• Nuclear Engineering and Technology
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• 제53권10호
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• pp.3151-3157
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• 2021

Copper is an important structural material in various nuclear energy applications, therefore the correct knowledge of copper cross sections is crucial. The presented paper deals with a validation of different copper transport libraries by means of activation of selected samples. An intense ²⁵²Cf(sf) source with a reference neutron spectrum was used as a neutron source. After irradiation, the samples were measured using a high purity germanium detector and the dosimeter reaction rates were inferred. These experimental data were compared with MCNP6 calculations using CENDL-3.1, JENDL-4.0, ENDF/B-VII.1, ENDF/B-VIII.0, JEFF-3.2 and JEFF-3.3 evaluated Cu transport libraries. The experiment specifically focuses on ⁵⁸Ni(n,p)⁵⁸Co, ⁹³Nb(n,2n)^92mNb, ¹⁹⁷Au(n,g)¹⁹⁸Au and ⁵⁵Mn(n,g)⁵⁶Mn dosimetry reactions. Evaluated activation cross sections of these dosimetric reactions were taken from the IRDFF-II library. The best library performance depends on the energy region of interest.

• 한국표면공학회지
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• 제46권4호
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• pp.158-161
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• 2013

Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plating process for Via-Filling effectively forms interlayer connection in build-up PCBs with high-density interconnections. However, in the case of copper-via filled in a bath, which is greatly dependent on the effects of additives. This paper discusses effects of Cl ion on the filling of PCB vias with electrodeposited copper based on both electrochemical experiment and practical observation of cross sections of vias.

• 한국재료학회지
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• 제27권4호
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• pp.221-228
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• 2017

Various morphologies of copper oxide (CuO) have been considered to be of both fundamental and practical importance in the field of electronic materials. In this study, using Cu ($0.1{\mu}m$ and $7{\mu}m$) particles, flake-type CuO particles were grown via a wet oxidation method for 5min and 60min at $75^{\circ}C$. Using the prepared CuO, AlN, and silicone base as reagents, thermal interface material (TIM) compounds were synthesized using a high speed paste mixer. The properties of the thermal compounds prepared using the CuO particles were observed by thermal conductivity and breakdown voltage measurement. Most importantly, the volume of thermal compounds created using CuO particles grown from $0.1{\mu}m$ Cu particles increased by 192.5 % and 125 % depending on the growth time. The composition of CuO was confirmed by X-ray diffraction (XRD) analysis; cross sections of the grown CuO particles were observed using focused ion beam (FIB), field emission scanning electron microscopy (FE-SEM), and energy dispersive analysis by X-ray (EDAX). In addition, the thermal compound dispersion of the Cu and Al elements were observed by X-ray elemental mapping.

• Journal of Radiation Protection and Research
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• 제26권3호
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• pp.327-331
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• 2001

The Pohang Neutron Facility based on an electron linac was constructed in order to construct the infrastructure for nuclear data production in Korea. It consists of a 100-MeV electron linac, a water-cooled Ta target, and an 11-m time-of-flight path. We measured the time-of-flight path length, the neutron energy spectra for different water levels inside the moderator, and the neutron total cross sections of polyethylene and copper by the transmission method.

• 대한기계학회논문집A
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• 제34권3호
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• pp.341-346
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• 2010

이종 접합재($\beta-Si_3N_4/S45C$)의 굽힘강도와 인장강도에 미치는 시험편 형상의 영향을 정량적으로 평가하였다. 평균 굽힘강도와 평균 인장강도는 원형단면 시험편이 4각형 단면 시험편보다 약간 높았다. 또한, 초음파(AE)를 이용하여 균열발생응력을 성공적으로 측정할 수 있었으며, 균열발생응력은 굽힘강도의 60~80% 이었다. 아울러, 세라믹측 접합계면 근처의 잔류응력 측정을 굽힘강도 시험전에 X선 회절법에 의해 실시하였으며, 굽힘강도와 균열발생응력은 잔류응력 증가와 더불어 감소하였다. 마지막으로 인장시험에서 굽힘변형률 성분의 영향을 평가하였으며, 인장강도는 굽힘변형률 성분의 증가와 더불어 감소하고 굽힘강도의 약 80%에 해당되었다.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

• Journal of Welding and Joining
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• 제33권3호
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• pp.47-53
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• 2015

By the trends of electronic package to be more integrative, the fine Cu trace pitch of organic PCB is required to be a robust design. In this study, the short circuit failure mechanism of PCB with a Cl element under the Temperature humidity bias test ($85^{\circ}C$/85%RH/3.5V) was examined by micro-structural study. A focused ion beam (FIB) and an electron probe micro analysis (EPMA) were used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $CuCl_x$ were formed and grown on Cu trace during the $170^{\circ}C$/3hrs and that $CuCl_x$ was decomposed into Cu dendrite and $Cl_2$ gas during the $85^{\circ}C$/85%RH/3.5V. It is suggested that Cu dendrites formed on Cu trace lead to a short circuit failure between a pair of Cu traces.

• International Journal of Precision Engineering and Manufacturing
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• 제9권2호
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• pp.75-80
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• 2008

The fabrication of complex three-dimensional electrodes for micro electrical discharge machining (micro-EDM) is an important issue in the field of micromachining Localized electrochemical deposition (LECD) is a simple and inexpensive technique for fabricating micro-EDM electrodes. This study presents a new process for manufacturing electrodes with complex cross-sections using masks of different shapes, In this process, a non-conductive mask is placed between an anode and cathode that are immersed in a plating solution of acidified copper sulfate. The LECD is achieved by applying a pulsed voltage between the anode and cathode, which are separated by a small distance. In this setup, the cathode is placed above the anode and the mask, so that the deposited electrode can be used directly for EDM without changing the tool orientation. We found that the microstructure of the deposited electrode is influenced by the concentration of the plating solution and organic additives. Moreover, the values of the voltage, frequency, and duty cycle of the pulsed input have significant effects on the microstructure of the fabricated electrode. Finally, the optimum values of the voltage, frequency, and duty cycle were determined for the most effective fabrication of complex-shaped electrodes.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.43-49
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• 2015

전자 제품의 경박 단소화 및 고집적화가 이루어 지면서 반도체 칩뿐만 아니라 유기 기판도 고집적화가 요구되고 있다. 본 연구는 인쇄회로기판의 미세 피치 회로에 대한 고온고습 전압인가 시험을 실시하여 불량 메커니즘을 연구하였다. $130^{\circ}C/85%RH/3.3V$와 $135^{\circ}C/90%RH/3.3V$ 시험조건에서 고온고습 전압시험(Biased HAST)의 가속 계수는 2.079로 계산되었다. 불량 메커니즘 분석을 위하여 집속이온빔(FIB) 분석이 이용되었다. (+)전극에서는 콜로이드 형태의 $Cu_xO$와 $Cu(OH)_2$가 형성되었으며, (-)전극에서는 수지형태의 Cu가 관찰되었다. 이를 통해 $Cu^{2+}$ 이온과 전자($e^-$)가 결합한 수지상 Cu에 의해 절연파괴가 일어난다는 것을 확인하였다.

• 설비공학논문집
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• 제29권8호
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• pp.408-418
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• 2017

Supercritical carbon dioxide ($sCO_2$) power system is emerging technology because of its high cycle efficiency and compactness. Meanwhile, PCHE (Printed Circuit Heat Exchanger) is gaining attention in $sCO_2$ power system technology because PCHE with high pressure-resistance and larger heat transfer surface per unit volume is fundamentally needed. Thermo-fluidic characteristics of $sCO_2$ in the micro channel of PCHE should be investigated. In this study, heat transfer characteristics of $sCO_2$ of various inlet conditions and cross-sectional shapes of single micro channel were investigated experimentally. Experiment was conducted at supercritical state of higher than critical temperature and pressure. Test sections were made of copper and hydraulic diameter was 1 mm. Convective heat transfer coefficients were measured according to each interval of the channel and pressure drop was also measured. Convective heat transfer coefficients from experimental data were compared with existing correlation. In this study, using measured data, a new empirical correlation to predict near critical region heat transfer coefficient is developed and suggested. Test results of single channel will be used for design of PCHE.