Journal of the Korean institute of surface engineering (한국표면공학회지)
- Volume 5 Issue 1
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- Pages.1-7
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- 1972
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Fabrication & Evaluation of electroplated Copper Foils for Printed Circuit Board Applications
인쇄 배선용 전해동박의 제조에 관한 연구
Abstract
Copper -clad laminate(CCL) was fabricated and evaluated by bonding 35
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