A Study on the Adhesion Improvement of Immersion Copper Coatings using Complexing Agent
![]() |
Koo, Seokbon
(Surface Technology R&BD Group, Korea Institute of Industrial Technology)
Jeon, Jumi (Surface Technology R&BD Group, Korea Institute of Industrial Technology) Hur, Jinyoung (Surface Technology R&BD Group, Korea Institute of Industrial Technology) Lee, Hongkee (Surface Technology R&BD Group, Korea Institute of Industrial Technology) |
1 | R. Sharmaitis et al, 10th Lithuanian Conf. of electrochemists, (1970) 108. |
2 | L. Domnikov, Metal Finish, 63(2), (1965) 64. |
3 | K. N. Srinivasan et al, B. Electrohem. 4(4), (1988) |
4 | M. Paunovic, Modern Electroplating, 5th Ed. (2010) |
5 | S. Nakahara and Y. Okinaka, Ada Metall., 31, (1983) 713. DOI |
6 | J.E. Graebner, Y. Okinaka, J. Appl. phys., 60(1), (1986) 36. DOI |
7 | Y. Okinaka and H.K. Straschil, J. Electrochem. Soc., 133, (1986) 2608. DOI |
8 | S. Nakahara, Acta Metall., 36(7), (1988), 1669. DOI |
![]() |