한국표면공학회지 (Journal of the Korean institute of surface engineering)

  • 제42권4호
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  • Pages.145-151
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  • 2009
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  • 1225-8024(pISSN)
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  • 2288-8403(eISSN)
한국표면공학회 (The Korean Institute of Surface Engineering)
권호 표지
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Sulfate 용액을 이용하여 전기도금 한 FCCL용 Cu 필름의 특성에 미치는 전류밀도와 pH의 영향

Effect of Current Density and Solution pH on Properties of Electrodeposited Cu Thin Films from Sulfate Baths for FCCL Applications

  • 신동율 (한밭대학교 신소재공학부) ;
  • 박덕용 (한밭대학교 신소재공학부) ;
  • 구본급 (한밭대학교 신소재공학부)
  • Shin, Dong-Yul (Division of Advanced Materials Engineering, Hanbat National University) ;
  • Park, Doek-Yong (Division of Advanced Materials Engineering, Hanbat National University) ;
  • Koo, Bon-Keup (Division of Advanced Materials Engineering, Hanbat National University)
  • 발행 : 2009.08.31
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초록

Nanocrystalline Cu thin films for FCCL were electrodeposited from sulfate baths to investigate systematically the influences of current density, solution pH on current efficiency, residual stress, surface morphology, and microstructure of thin Cu films. Current efficiencies were measured to be approximately 100%, irrespective of the applied current density and solution pH. But these influenced residual stress, surface morphology, XRD pattern, and grain size of electrodeposited Cu thin film. The residual stress decreased with decreasing the surface roughness, but increased with increasing the fcc(111) peak strength of XRD patterns.

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피인용 문헌

  1. Effect of Deposition Conditions on Properties of Cu Thin Films Electrodeposited from Pyrophosphate Baths vol.16, pp.1, 2013, https://doi.org/10.5229/JKES.2013.16.1.19
  2. The effect of additives and current density on mechanical properties of cathode metal for secondary battery vol.9, pp.4, 2013, https://doi.org/10.1007/s13391-013-0039-8
  3. Effect of additives on the elongation and surface properties of copper foils vol.9, pp.3, 2013, https://doi.org/10.1007/s13391-012-2125-8
  4. Main Effects of Plating Parameters on Mechanical and Surface Properties of Electroplated Copper vol.56, pp.6, 2018, https://doi.org/10.3365/KJMM.2018.56.6.459