• Analytical Science and Technology
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• v.37 no.1
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• pp.63-78
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• 2024

The continuous increasing of the global demand of copper and nickel metals raises the interest in developing alternative technologies to produce them from copper sulfide ore. Also, in line with Egypt's vision 2030 for achieving the sustainable socioeconomic development which aims at developing alternative and eco-friendly technologies for processing the Egyptian ores to produce these strategic products instead of its importing. These metals enhance the advanced electrical and electronic industries. The current work aims at investigating the recovery of copper and nickel from Abu Swayeil copper ore using pug leaching technique by sulfuric acid. The factors affecting the pug leaching process including the sulfuric acid concentration, leaching time and temperature have been investigated. The copper ore sample was characterized chemically using X-ray fluorescence (XRF) and scanning electron microscope (SEM-EDX). A response surface methodology develops a quadratic model that expects the nickel and copper leaching effectiveness as a function of three controlling factors involved in the procedure of leaching was also investigated. The obtained results showed that the maximum dissolution efficiency of Ni and Cu are 99.06 % and 95.30%, respectively which was obtained at the following conditions: 15 % H₂SO₄ acid concentration for 6 hr. at 250 ℃. The dissolution kinetics of nickel and copper that were examined according to heterogeneous model, indicated that the dissolution rates were controlled by surface chemical process during the pug leaching. The activation energy of copper and nickel dissolution were 26.79 kJ.mol^-1 and 38.078 kJ.mol^-1 respectively; and the surface chemical was proposed as the leaching rate-controlling step.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.8
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• pp.966-971
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• 1988

AES was used to study oxygen adsorption due to the oxygen exposure at 300\ulcorner temperature and segregation of impurities due to annealing on polycrystal copper surface. The intensity of peak of CuM2, 3VV and CuL3 VV increased with annealing time and the peak of CKLL increased after Ar ion bombardment. The effect of oxygen adsorption on copper surface at 300\ulcorner was verified by the decreased of peak of CuM2, 3VV and CuL3 VV as oxygen exposure increase. The binding energy of copper atoms gradualy shifts from 0.7eV to 1.5eV of copper atoms gradually shifts from 0.7eV to 1.5eV after a oxygen exposure. After the oxygen exposure, the width at half the height of CuM2, 3VV is larger 2V*C/S by the effect of chemical liaison of the copper aton with oxygen atom.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.71-71
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• 2010

Copper oxide thin films were deposited on the p-type Si(100) by r.f. magnetron sputtering as a function of different substrate temperature. The deposited copper oxide thin films were investigated by atomic force microscopy (AFM), scanning electron microscopy (SEM), spectroscopic ellipsometry (SE), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The SEM and SE data show that the thickness of the copper oxide films was about 170 nm. AFM images show that the surface roughness of copper oxide films was increased with increasing substrate temperature. As the substrate temperature increased, monoclinic CuO (111) peak appeared and the crystal size decreased while the monoclinic CuO (-111) peak was independent on the substrate temperature. The oxidation states of Cu 2p and O 1s resulted from XPS were not affected on the substrate temperature. The contact angle measurement was also studied and indicated that the surface of copper oxide thin films deposited high temperature has more hydrophobic surface than that of deposited at low temperature.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.244-248
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• 1999

Photoelectrodeposition of copper on semiconductive B-doped diamond films was investigated. There are cleasr morphology differences between photodeposited copper and electrodeposited copper. Photoelecrodeposition proceeded as uniform 2-dimensional growth. On the other hand electrodeposition proceeded as scarce random deposition. By applying this effect we have succeeded in forming a conductive pattern on semiconductive B-doped diamond with the aid of a photo-mask. And it was suggested that the surface reforming caused by photoelectrochemical process could be easily detected by the following metal (copper) deosition method, which is demonstrated as 'Diamond photographic phenomenon'.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.49 no.10
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• pp.841-847
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• 2021

In this paper, the applicability of the low-density surface film copper mesh for aircraft applications have been analyzed. Recently, low-density surface film copper mesh is developed to reduce weight and cost compared with traditional surface film copper mesh. In order to apply low-density surface film copper mesh to aircraft, it is needed to analyze its electromagnetic effects as well as structural integrity with sandwich panels to prevent pinholes. The structural integrity and electromagnetic characteristics have been analyzed for 2 samples of low-density surface film copper mesh and 1 sample of surface film copper mesh. To review the applicability of the low-density surface film, it is combined with sandwich composite panel to confirm pinhole effects. The low-density surface film has been modeled as a periodic structure and analyzed with 3D electromagnetic simulation tool. The simulation results has been verified through measured electromagnetic transmission results using free space measurements. From the results, it will be possible to use these results for the analysis and the applicability of low-density surface film copper mesh for aircraft.

• Environmental Engineering Research
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• v.8 no.2
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• pp.91-97
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• 2003

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.11
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• pp.836-840
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• 2013

In this study, the surface modification of copper foil using an inductively coupled $O_2$ / Ar plasma as $O_2$ gas fraction (0~100%) was investigated in order to improve the surface characteristics. After plasma treatment, the measurement of the surface roughness, surface contact angle and surface energy were performed for the surface analysis of copper foil. As a result, the surface roughness and the surface energy were increased. And plasma diagnostics was performed by a double Langmuir probe (DLP) and optical emission spectroscopy (OES). Using these results, the plasma surface modification mechanism was investigated.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.210.1-210.1
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• 2014

The hexagonal boron nitride (h-BN) sheet, a 2D material like graphene sheet, is comprised of boron and nitrogen atoms. Similar to graphene, h-BN sheet has attractive mechanical properties while it has a wide band gap unlike graphene. Recently, many experimental groups studied the growth of single BN layer by chemical vapor deposition (CVD) method on the copper substrate. To study the initial stage of h-BN growth on the copper surface, we have performed density functional theory calculations. We investigate several adsorption sites of a boron or nitride atom on the Cu surfaces. Then, by increasing the number of adsorbed B and N atoms, we study formation behaviors of the BN flakes on the surface. Several types of BN flakes atoms such as triangular, linear, and hexagonal shapes are considered on the copper surface. We find that the formation of the BN flake in triangular shape is most favorable on the surface. On the basis of the theoretical results, we discuss the growth mechanism of h-BN layer on the copper surfaces in terms of its shapes in the initial stage of growth.

• Journal of the Korean institute of surface engineering
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• v.48 no.1
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• pp.1-6
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• 2015

Amino-carboxyl acid as a complexing agent in acid copper sulfate solution was utilized to improve the adhesion of immersion copper layer for steel wire. According to the tape test results, regardless of alloy composition of the wire, the adhesion of immersion copper layer was improved with the addition of amino-carboxyl acid. The incorporation of H and Fe in the plating layer was analyzed by TOF-SIMS. The H and Fe were detected at the entire coating layer without any addition of amino-carboxyl acid. However, with addition of amino-carboxyl acid, the H and Fe were scarcely detected at the coating layer.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.4
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• pp.425-429
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• 2009

The protection for copper tarnish was developed by surface treatment method and volatile corrosion inhibiting (VCI) technology. The performance of surface treatment and VCI material is also examined in simulated test environment. Benzotriazole (BTAH) solution that contained molybdate showed best performance than others. Usage of VCI materials with surface treatment was more effective. The protection film foamed on the surface of copper was investigated by auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS). Molybdate does not participate in the formation of the protective film but promotes the passivation effect. This facilitates the stabilization of the cuprous oxide film, and strengthens the adsorption of BTAH.