• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2005년도 High Temperature Superconductivity Vol.XV
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• pp.90-90
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• 2005

• 한국표면공학회지
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• 제5권1호
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• pp.1-7
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• 1972

Copper -clad laminate(CCL) was fabricated and evaluated by bonding 35${\pm}$5${\mu}$ thick electroplated copper foils with a suitable adhesive to an insulating base such as phenolic resin laminate. In this study, electroplating methods and conditions were studied to produced good quality copper foils for printed circuit board applications. The electroplating bath solutions used were a copper-sulfate solution and a concentrated copper fluoborate solution. A surface roughening treatment that improved the adhesive strength of copper foils with an insulating laminate was also developed . A conventional copper sulfate solution containing sulfuric acid was used for the roughening treatment.

• 한국재료학회지
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• 제18권3호
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• pp.117-122
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• 2008

Micro-sized bumps on a multi-layered build-up PCB were fabricated by pulse-reverse copper electroplating. The values of the current density and brightener content for the electroplating were optimized for suitable performance with maximum efficiency. The micro-bumps thus electroplated were characterized using a range of analytical tools that included an optical microscope, a scanning electron microscope, an atomic force microscope and a hydraulic bulge tester. The optical microscope and scanning electron microscope analyses results showed that the uniformity of the electroplating was viable in the current density range of $2-4\;A/dm^2$; however, the uniformity was slightly degraded as the current density increased. To study the effect of the brightener concentration, the concentration was varied from zero to 1.2 ml/L. The optimum concentration for micro-bump electroplating was found to be 0.6 ml/L based on an examination of the electroplating properties, including the roughness, yield strength and grain size.

• 한국표면공학회지
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• 제36권2호
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• pp.194-199
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• 2003

Polarization measurements were peformed to investigate the electrochemical behavior of copper ions and limiting current density in waste rinse water from copper electroplating processes. A newly designed cyclone type electrolyzer was tested to recover the copper powder. Synthetic solutions were prepared using analytical grade $CuSO_4$ to the desired waste water concentration and pH was adjusted with $H_2$$SO_4$. Electrowinning was peformed at room temperature and the solution was cycled with a pump. Results showed that more than 99 percent of Cu was recovered and the size of the recovered Cu powder ranges from 0.1 - $0.5\mu\textrm{m}$. The chemical composition of the Cu powder mainly consists of $Cu_2$O and Cu and can be easily reduced to pure Cu powder.

• 한국표면공학회지
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• 제43권6호
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• pp.289-296
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• 2010

The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni substrate and affected the initial electroplating process by inducing surface reaction instead of mass transfer in the bulk solution. TU additives had its critical micelle concentration at 200 ppm in copper sulphate solution and showed abrupt change in morphological and electrochemical impedance spectroscopic results around this concentration, which could be related with the destruction of adsorption structure of TU-Cu(I) complex formed at the Ni substrate surface. By conducting a commercial electroplating simulation, when TU additives was included at cmc in the plating solution, it acted as a depolarizer for copper electrodeposition and was effective to reduce the unevenness of copper deposits between centre and edge region at high current densities of 10 ASD.

• Journal of Electrochemical Science and Technology
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• 제11권1호
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• pp.60-67
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• 2020

In this study, copper (II) oxide powder for electroplating was prepared by recovering CuCl₂ from NaClO₃ type etching wastes via recovered non-sintering two step chemical reaction. In case of alkali copper carbonate [mCuCo₃·nCu(OH)₂], first reaction product, CuCo₃ is produced more than Cu(OH)₂ when the reaction molar ratio of sodium carbonate is low, since m is larger than n. As the reaction molar ratio of sodium carbonate increased, m is larger than n and Cu(OH)₂ was produced more than CuCO₃. In the case of m has same values as n, the optimum reaction mole ratio was 1.44 at the reaction temperature of 80℃ based on the theoretical copper content of 57.5 wt. %. The optimum amount of sodium hydroxide was 120 g at 80℃ for production of copper (II) oxide prepared by using basic copper carbonate product of first reaction. At this time, the yield of copper (II) oxide was 96.6 wt.%. Also, the chloride ion concentration was 9.7 mg/L. The properties of produced copper (II) oxide such as mean particle size, dissolution time for sulfuric acid, and repose angle were 19.5 mm, 64 second, and 34.8°, respectively. As a result of the hole filling test, it was found that the copper oxide (II) prepared with 120 g of sodium hydroxide, the optimum amount of basic hydroxide for copper carbonate, has a hole filling of 11.0 mm, which satisfies the general hole filling management range of 15 mm or less.

• 한국진공학회지
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• 제9권3호
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• pp.267-272
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• 2000

electroplating(EP)법을 이용하여 ULSI용 Cu 박막을 제조하였다. seed Cu는 sputtering으로 증착하였으며, 확산방지막으로 TaN를 사용하였다. 제작된 EP Cu 박막은 seed Cu의 영향으로 열처리 조건에 관계없이 Cu(111)방향으로 강하게 우선 배향 하였다. 열처리 온도와 시간이 증가함에 따라 Cu박막의 미세조직이 non-columnar structure에서 약 2배 이상 결정립 성장하여 columnar structure로 바뀌었으며, 또한 as-deposit시 관찰되었던 stacking fault, twin, dislocation들이 상당히 줄어드는 것이 관찰되었다. Cu의 확산에 의하여 생기는 copper-silicide는 관찰할 수 없었으며, 이것은 두께 45nm의 TaN막이 $450^{\circ}C$, 30분 열처리시 확산방지막으로 충분한 역할을 한 것으로 판단된다. Cu(111)우선 배향과 열처리에 의한 결정립 성장 및 defect감소는 Cu 박막의 결정립계에서 발생하는 electromigration 현상을 상당히 줄일 수 있을 것으로 판단된다.

• Environmental Engineering Research
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• 제23권1호
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• pp.92-98
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• 2018

Suitability of aluminium-based water treatment sludge (WTS), a waste product from water treatment facilities, was assessed for removal of heavy metals from an electroplating wastewater which had high concentrations of copper and chromium along with other heavy metals. Batch tests with simulated wastewater in single- and multi-metal solutions indicated the influence of initial pH and WTS dose on removal of six metals namely Cu(II), Co(II), Cr(VI), Hg(II), Pb(II) and Zn(II). In general, removal of cationic metals such as Pb(II), Cu(II) and Zn(II) increased with increase in pH while that of anionic Cr(VI) showed a reduction with increased pH values. Tests with multi-metal solution showed that the influence of competition was more pronounced at lower WTS dosages. Column test with diluted (100 times) real electroplating wastewater showed complete removal of copper up to 100 bed volumes while chromium removal ranged between 78-92%. Other metals which were present in lower concentrations were also effectively removed. Mass balance for copper and chromium showed that the WTS media had Cu(II) and Cr(VI) sorption capacities of about 1.7 and 3.5 mg/g of dried sludge, respectively. The study thus indicates that WTS has the potential to be used as a filtration/adsorption medium for removal of metals from metal-bearing wastewaters.

• 대한기계학회논문집B
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• 제35권1호
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• pp.43-51
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• 2011

수평관 외부에서 발생하는 자연대류 열전달 현상을 실험적으로 연구하였다. 연구의 목적은 구리 도금계를 채택한 유사성실험방법론이 적용가능한지 확인하는 것과 수평관의 지름과 각도에 따라 달라지는 국부열전달을 시각화하는 것이었다. 구리의 전기도금계를 사용하면 양극에서 생성된 구리이온은 대류와 확산을 통하여 음극으로 이동되어 환원되는데 이는 열전달을 모사하게 된다. 구리와 색깔이 다른 알루미늄을 음극으로 채택함으로써 각도에 따라 환원되어 석출된 구리의 양을 시각화 할 수 있었다. 수평관의 직경은 0.01m에서 0.15m이었고 이는 $Ra_D\;=\;1.73{\times}10^7\;{\sim}\;5.69{\times}10^{11}$에 해당한다. 실험결과는 기존에 알려진 열전달 상관식과 일치하였다. 알루미늄 음극에 도금된 구리의 패턴은 Kitamura에 의해 액체결정온도측정법으로 시각화한 결과와 매우 잘 일치 하였다.

• 전기학회논문지
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• 제56권8호
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• pp.1436-1440
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• 2007

Beryllium copper has been known to be an important material for the various fields of industry because it can be used for mechanical and electrical/electronic components that are subjected to elevated temperatures (up to $400^{\circ}C$ for short times). Blade type tip for probing the cells of liquid crystal display(LCD) was fabricated using beryllium copper foil. The dry film resist was employed as a mask for patterning of the blade type tip. The beryllium copper foil was etched using hydrochloric acidic iron-chloride solution. The concentration, temperature, and composition ratio of hydrochloric acidic iron-chloride solution affect the etching characteristics of beryllium copper foil. Nickel with the thickness of $3{\mu}m$ was electroplated on the patterned copper beryllium foil for enhancing its hardness, followed by electroplating gold for increasing its electrical conductivity. Finally, the dry film resist on the bridge was removed and half of the nickel was etched to complete the blade type tip.