• Journal of Welding and Joining
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• v.29 no.1
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• pp.46-51
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• 2011

TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the driving failure may be TSV interconnects. In this study, the thermomechanical reliability of TSV technology is investigated using finite element method. Thermal stress and thermal fatigue phenomenon caused by repetitive temperature cycling are analyzed, and possible failure locations are discussed. In particular, the effects of via size, via pitch and bonding pad on thermo-mechanical reliability are investigated. The plastic strain generally increases with via size increases. Therefore, expected thermal fatigue life also increase as the via size decreases. However, the small via shows the higher von Mises stress. This means that smaller vias are not always safe despite their longer life expectancy. Therefore careful design consideration of via size and pitch is required for reliability improvement. Also the bonding pad design is important for enhancing the reliability of TSV structure.

• Progress in Superconductivity and Cryogenics
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• v.6 no.4
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• pp.17-21
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• 2004

The butt joint was verified to satisfy the thermal stability of the ITER magnet system through the ITER CS model coil test. Since the contact area in the butt joint is limited to the cross section of the cable, it is necessary to analyze and control the joining parameters precisely for improving the DC resistance. It is difficult to simulate the cables, which are composed of a lot of strands, as three-dimensional models using the commercial code. The random numbers were used to simulate many kinds of contact patterns of the strands on the bonding surface for calculating the bonding area and the DC resistance of the butt joint. The calculated DC resistance decreases with an increase of cable filling factor in terminal. The calculated DC resistance of a 0.9 cable filling factor is about 0.48 n-Ohm, which is about one-tenth of that in the CS model coil test when not considering the electrical contact resistance. From this difference, the electrical contact resistance between the strands and copper sheet was calculated.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• The Journal of the Acoustical Society of Korea
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• v.33 no.2
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• pp.102-110
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• 2014

The effect of a bonding layer on the performance of a quarter-wave (${\lambda}/4$) mode PVDF ultrasound transducer having not only a piezoelectric layer but also a non-piezoelectric layer between two electrodes was analyzed. The equivalent circuit of a transmission line model by Kikuchi et al.[Sound of IEICE, 55-A, 331-338 (1981)] was introduced for the analysis. The validity of the model was confirmed by comparison with a KLM model for three postulated adhesion cases of a $80{\mu}m$ thick piezoelectric PVDF film to a copper (Cu) backer. The pulse-echo responses of five PVDF transducers, each fabricated with a different thickness ($5{\mu}m{\sim}20{\mu}m$) of the bonding layer, were measured and the results were compared with those by simulation. The two results were in good agreement with each other and it was noted that the effect of the bonding layer on the performance of the transducer could be analyzed by the Kikuchi model. In detail, the $20{\mu}m$ bonding layer decreased the center frequency and the bandwidth by about 19.7 % and 25.0 %, respectively, and increased the insertion loss by 57.2 %.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.75-81
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• 2018

The effect of $Ar-N_2$ plasma treatment on Cu surface as one of solutions to realize reliable Cu-Cu wafer bonding was investigated. Structural characteristic of $Ar-N_2$ plasma treated Cu surface were analyzed using X-ray diffraction, X-ray photoelectron spectroscopy, atomic force microscope. Ar gas was used for a plasma ignition and to activate Cu surface by ion bombardment, and $N_2$ gas was used to protect the Cu surface from contamination such as -O or -OH by forming a passivation layer. The Cu specimen under high Ar partial pressure plasma treatment showed more copper oxide due to the activation on Cu surface, while Cu surface after high $N_2$ gas partial pressure plasma treatment showed less copper oxide due to the formation of Cu-N or Cu-O-N passivation layer. It was confirmed that nitrogen plasma can prohibit Cu-O formation on Cu surface, but nitrogen partial pressure in the $Ar-N_2$ plasma should be optimized for the formation of nitrogen passivation layer on the entire surface of Cu wafer.

• Korean Journal of Crystallography
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• v.11 no.2
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• pp.75-79
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• 2000

The complex [Cu(L)(H2O)2] (PDC)(1)(L=2,5,9,12-tetramethyl-1,4,8,11- tetraazacyclotetradecane;PDC=1,4-pyridinedicarboxylate) has been synthesized and characterized by X-ray crys-tallography. The compound 1 crystallizes in the triclinic space group P1, with a=7.553(1)Å, b=9.619(2)Å, c=10.692(2)Å, α=74.22(1)°, β=73.32(1)°, γ=78.70(1)°, V=710.1(2)Å3, Z=1,R1(wR2) for 2634 observed reflections of [I>2σ(I)] was 0.0854(0.2242). The compound 1 is interconnected to give a three-dimensional network through weak hydrogen-bonding interactions.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.4
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• pp.235-240
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• 2017

The effect of particle sizes on the aerosol deposition (AD) of Cu films is investigated in order to understand the deposition behaviors of metal powder during the AD process. The Cu coatings fabricated by using $2{\mu}m$ Cu powders had a dense microstructure, a high deposition rate ($1.6{\pm}0.2{\mu}m/min$), and low resistance ($9.42{\pm}0.4{\mu}{\Omega}{\cdot}cm$) compared to that from using Cu powder with a particle size greater than $5{\mu}m$. Also, from estimating the internal micro-strain of Cu films, the Cu coatings fabricated by using $2{\mu}m$ Cu particles exhibited a high micro-strain value of $3.307{\times}10^{-3}$. On the other hand, the strain of Cu coatings fabricated with $5{\mu}m$ particles was decreased to $2.76{\times}10^{-3}$. These results seem to show that the impacted Cu particles are compressed and flattened by shock waves, and that their bonding is associated with the high internal micro-strain caused by plastic deformation.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.5
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• pp.458-461
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• 2004

In order to improve the adhesion properties of copper, MPS(3-mercaptopropyltrimethoxysilane) organic film were employed. The plasma pretreatment in pure He or $He/O_{2}$ mixed gas environment greatly increased adhesion force. Adhesion force was measured by scratch test with nano indenter. Microstructures and surface roughness were observed with scanning electron microscope(SEM). The characteristics of MPS layer for pretreatment were studied with flourier transform infrared spectroscope(FT-IR) and contact angle tester. The heighest adhesion was achieved in the specimen pretreated with mixed plasma and NPS coating, which was 56mN. Other specimen showed lower value by $20{\%}$ to $30{\%}$. The roughness of substrate was not affected by the bonding strength of copper plating.

• Journal of Powder Materials
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• v.26 no.3
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• pp.220-224
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• 2019

The aluminum (Al)/copper oxide (CuO) complex is known as the most promising material for thermite reactions, releasing a high heat and pressure through ignition or thermal heating. To improve the reaction rate and wettability for handling safety, nanosized primary particles are applied on Al/CuO composite for energetic materials in explosives or propellants. Herein, graphene oxide (GO) is adopted for the Al/CuO composites as the functional supporting materials, preventing a phase-separation between solvent and composites, leading to a significantly enhanced reactivity. The characterizations of Al/CuO decorated on GO(Al/CuO/GO) are performed through scanning electron microscopy, transmission electron microscopy, and energy dispersive X-ray spectroscopy mapping analysis. Moreover, the functional bridging between Al/CuO and GO is suggested by identifying the chemical bonding with GO in X-ray photoelectron spectroscopy analysis. The reactivity of Al/CuO/GO composites is evaluated by comparing the maximum pressure and rate of the pressure increase of Al/CuO and Al/CuO/GO. The composites with a specific concentration of GO (10 wt%) demonstrate a well-dispersed mixture in hexane solution without phase separation.

• Journal of Sensor Science and Technology
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• v.30 no.2
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• pp.88-93
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• 2021

In this paper, a folding sensor based on capacitance is proposed. The sensor was developed to sense the length and angle data for the milli-scale actuators without causing any interference to the actuating joints. For the sensing and testing the robotic joint with reducing the cost and complexity aspects of manufacturing, a simple composition was adopted. The sensor comprises a pair of copper tapes, papers, and wires. The complete sensing unit is constructed by bonding the tapes with the papers and soldering the wire to the copper parts. For accuracy, a teensy 4.0 board, which has a 12-bit ADC resolution, is employed. Furthermore, the sensed analog data is not translated into the unit of capacitance for accuracy; however, it is filtered using a low-pass filter and subsequently, a Butter-worth filter. The data obtained demonstrate a periodic waveform, which implies that the data are in good agreement with the hypothesis set prior to the experiments. Compared to other milli-scale sensors, this could be a better option for sensing the length and angle data for milliscale actuators.