• Geomechanics and Engineering
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• 제29권4호
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• pp.421-434
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• 2022

In the present study, reference samples were prepared using ore preparation facility tailings taken from the copper mine (Kure, Kastamonu), Portland cement (PC) in certain proportions (3 wt%, 5 wt%, 7 wt%, 9wt% and 11 wt%), and water. Then natural zeolite taken from the Bigadic Region was mixed in certain proportions (10 wt%, 20 wt%, 30 wt% and 40 wt%) for each cement ratio, instead of the PC, to prepare zeolite-substituted CPB samples. Thus, the effect of using Zeolite instead of PC on CPB's strength was investigated. The obtained CPB samples were kept in the curing cabinet at a temperature of 25℃ and at least 80% humidity, and they were subjected to the Uniaxial Compressive Strength (UCS) test at the end of the curing periods of 3, 7, 14, 28, 56, and 90 days. Except for the 3 wt% cement ratio, zeolite substitution was observed to increase the compressive strength in all mixtures. Also, the liquefaction risk limit for paste backfill was achieved for all mixtures, and the desired strength limit value (0.7 MPa) was achieved for all mixtures with 28 days of curing time and 7 wt%, 9 wt%, 11 wt% cement ratios and 5% cement - 10% zeolite substituted mixture. Moreover, the limit value (4 MPa) required for use as roof support was obtained only for mixtures with 11% cement - 10% and 20% zeolite content. Generally, zeolite substitution seems to be more effective in early strength (up to 28th day). It has been determined that the long-term strength losses of zeolite-substituted paste backfill mixtures were caused by the reaction of sulfate and hydration products to form secondary gypsum, ettringite, and iron sulfate.

• Journal of Nutrition and Health
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• 제39권4호
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• pp.381-391
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• 2006

This study is performed to compare the dietary intakes and food sources of copper (Cu) using the database of Cu content developed in this study between the elementary schoolchildren in remote rural areas (RA, n=58, $9.9{\pm}1.7$ yrs) and those in urban area (UA, n=60, $9.4{\pm}1.8$ yrs), and to analyze the relationship between serum Cu concentration and serum antioxidant status in the RA. The results obtained in this study were as followings: 1) Dietary intakes of calorie, calcium and iron in the RA were in the 3/5-4/5 of the Korean RDA while the UA were similar to or more than the Korean RDA, 7th ed. except iron. 2) More than 273 kinds of food consumed by the subjects were analyzed the content of Cu and database of Cu content were developed in the present study. The mean dietary intake of Cu per day in the RA was $0.99{\pm}0.07mg/d$ ($170.0{\pm}13.2%$ of the USA RDA) while it was $1.22{\pm}0.07mg/d$ ($203.4{\pm}13.1%$ of the RDA) in the UA. The percentage of dietary intakes of Cu less than 213 of the RDA was 8.6% in the RA in comparison to 0% in the UA. 3) The RA and the UA consumed more than 80% of total dietary intakes of Cu from plant foods. Thus, the RA and the UA consumed Cu from cooked rice, vegetables and fruits as a major source. However the RA had less Cu from meat and their products than did the UA (p<0.05) .4) Crab stew including crab and juice was the highest food source of Cu for the total subjects, followed by seasoned bud of aralia, cooked; beef rib meat, roasted; soybean paste soup w/mallow; and soybean paste soup w/mallow & beef. Major food source of Cu was similar for the RA and the UA such as cooked rice, vegetables and fruits. 5) Mean concentration of serum Cu in the RA was $18.1{\pm}0.7{\mu}M/L$ that was in the normal value, and all subjects in this group were in more than normal value. In the RA serum Cu concentration related positively with serum ceruloplasmin concentration, serum vitamin C concentration and EC SOD activity, respectively. However, serum Cu concentration did not relate with serum TBARS concentration in the RA. Above results showed that the RA had good status of Cu nutrition based upon dietary intake and serum concentration, however some of the RA had lower intake of Cu than the RDA. The overall children in the UA had good Cu nutrition. Therefore, the subgroup of the RA should be supported to improve their Cu nutrition, and this support could give them better antioxidant status based upon positive relationship between serum Cu concentration and serum antioxidant status in the RA.

• 전자공학회논문지
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• 제53권8호
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• pp.119-126
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• 2016

본 논문에서는 의복용 무선전력전송 시스템을 구축을 위한 평면형 직물공진기를 제안하고, 공진기에 사용된 의복용 직물기판의 재질별 특성을 분석하였다. 평면형 직물공진기는 공진주파수가 1-10 MHz가 되도록 직물기판 위에 전도성 물질로 루프 및 코일을 평면 설계하였다. 의복용으로 많이 사용되고 있는 폴리에스테르 섬유와 면을 직물기판으로 사용하였으며, 평면 루프와 코일은 동테이프(copper tape)와 실버페이스트(silver paste)로 설계하였다. 자기공진형 무선전력전송 시스템에 적용된 직물의 재질별 특성을 분석하기 위해 송신부와 수신부를 대칭으로 설계하였다. 실험 결과, 낮은 유전상수 및 비교적 두꺼운 두께를 가진 직물기판과 표면저항이 작은 도체성 재질의 패턴(루프 및 코일)으로 제작되었을 때, 의복용 무선전력전송 시스템이 높은 전송효율을 보였다. 본 연구를 통해 제안된 평면형 직물 공진기는 무선전력전송 기술의 영역을 의복용으로 넓힐 수 있는 가능성을 보여주었다.

• 폴리머
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• 제27권4호
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• pp.275-284
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• 2003

접착성이 없는 고밀도 폴리에틸렌 (HDPE)과 나노입자 카본블랙 복합체를 대상으로 전극과의 계면 접착 향상과 고분자 가교 특성에 따른 양온도 계수 (PTC) 특성을 연구하였다. 은페이스트를 전극으로 사용하였을 때에는, 전극과 HDPE의 접착 계면 저항으로 인하여 카본함량이 45 wt% 이상에서 1 $\Omega$ 이었으나, 덴드라이트 (dendrite)된 구리 전극의 경우 HDPE와 전극간의 넓은 면적 접촉에 의한 계면 저항이 0.2 $\Omega$ 이하였다. HDPE와 은페이스트의 계면 저항의 증가로 인하여 구리 박막을 사용하였을 때보다 전체적으로 저항이 높게 나타났다. HDPE와 나노입자 카본블랙 복합체는 온도가 증가하여 HDPE의 비캣연화온도까지는 저항이 일정하게 유지하다가, HDPE의 연화점에서 증가하기 시작하여 용융점에서 극대 값을 나타내는 전형적인 PTC특성을 보여주었다. 일반적으로 HDPE의 용융점을 넘어서면 음온도 계수 (NTC) 현상이 나타나는데, 가교결합을 시킨 HDPE의 경우는, 용융점 이상에서 NTC 현상이 나타나지 않고 저항이 일정하게 유지되거나 증가하는 경향이 나타났다. 구리 (copper) 전극과 고분자와의 계면 접촉 면적을 증가시키기 위하여 크롬 (chromium)을 덴드라이트시킨 전극을 사용하여 계면 접촉 저항을 감소시켰다.

• 마이크로전자및패키징학회지
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• 제11권4호
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• pp.1-5
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• 2004

다층 연성기판은 높은 전기 전도성과 낮은 절연상수로 잘 알려진 구리와 폴리이미드로 구성되어 있다. 본 연구에서는 이러한 다층연성기판을 패턴된 스테인리스 스틸 위에 구리선을 전기도금하고 폴리이미드를 코팅함에 의해서 균일한 형태의 $5{\mu}m$-pitch의 전도선을 제조하는데 성공하였다. 또한, 다층기판 형성시 비아흘은 UV 레이저로 형성시켰으며 구리와 주석을 전기 도금함으로 이를 채웠다. 그런다음 비아와 전도선이 붙은 채로 스테인리스 스틸에서 벗겨냈다. 이렇게 형성된 각각의 층을 한번에 적층하여 다층연성기판을 완성하였다. 적층시 주석과 구리사이에 고체상태 반응(Solid state reaction)이 발생하여 $Cu_6Sn_5$ and $Cu_3Sn$을 형성하였으며 비아패드에 비아가 수직으로 위치한 완전한 형태의 층간 연결을 형성하였다. 이러한 비아 형성 공정은 V형태의 비아나 페이스트 비아와 비교할 때 좋은 전기적 특성, 저가공정등의 여러 장점을 가지고 있다.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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• pp.225-229
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• 2009

The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

• Bulletin of the Korean Chemical Society
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• 제35권10호
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• pp.3025-3029
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• 2014

To realize copper-based electrode materials for printed electronics applications, it is necessary to improve the adhesion strength between conductive lines and the substrate. Here, we report the preparation of Cu pastes using (3-glycidoxypropyl) trimethoxysilane (GPTMS) prepolymer as an adhesion promoter (AP). The Cu pastes were screen-printed on glass and polyimide (PI) substrates and sintered at high temperatures (> $250^{\circ}C$) under a formic acid/$N_2$ environment. According to the adhesion strengths and electrical conductivities of the sintered Cu films, the optimized Cu paste was composed of 1.0 wt % GPTMS prepolymer, 83.6 wt % Cu powder and 15.4 wt % vehicle. After sintering at $400^{\circ}C$ on a glass substrate and $275^{\circ}C$ on a PI substrate, the Cu films showed the sheet resistances of $10.0m{\Omega}/sq$. and $5.2m{\Omega}/sq$., respectively. Furthermore, the sintered Cu films exhibit excellent adhesion properties according to the results of the ASTM-D3359 standard test.

• 한국재료학회지
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• 제17권1호
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• pp.50-55
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• 2007

Ultra-fine Copper powder for a conductive paste in electric-electronic field have been synthesized by chemical reduction of aqueous $CuSO_4$ with hydrazine hydrate $(N_2H_4{\cdot}H_2O)$ as a reductor. The effect of reaction conditions such as dispersant and reaction temperature on the particle size and shape for the prepared Cu powders was investigated by means of XRD, SEM, TEM and TGA. Experiments showed that type of dispersant and reaction temperature were affected on the particle size and morphology of the copper powder. When the carboxymethyl cellulose (CMC) was added as a dispersant the relative mono-dispersed and spherical Cu powder was obtained. Cu powders with particle size of approximately 140nm and narrow particle size distribution were obtained from 0.3M $CuSO_4$ with adding of 0.03M CMC and 40ml $N_2H_4{\cdot}H_2O$ at a reaction temperature of $70^{\circ}C$.

• 한국재료학회지
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• 제27권4호
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• pp.221-228
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• 2017

Various morphologies of copper oxide (CuO) have been considered to be of both fundamental and practical importance in the field of electronic materials. In this study, using Cu ($0.1{\mu}m$ and $7{\mu}m$) particles, flake-type CuO particles were grown via a wet oxidation method for 5min and 60min at $75^{\circ}C$. Using the prepared CuO, AlN, and silicone base as reagents, thermal interface material (TIM) compounds were synthesized using a high speed paste mixer. The properties of the thermal compounds prepared using the CuO particles were observed by thermal conductivity and breakdown voltage measurement. Most importantly, the volume of thermal compounds created using CuO particles grown from $0.1{\mu}m$ Cu particles increased by 192.5 % and 125 % depending on the growth time. The composition of CuO was confirmed by X-ray diffraction (XRD) analysis; cross sections of the grown CuO particles were observed using focused ion beam (FIB), field emission scanning electron microscopy (FE-SEM), and energy dispersive analysis by X-ray (EDAX). In addition, the thermal compound dispersion of the Cu and Al elements were observed by X-ray elemental mapping.

• Journal of Welding and Joining
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• 제35권3호
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• pp.21-27
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• 2017

A soldering temperature of ($235{\pm}3$) $^{\circ}C$ is described in ISO 9455-15 for the copper corrosion test. However, this temperature is not suitable for performing lead-free solder pastes. We evaluated the compatibility of a lead-free solder paste in the experimental conditions of (Liquidus temperature + ($35{\pm}3$)) $^{\circ}C$. Based on the results after a Cu corrosion test, a proper temperature for Pb-free soldering was (melting point+($35{\pm}3$)) $^{\circ}C$. Criteria used to evaluate corrosion due to discoloration of flux residue is described in ISO 9455-15, but a more quantitative evaluation standard is needed. In this study, experimental error level was estimated by analyzing flux residue after a corrosion test for 72, 500 hours of specimens using EDS analysis with acceleration voltage. It was determined that the copper area at the flux residue boundary is suitable for the EDS analysis area.