Browse > Article
http://dx.doi.org/10.4313/JKEM.2013.26.11.836

A Study on the Surface Modification Mechanism of Copper Foil Using O2 / Ar Plasma  

Lee, Jongchan (Department of Control and Instrumentation, Korea University)
Son, Jinyoung (Department of Control and Instrumentation, Korea University)
Kim, Moonkeun (Department of Control and Instrumentation, Korea University)
Kwon, Kwang-Ho (Department of Control and Instrumentation, Korea University)
Lee, Hyunwoo (Division of Electronic, Computer and Communication Engineering, Hanseo University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.26, no.11, 2013 , pp. 836-840 More about this Journal
Abstract
In this study, the surface modification of copper foil using an inductively coupled $O_2$ / Ar plasma as $O_2$ gas fraction (0~100%) was investigated in order to improve the surface characteristics. After plasma treatment, the measurement of the surface roughness, surface contact angle and surface energy were performed for the surface analysis of copper foil. As a result, the surface roughness and the surface energy were increased. And plasma diagnostics was performed by a double Langmuir probe (DLP) and optical emission spectroscopy (OES). Using these results, the plasma surface modification mechanism was investigated.
Keywords
Copper foil; Roughness; Surface energy; Plasma; $O_2$; Ar; DLP; OES;
Citations & Related Records
연도 인용수 순위
  • Reference
1 X. Ye, M. De Bonte, J. P. Celis, and J. R. Roos, J. Electrochem. Soc., 139, 1592 (1992).   DOI
2 J. W. Braithwaite, G. Angelo, N. Ganesan, and J. L. Samuel. J. Electrochem Soc., 146, 448 (1999).   DOI   ScienceOn
3 N. Tamura, R. Ohshita, M. Fujimoto, M. Kamino, and S. Fujitani, J. Electrochem. Soc., 150, A679 (2003).   DOI   ScienceOn
4 E. T. Kang, K. L. Tan, K. Kato, Y. Uyama, and Y. Ikada, J. Macromolecules, 29, 6872 (1996).   DOI   ScienceOn
5 J. R. Chen and T. Wakida, J. Appl. Polym. Sci. 63, 1733 (1997).   DOI   ScienceOn
6 D. K. Owens and R. C. Wendt, J. Appl. Polym. Sci., 13, 1741 (1969).   DOI
7 B. K. Kim, K. S. Kim, C. E. Park, and C. M. Ryu, J. Adhesion Sci. Technol., 16, 509 (2002).   DOI   ScienceOn
8 S. J Cho, J. W Choi, and I. S Bae, J. Appl Phys., 50, 01AK02 (2011).   DOI
9 C. R. Aita, J. Vac. Sci. Technol., A3, 625 (1985).
10 K. H. Kwon, A. Efremov, M. Kim, N. K. Min, J. Jeong, M. Hong, and K. Kim, J. Vac. Sci. Technol., A28, 226 (2010).