• Title/Summary/Keyword: Cu dispersion

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The Processing control of NiCuZn Ferrite (I) - Mixing and Size Reduction of Raw Materials by Wet Ball Milling. (NiCuZn Ferrite의 제조공정 제어 (제1보) - 습식 볼밀링에 의한 다성분 원료의 혼합 및 분쇄 공정의 고찰)

  • 류병환;김선희;최경숙;고재천
    • Journal of the Korean Magnetics Society
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    • v.5 no.6
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    • pp.928-936
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    • 1995
  • In this research, the processing control of NiCuZn Ferrite has been developed. The mixing and the size reduction of raw materials have been proceeded. In order to produce NiCuZn Ferrite, highly concentrated slurry with fixed ratio and wet ball milling were used. First, the dispersion behavior of raw mixture at the region of pH4~pH11 has been studied. Using wet ball milling operation, the best conditions of mixing and size reduction have been determined. Further more, the most suitable conditions, such as, dispersant kind, dispersant amount, milling time, and slurry concentration have been studied. The poly acrylic ammonium salt (PAN) was chosen as a suitable dispersant to have effective dispersion in basic region. The slurry of raw mixture without dispersant, showed high viscosity and poor grindability. As 0.7 wt% of PAN was added, the concentrated slurry (up to 55 vol%) was possible, and showed well grindability. After 18 h ball milling of 30 vol% of mixture slurry with 0.7 wt% of PAN, the average particle size and specific surface area of raw mixture were $0.54\mu\textrm{m}$ and $12.92m^{2}/cc$, respectively. The ball milled raw mixture, calcined at $700^{\circ}C$ for 3h, was totally changed into NiCuZn Ferrite with spinel phase.

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Fabrication of Porous Polytetrafluoroethylene thin Film from Powder Dispersion-solution for Energy Nanogenerator Applications (Polytetrafluoroethylene 분말 현탁액을 통한 다공성 박막 제조 및 에너지 발생소자 응용)

  • Park, Il-Kyu
    • Journal of Powder Materials
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    • v.24 no.2
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    • pp.102-107
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    • 2017
  • Porous polytetrafluoroethylene (PTFE) thin films are fabricated by spin-coating using a dispersion solution containing PTFE powders, and their crystalline properties are investigated after thermal annealing at various temperatures ranging from 300 to $500^{\circ}C$. Before thermal annealing, the film is densely packed and consists of many granular particles 200-300 nm in diameter. However, after thermal annealing, the film contains many voids and fibrous grains on the surface. In addition, the film thickness decreases after thermal annealing owing to evaporation of the surfactant, binder, and solvent composing the PTFE dispersion solution. The film thickness is systematically controlled from 2 to $6.5{\mu}m$ by decreasing the spin speed from 1,500 to 500 rpm. A triboelectric nanogenerator is fabricated by spin-coating PTFE thin films onto polished Cu foils, where they act as an active layer to convert mechanical energy to electrical energy. A triboelectric nanogenerator consisting of a PTFE layer and Al metal foil pair shows typical output characteristics, exhibiting positive and negative peaks during applied strain and relief cycles due to charging and discharging of electrical charge carriers. Further, the voltage and current outputs increase with increasing strain cycle owing to accumulation of electrical charge carriers during charge-discharge.

Synthesis and disperse treatment of Cu powder from $Cu(OH)_2$ slurry by wet reduction methods (액상환원법에 의한 $Cu(OH)_2$ 슬러리로부터 미세구리분말 제조 및 분산화 처리)

  • Ahn Jong-Gwan;Hai Hoang Tri;Kim Dong-Jin;Kim Byeong-Gyu
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2005.11a
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    • pp.87-88
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    • 2005
  • Ultra-fine copper powders with particle size about 150 nm were synthesized from copper hydroxide slurry by wet method using hydrazine as reduction agent and several sur factants at below $80^{\circ}C$. The particle size distribution and dispersion of synthesized powders as function of temperature, feeding rate of reduction and especially, sur factants were character ized by XRD, BET, PSA and SEM by this process.

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Surface Modification of Ag Coated Cu Conductive Metal Powder for Conductive Silicone Sealant Gasket Paste

  • Park, Seong-Yong;Yoon, Tae-Won;Lee, Chung-Ho;Jeong, In-Bum;Hyun, Sang-Hoon
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.1076-1077
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    • 2006
  • Conductive pastes consist of conductive fillers( Au, Ag, Ni, Cu etc.), organic binders, solvents and additives. Meanwhile, there are some metal powders such as copper, nickel etc that are used for pastes which have serious surface corrosion problems. This problem leads to change of the color and decrease in conductivity and affect storage stability of conductive pastes. By using silane coupling agent and dispersion agent, we can ensure both the corrosion stability and long term storage stability, and enhance the high performance electrical and mechanical properties of EMI shielding silicone sealant.

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Effects of Cu and Mg on Wear Properties of SiC Particulate Reinforced Al-Si Metal Matrix Composites (SiC 입자강화 Al-Si 복합재료의 내마멸성에 미치는 Cu , Mg의 영향)

  • Shim, Shang-Han;Chung, Yong-Keun;Park, In-Min
    • Journal of Korea Foundry Society
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    • v.10 no.1
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    • pp.43-49
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    • 1990
  • The influences of Cu and Mg addition on wear properties of SiC particulate reinforced Al-Si metal(alloy) matrix composites were investigated. Metal matrix composites were prepared by combination of compocasting and hot pressing techniques. The main results obtained are as follows : 1) The composite with Mg addition exhibits letter wear resistance than that with Cu addition. It is considered that Mg addition improved wettability of matal matrix composite by the strong segregation to the SiC / Al matrix interface. 2) After homogenization treatment, it was found that the interfacial segregation of Mg was predominant, while that of Cu was not detected. 3) The SiC / Al-11Si eutectic composite exhibits better wear resistance than the SiC / Al-6Si hypoeutectic composite does. 4) It seems that the increase in the amount of Mg addition affects on the uniform dispersion of SiC particulates, on the refinement of microstructure and on age hardening and these effects cause wear resistance improvement of composites.

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Comparative Study on the Fabrication of Single Grain YBCO Bulk Superconductors using Liquid Infiltration and Conventional Melt Growth Processes (단결정 YBCO 벌크 초전도체 제조에 대한 액상침투법과 고전적 용융공정의 비교연구)

  • Mahmood, Asif;Jun, Byung-Hyuk;Kim, Chan-Joong
    • Progress in Superconductivity
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    • v.11 no.1
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    • pp.42-46
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    • 2009
  • With an aim of comparison, single grain Y-Ba-Cu-O (YBCO) bulk superconductors were fabricated using a liquid infiltration growth (LIG) process and a conventional melt growth (MTG) process with top seeding. The MTG process uses an $YBa_2Cu_3O_{7-x}$(Y123) powder as a precursor, while the LIG process uses $Y_2BaCuO_5(Y211)/Ba_3Cu_5O_8(Y035)$ pre-forms. The growth of a single Y123 domain on the top seed was successful in the both processes. Different feature between the two processes is the interior microstructure regarding the critical current density ($J_c$). The LIG-processed YBCO sample showed a lower porosity, more uniform distribution of Y211 particles and the enhanced Y211 refinement compared to the conventional MTG process. The $J_c$ improvement in the LIG process is attributed to the dispersion of finer Y211 particles as well as lower porosity within the Y123 superconducting matrix.

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Effect of Sintering Temperature on Microstructure and Mechanical Properties of Cu Particles Dispersed Al2O3 Nanocomposites (Cu 입자분산 Al2O3 나노복합재료의 미세조직과 기계적 특성에 미치는 소결온도의 영향)

  • Jeong, Young-Keun;Oh, Sung-Tag;Choa, Yong-Ho
    • Journal of Powder Materials
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    • v.13 no.5 s.58
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    • pp.366-370
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    • 2006
  • The microstructure and mechanical properties of hot-pressed $Al_2O_3/Cu$ composites with a different sintering temperature have been studied. The size of matrix grain and Cu dispersion in composites increased with increase in sintering temperature. Fracture toughness of the composite sintered at high temperature exhibited an enhanced value. The toughness increase was explained by the thermal residual stress, crack bridging and crack branching by the formation of microcrack. The nanocomposite, hot-pressed at $1450^{\circ}C$, showed the maximum fracture strength of 707 MPa. The strengthening was mainly attributed to the refinement of matrix grains and the increased toughness.

Influence of Sintering Temperature on Magnetic Properties of Ni-Zn-Cu Ferrites Used for Mangetic Shielding in NFC (NFC의 자기차폐용 Ni-Zn-Cu 페라이트의 자기특성에 미치는 소결온도의 영향)

  • Ryu, Yo-Han;Kim, Sung-Soo
    • Journal of Powder Materials
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    • v.23 no.2
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    • pp.132-135
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    • 2016
  • This study investigates the influence of sintering temperature on the magnetic properties and frequency dispersion of the complex permeability of Ni-Zn-Cu ferrites used for magnetic shielding in near-field communication (NFC) systems. Sintered specimens of $(Ni_{0.7}Zn_{0.3})_{0.96}Cu_{0.04}Fe_2O_4$ are prepared by conventional ceramic processing. The complex permeability is measured by an RF impedance analyzer in the range of 1 MHz to 1.8 GHz. The real and imaginary parts of the complex permeability depend sensitively on the sintering temperature, which is closely related to the microstructure, including grain size and pore distribution. In particular, internal pores within grains produced by rapid grain growth decrease the permeability and increase the magnetic loss at the operating frequency of NFC (13.56 MHz). At the optimized sintering temperature ($1225-1250^{\circ}C$), the highest permeability and lowest magnetic loss can be obtained.

Synthesis of Core-shell Copper nanowire with Reducible Copper Lactate Shell and its Application

  • Hwnag, Hyewon;Kim, Areum;Zhong, Zhaoyang;Kwon, Hyeokchan;Moon, Jooho
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.430.1-430.1
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    • 2016
  • We present the concept of reducible fugitive material that conformally surrounds core Cu nanowire (NW) to fabricate transparent conducting electrode (TCE). Reducing atmosphere can corrodes/erodes the underlying/surrounding layers and might cause undesirable reactions such impurity doing and contamination, so that hydrogen-/forming gas based annealing is impractical to make device. In this regards, we introduce novel reducible shell conformally surrounding indivial CuNW to provide a protection against the oxidation when exposed to both air and solvent. Uniform copper lactate shell formation is readily achievable by injecting lactic acid to the CuNW dispersion as the acid reacts with the surface oxide/hydroxide or pure copper. Cu lactate shell prevents the core CuNW from the oxidation during the storage and/or film formation, so that the core-shell CuNW maintains without signficant oxidation for long time. Upon simple thermal annealing under vacuum or in nitrogen atmosphere, the Cu lactate shell is easily decomposed to pure Cu, providing an effective way to produce pure CuNW network TCE with typically sheet resistance of $19.8{\Omega}/sq$ and optical transmittance of 85.5% at 550 nm. Our reducible copper lactate core-shell Cu nanowires have the great advantage in fabrication of device such as composite transparent electrodes or solar cells.

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Organic Dispersion Type Back Light EL Display Device as a New Light Source (신광원 유기분산형 백라이트 EL 디스플레이 소자)

  • 임인호;박종주;장관식;정회승;박창엽
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.14 no.1
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    • pp.1-6
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    • 2000
  • In this paper, organic dispersion type back light EL(Electroluminescent) devices were manufactured using Ethyl hydroxy ethyl cellulose as organic binder, ZnS:Cu as phosphor powder and $BaTiO_3$ as dielectrics by screen printing method, which are focused on as a new light source. The properties of the fabricated organic dispersion type back light EL devices were showed $1.98[mA/\m^2]$ of current density, 0.075[W] of power consumption, 7.1[nF] of capacitance at $25[^{\circ}C]$, 100[V], 400[Hz], respectively. Also brightness of the fabricated device was revealed $20~110[cd/\m^2]$ at 50~150[V] and the change of color was shoed bluish green of x=0.1711, y=0.3676 which are color coordinate by CIE.

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