• 제목/요약/키워드: Copper powder

검색결과 366건 처리시간 0.023초

Expansion Behavior of Iron-copper Compact Made from (Fe-Cu) Prealloyed Powder

  • Kim, Youn-Che;Suk, Myung-Jin
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.812-813
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    • 2006
  • Dimensional change of compact made from (Fe-Cu) prealloyed powder and copper powder compared to that of compact made from iron-copper elemental powder. The compact made from the prealloyed powder with a copper content of 7.18mass% which is nearly equal to its solution limit and copper powder showed only the large contraction in spite of penetration of liquid copper into grain boundary of the prealloyed powder. But the compact made from iron-copper elemental powder showed the large expansion in spite of same chemical composition with former case.

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Fe-Cu계 소결합금의 이상팽창에 관한 연구 (I) (A Study on Abnormal Expansion of Fe-Cu Sintered Alloy)

  • 송영준;김윤채
    • 한국분말재료학회지
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    • 제11권5호
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    • pp.383-390
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    • 2004
  • In order to investigate behavior of abnormal expansion of the iron-copper compacts, we compared the dilatometric curves of the compacts which mixed the copper powder to the iron powder with those of compacts which mixed the copper powder to the iron-copper alloy powder. The dilatometric curves were obtained below the sintering conditions, which heated up to 115$0^{\circ}C$ by a heating rate of 1$0^{\circ}C$/min, held for 60min at 115$0^{\circ}C$ and cooled down at a rate of 2$0^{\circ}C$/min to room temperature. The dilatometric curves of the compacts showed the different expansion behavior at temperatures above the copper melting point in spite of same chemical composition. All of the compacts of former case showed large expansion, but all of the compacts in latter case showed large contraction. The microstructures of sintered compacts also showed the different progress in alloying of the copper into the iron powder. Namely we could observe the segregation at alloy part of copper into iron powder in case of the sintered compacts, which mixed the copper powder to the iron powder, but could not observe the segregation in compacts which mixed the copper powder to the iron-copper alloy powder. But the penetration of liquid copper into the interstices between solid particles was occurred at both cases. Therefore, the showing of the different dimensional changes in the compacts in spite of same chemical composition is due to more the alloying of copper into iron powder than the penetration of liquid copper into the interstices between solid particles.

구리 관(管)의 절단(切斷) 공정(工程)중 발생한 구리칩 스크랩의 볼밀링에 의한 구리 분말(粉末) 제조(製造) 가능성(可能性) (Feasibility of Copper Powder Fabrication by Ball Milling of Copper Chip Scrap Occurred During Cutting Process of Copper Pipe)

  • 홍성현
    • 자원리싸이클링
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    • 제20권6호
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    • pp.37-42
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    • 2011
  • 구리관의 절단 공정에서 구리 칩 스크랩이 발생해왔다. 분쇄에 의하여 구리칩 스크랩을 분말화하는 가능성이 연구되었다. 본 연구에서는 로드 밀링, 수평식 볼밀링과 같은 두 가지 타입의 분쇄 방식이 적용되었다. 구리 칩은 로드 밀링에 의하여 분말 형태로 분쇄될 수 없었다. 반면에 36시간 이상 수평식 볼밀링에 의하여 구리칩은 분말로 변화하였다. 수평식 볼밀링에 의한 구리 칩의 분말로 재활용이 가능하였고 48시간 동안 밀링된 원료중 $75{\sim}150{\mu}m$ 범위의 분말은 25.3%이였다.

Kelex100로부터 구리입자 분말 합성 (Composite copper powder from Kelex 100)

  • 조종상;;양권승
    • 한국결정성장학회지
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    • 제8권1호
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    • pp.131-137
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    • 1998
  • 구리입자를 코딩한 분말 합성은 Kelex 100 solvent extraction으로부터 silica powder에 수소압력 stripping copper에 의하여 생성하였다. Solvent extraction의 범위내인 일정한 조건에서 loading level과 stripping rate등을 재생하였으며 stripping copper kinetics는 divalent상태에서 metallic 상태로 감소하면서 silica 입자에 침적하였다. Copper들은 seed 입자에 heterogeneous 핵을 형성하면서 이들은 agglomeration 상태로 생성되었고 불균일한 분말로 형성하였다.

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MoO3 침출공정 폐액으로부터 동분말의 회수기술 (Recovery of Copper Powder from MoO3 Leaching Solution)

  • 홍현선;정항철;김건홍;공만식
    • 한국분말재료학회지
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    • 제16권5호
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    • pp.351-357
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    • 2009
  • A two-step recovery method was developed to produce copper powders from copper chloride waste solution as byproducts of MoO$_3$ leaching process. The first step consisted of replacing noble copper ions with external Fe$^{3+}$ ions which were formed by dissolving iron scraps in the copper chloride waste solution. The replaced copper ions were subsequently precipitated as copper powders. The second step was cementation of entire solution mixture to separate (pure) copper powders from aqueous solution of iron chloride. Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRD, SEM-EDS and laser diffraction and scattering methods.Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99% purity and average 1$\sim$2$\mu$m in size.

MoO3 침출공정 폐액으로부터 치환반응 시스템을 이용한 구리 분말 회수에 대한 연구 (Recovery of Copper Powder form MoO3 Leaching Solution Using Cementation Reaction System)

  • 김건홍;홍현선;정항철
    • 한국분말재료학회지
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    • 제19권6호
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    • pp.405-411
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    • 2012
  • Recovery of copper powder from copper chloride solution used in $MoO_3$ leaching process was carried out using a cementation method. Cementation is a simple and economical process, necessitating less energy compared with other recovery methods. Cementation utilizes significant difference in standard reduction potential between copper and iron under standard condition. In the present research, Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated using bench-scale cementation reaction system. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRF, SEM-EDS and laser diffraction and scattering methods. Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99.65% purity and average $1{\mu}m$ in size.

분무열분해법에 의한 구리염화물 용액으로부터 CuO 분말 제조에 관한 연구 (A study on the Manufacture of the CuO Powder from Copper Chloride Solution by Spray Pyrolysis Process)

  • 유재근;박희범
    • 한국재료학회지
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    • 제12권1호
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    • pp.58-67
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    • 2002
  • In this study copper chloride(CuCl$_2$) solution was used as raw material to produce the fine copper oxide powder which has less than 1 $\mu\textrm{m}$ average particle size and has uniform particle size distribution by spray pyrolysis process. In the present study, the effects of reaction temperature, the injection speed of solution and air, the nozzle tip size and the concentration of raw material solution on the properties of produced powder were studied. The structure of the powder became much more compact with increasing the reaction temperature regardless of copper concentration of the raw material solution. The particle size of the powder increased accordingly with increasing the reaction temperature in case of 30 g/$\ell$ copper concentration of the solution. The particle size of the powder increased accordingly, and the surface structure of the powder became more porous with increasing the copper concentration of the raw material solution. When copper concentration in raw material solution was more than 100 g/$\ell$, all produced powder was CuCl regardless of reaction temperatures. When copper concentration in solution was below 30 g/$\ell$ and reaction temperature was higher than 90$0^{\circ}C$, CuO was the main phase. The surface of the powder tended to become porous with increasing the injection speed of solution. Particle size was increased and the surface of the powder showed severely disrupted state with increasing the nozzle tip size. The particle size was decreased and the particle size distribution was more uniform with increasing the air pressure through the nozzle.

Equilibrium and kinetic studies on the adsorption of copper onto carica papaya leaf powder

  • Varma V., Geetha;Misra, Anil Kumar
    • Membrane and Water Treatment
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    • 제7권5호
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    • pp.403-416
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    • 2016
  • The possibility of using carica papaya leaf powder for removal of copper from wastewater as a low cost adsorbent was explored. Different parameters that affect the adsorption process like initial concentration of metal ion, time of contact, adsorbent quantity and pH were evaluated and the outcome of the study was tested using adsorption isotherm models. A maximum of 90%-94.1% copper removal was possible from wastewater having low concentration of the metal using papaya leaf powder under optimum conditions by conducting experimental studies. The biosorption of copper ion was influenced by pH and outcome of experimental results indicate the optimum pH as 7.0 for maximum copper removal. Copper distribution between the solid and liquid phases in batch studies was described by isotherms like Langmuir adsorption and Freundlich models. The adsorption process was better represented by the Freundlich isotherm model. The maximum adsorption capacity of copper was measured to be 24.51 mg/g through the Langmuir model. Pseudo-second order rate equation was better suited for the adsorption process. A dynamic mode study was also conducted to analyse the ability of papaya leaf powder to remove copper (II) ions from aqueous solution and the breakthrough curve was described by an S profile. Present study revealed that papaya leaf powder can be used for the removal of copper from the wastewater and low cost water treatment techniques can be developed using this adsorbent.

Development of the Copper Core Balls Electroplated with the Solder of Sn-Ag-Cu

  • Imae, Shinya;Sugitani, Yuji;Nishida, Motonori;kajita, Osamu;Takeuchi, Takao
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.1207-1208
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    • 2006
  • We developed the copper core ball electroplated with Sn-Ag-Cu of the eutectic composition which used mostly as Pb free solder ball with high reliability. In order to search for the practicality of this developed copper core ball, the evaluation was executed by measuring the initial joint strength of the sample mounted on the substrate and reflowed and by measuring the joint strength of the sample after the high temperature leaving test and the constant temperature and the humidity leaving test. This evaluation was compered with those of the usual other copper core balls electroplated with (Sn,Sn-Ag,Sn-Cu,Sn-Bi) and the Sn-Ag-Cu solder ball.

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Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying

  • Song, Shu-Xiang;Zhou, Zhang-Jian;Du, Juan;Zhong, Zhi-Hong;Ge, Chang-Chun
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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    • pp.511-512
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    • 2006
  • Tungsten coatings with different interlayers onto the oxygen-free copper substrates were fabricated by atmosphere plasma spraying. The effects of different interlayers of NiCrAl, NiAl and W/Cu on bonding strength were studied. SEM, EDS and XRD were used to investigate the photographs and compositions of these coatings. The tungsten coatings with different initial particle sizes resulted in different microstructures. Oxidation was not detected in the tungsten coating, but in the interlayer, it was found by both XRD and EDS. The tungsten coating deposited directly onto the copper substrate presented higher bonding strength than those with different interlayers.

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