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http://dx.doi.org/10.5695/JKISE.2009.42.4.145

Effect of Current Density and Solution pH on Properties of Electrodeposited Cu Thin Films from Sulfate Baths for FCCL Applications  

Shin, Dong-Yul (Division of Advanced Materials Engineering, Hanbat National University)
Park, Doek-Yong (Division of Advanced Materials Engineering, Hanbat National University)
Koo, Bon-Keup (Division of Advanced Materials Engineering, Hanbat National University)
Publication Information
Journal of the Korean institute of surface engineering / v.42, no.4, 2009 , pp. 145-151 More about this Journal
Abstract
Nanocrystalline Cu thin films for FCCL were electrodeposited from sulfate baths to investigate systematically the influences of current density, solution pH on current efficiency, residual stress, surface morphology, and microstructure of thin Cu films. Current efficiencies were measured to be approximately 100%, irrespective of the applied current density and solution pH. But these influenced residual stress, surface morphology, XRD pattern, and grain size of electrodeposited Cu thin film. The residual stress decreased with decreasing the surface roughness, but increased with increasing the fcc(111) peak strength of XRD patterns.
Keywords
FCCL; Electrodeposition; Current density; pH; Sulfate bath; Residual stress;
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