• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.287-287
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• 2011

ITRS(international technology roadmap for semiconductors)에 따르면 MOS (metal-oxide-semiconductor)의 CD(critical dimension)가 45 nm node이하로 줄어들면서 poly-Si/SiO2를 대체할 수 있는 poly-Si/metal gate/high-k dielectric이 대두되고 있다. 일반적으로 metal gate를 식각시 정확한 CD를 형성시키기 위해서 plasma를 이용한 RIE(reactive ion etching)를 사용하고 있지만 PIDs(plasma induced damages)의 하나인 PICD(plasma induced charging damage)의 발생이 문제가 되고 있다. PICD의 원인으로 plasma의 non-uniform으로 locally imbalanced한 ion과 electron이 PICC(plasma induced charging current)를 gate oxide에 발생시켜 gate oxide의 interface에 trap을 형성시키므로 그 결과 소자 특성 저하가 보고되고 있다. 그러므로 본 연구에서는 이에 차세대 MOS의 metal gate의 식각공정에 HDP(high density plasma)의 ICP(inductively coupled plasma) source를 이용한 중성빔 시스템을 사용하여 PICD를 줄일 수 있는 새로운 식각 공정에 대한 연구를 하였다. 식각공정조건으로 gas는 HBr 12 sccm (80%)와 Cl2 3 sccm (20%)와 power는 300 w를 사용하였고 200 eV의 에너지로 식각공정시 TEM(transmission electron microscopy)으로 TiN의 anisotropic한 형상을 볼 수 있었고 100 eV 이하의 에너지로 식각공정시 하부층인 HfO2와 높은 etch selectivity로 etch stop을 시킬 수 있었다. 실제 공정을 MOS의 metal gate에 적용시켜 metal gate/high-k dielectric CMOSFETs의 NCSU(North Carolina State University) CVC model로 effective electric field electron mobility를 구한 결과 electorn mobility의 증가를 볼 수 있었고 또한 mos parameter인 transconductance (Gm)의 증가를 볼 수 있었다. 그 원인으로 CP(Charge pumping) 1MHz로 gate oxide의 inteface의 분석 결과 이러한 결과가 gate oxide의 interface trap양의 감소로 개선으로 기인함을 확인할 수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.5
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• pp.389-395
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• 2005

The etching technology of the high aspect ratio contact(HARC) is necessary at the critical contact processes of semiconductor devices. Etching the $SiO_{2}$ contact hole with the sub-micron design rule in manufacturing VLSI devices, the unexpected phenomenon of 'profile tilting' or 'bottom distortion' is often observed. This makes a short circuit between neighboring contact holes, which causes to drop seriously the device yield. As the aspect ratio of contact holes increases, the high C/F ratio gases, $C_{4}F_{6}$, $C_{4}F_{8}$ and $C_{5}F_{8}$, become widely used in order to minimize the mask layer loss during the etching process. These gases provide abundant fluorocarbon polymer as well as high selectivity to the mask layer, and the polymer with high sticking yield accumulates at the top-wall of the contact hole. During the etch process, many electrons are accumulated around the asymmetric hole mouth to distort the electric field, and this distorts the ion trajectory arriving at the hole bottom. These ions with the distorted trajectory induce the deformation of the hole bottom, which is called 'profile tilting' or 'bottom distortion'. To prevent this phenomenon, three methods are suggested here. 1) Using lower C/F ratio gases, $CF_{4}$ or $C_{3}F_{8}$, the amount of the Polymer at the hole mouth is reduced to minimize the asymmetry of the hole top. 2) The number of the neighboring holes with equal distance is maximized to get the more symmetry of the oxygen distribution around the hole. 3) The dual frequency plasma source is used to release the excessive charge build-up at the hole mouth. From the suggested methods, we have obtained the nearly circular hole bottom, which Implies that the ion trajectory Incident on the hole bottom is symmetry.

• Journal of the Korean Society for Railway
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• v.16 no.3
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• pp.163-168
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• 2013

The maintenance of an urban transit vehicle accounts for 60-70% of total costs over its entire life cycle, so it is critical to reduce maintenance costs and extend the life times of urban transit EMUs (electric multiple units) through research. For these researches, the reliability and availability data management system was constructed through the case study of several industries in the domestic and international in the field of reliability centered maintenance system. And we created a system to manage reliability and availability data for use in urban-EMU maintenance. In this work, we identified the major functions needed to successfully develop the system. Here we report the successful development of a reliability and availability data management system for maintenance of urban transit vehicles.

• Journal of the Korean Society of Industry Convergence
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• v.25 no.2_1
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• pp.149-159
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• 2022

Biomass is material that is comprehensive of carbonaceous materials from plants, crops, animals, and algae. It has been used as one of heating fuel since the beginning the emergence of human beings. Since biomass is regarded as carbon-neutral energy source, it has recently been attracting attention as an energy source that can replace fossil fuels. The most widely applied field is distributed power generation, and a method of generating electric power by driving an internal combustion engine with syngas produced by gasifier is chosen. While the composition of the syngas produced in gasifiers changes depending on the air flowing into the reactor, commercialized gasifiers so far do not control the air flowing into the reactor. When the inner pressure in reactor increases, the air sucked into the reactor is reduced. That change of amount of air makes the composition of syngas varied. Those variations of composition of syngas cause the incomplete combustion hence the power output of engine drops, which is a critical weakness of the gasification technology. In this paper, to produce the uniformly composed syngas, PID control is applied. The result was shown when the amount of air into the reactor is supplied with the constant amount using PID control, the standard deviation of caloric values of syngas is around 2[%] of its average value. Meanwhile the gasifier without PID control has the standard deviation of caloric values is around 7[%]. Therefore, Adopting PID control to supply constant air to the gasifier is highly desirable.

• Resources Recycling
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• v.31 no.3
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• pp.27-39
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• 2022

The global demand for lithium-ion batteries (LIBs) has been continuously increasing since the 1990s along with the growth of the portable electronic device market. Of late, the rapid growth of the electric vehicle market has further accelerated the demand for LIBs. The demand for the LIBs is expected to surpass the supply of lithium from natural resources in the near future, posing a risk to the global lithium supply chain. Moreover, the continuous accumulation of end-of-life LIBs is expected to cause serious environmental problems. To solve these problems, recycling the spent LIBs must be viewed as a critical technological challenge that must be urgently addressed. In this study, recycling LIBs using pyrometallurgical processes and post-processes for efficient lithium recovery are briefly reviewed along with the major accomplishments in the field and current challenges.

• Korean Journal of Materials Research
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• v.34 no.2
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• pp.111-115
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• 2024

Silicon carbide (SiC) has emerged as a promising material for next-generation power semiconductor materials, due to its high thermal conductivity and high critical electric field (~3 MV/cm) with a wide bandgap of 3.3 eV. This permits SiC devices to operate at lower on-resistance and higher breakdown voltage. However, to improve device performance, advanced research is still needed to reduce point defects in the SiC epitaxial layer. This work investigated the electrical characteristics and defect properties using DLTS analysis. Four deep level defects generated by the implantation process and during epitaxial layer growth were detected. Trap parameters such as energy level, capture-cross section, trap density were obtained from an Arrhenius plot. To investigate the impact of defects on the device, a 2D TCAD simulation was conducted using the same device structure, and the extracted defect parameters were added to confirm electrical characteristics. The degradation of device performance such as an increase in on-resistance by adding trap parameters was confirmed.

• Journal of Korea Society of Industrial Information Systems
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• v.13 no.4
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• pp.64-72
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• 2008

Recently security is being an important issue in almost every field of industry. This situation has affected port logistics industry deeply. Ports are now leaving operational methods that only focus on productivity, and shifting to new ones which focus on safety and customer services on the basis of it. Thus a lot of companies and institutions have offered various solutions as this issue becomes more and more intense. Among them, most typical solutions involve installing special devices to ordinary containers to improve its security, such as CSD (Container Security Device) of GE (General Electric) and eSeal of Savi Networks. On the other hand, these devices focus only on international standards or technical implementation, and this causes inconvenience to actual users like cargo owners, sea carriers, or stevedoring companies. This is considered to be due to lack of sufficient consideration on user demands. This research uses QFD (Quality Function Deployment) method for deducting system requirements in order to solve the problems of previous security devices and to develop a security system that can not only reflect the demands of the users but also considers real-world conditions. According to the QFD results, a total of 21 system CTO's were deducted under 5 categories.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.55-55
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• 2009

Silicon Carbide (SiC) is a material with a wide bandgap (3.26eV), a high critical electric field (~2.3MV/cm), a and a high bulk electron mobility (${\sim}900cm^2/Vs$). These electronic properties allow high breakdown voltage, high frequency, and high temperature operation compared to Silicon devices. Although various SiC DMOSFET structures have been reported so far for optimizing performances. the effect of channel dimension on the switching performance of SiC DMOSFETs has not been extensively examined. In this paper, we report the effect of the interface states ($Q_s$) on the transient characteristics of SiC DMOSFETs. The key design parameters for SiC DMOSFETs have been optimized and a physics-based two-dimensional (2-D) mixed device and circuit simulator by Silvaco Inc. has been used to understand the relationship with the switching characteristics. To investigate transient characteristic of the device, mixed-mode simulation has been performed, where the solution of the basic transport equations for the 2-D device structures is directly embedded into the solution procedure for the circuit equations. The result is a low-loss transient characteristic at low $Q_s$. Based on the simulation results, the DMOSFETs exhibit the turn-on time of 10ns at short channel and 9ns at without the interface charges. By reducing $SiO_2/SiC$ interface charge, power losses and switching time also decreases, primarily due to the lowered channel mobilities. As high density interface states can result in increased carrier trapping, or recombination centers or scattering sites. Therefore, the quality of $SiO_2/SiC$ interfaces is important for both static and transient properties of SiC MOSFET devices.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.269-270
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• 2009

The biased vertical alignment (BVA) liquid crystal (LC) mode shows a has a distinct advantage of lower manufacture cost due to the elimination of a lithographic process step to form either ITO-patterning or protrusions on the color-filter substrates. However, those devices have complex voltage conditions which is the respective induce voltage on common electrode, pixel electrode and bias electrode when positive and negative frame. In order to overcome the complex voltage condition, the pretilt angles is controlled by photo polymerization of the UV-curable reactive mesogen (RM). According to our studies, voltages to the cell are critical to achieve an optimized surface-modified quality BVA (Q-BVA) mode which provides the well defined reorientation of the LCs with respect to an electric field.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.1-8
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• 2006

Higher density integration and adoption of new materials in advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, metal interconnects respond to applied voltages by electrochemical ionization and conductive filament formation, which leads to short-circuit failure of the electronic package. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in D.I. water and NaCl solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Pb was primarily ionized in both D.I. water and $Cl^{-}$ solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for ECM resistance of solder alloys.