, and P. D. Foo, Microelectronics Journal 32, 579 (2001) and references therein DOI ScienceOn
13	Jungju Lee, MS Thesis, Chungnam National University (2005)
14	G. B. McFadden, S. R. Coriell, T. P. Moffat, D. Josell, D. Wheeler, W. Schwarzacher, and J. Mallett, J. Electrochem. Soc. 150, C59l (2003) DOI
15	A. J. Bard and L. R. Faulkner, Electrochemical Methods, Fundamentals and Applications, Wiley, New York (2001)
16	P. Bratin, New Developments in the Use of Cyclic Voltammetric Stripping for Alaysis of Plating Solutions, Proceedings of AES Analytical Method Symposium, Chicargo, IL (1985)
17	Jungju Lee, Jinhan Lee, and Kimin Hong, To be published