• Structural Engineering and Mechanics
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• 제52권5호
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• pp.957-969
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• 2014

Among severe plastic deformation methods, groove pressing is one of the prominent techniques for producing ultra-fine grained sheet materials. This process consists of imposing repetitive severe plastic deformation on the plate or sheet metals through alternate pressing. In the current study, a 2 mm pure Cu sheet has been subjected to repetitive shear deformation up to two passes. Hardness and tensile yield and ultimate stress were obtained after groove pressing. Fracture toughness tests have been performed and compared for three conditions of sheet material namely as received (initial annealed state), after one and two passes of groove pressing. Results of experiments indicate that a decrease in the values of fracture toughness attains as the number of constrained groove pressing (CGP) passes increase.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.165-166
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• 2010

• 소성∙가공
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• 제20권5호
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• pp.357-361
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• 2011

A beryllium copper alloy(C1720) sheet was stretch-drawn using different processes. A hemispherical punch was first used and the forming behavior was examined. Then, cylindrical cups with a hemispherical head were produced by either one-step drawing or two-step forming(sequential stretch forming-drawing). The one-step drawing showed the better formability than two-step forming. However, the two-step forming was the superior process in terms of attaining shape accuracy.

• 한국재료학회지
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• 제22권11호
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• pp.581-586
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• 2012

The microstructure and mechanical properties of a copper alloy sheet processed by differential speed rolling (DSR) were investigated in detail. A copper alloy with thickness of 3 mm was rolled to a 50% reduction at ambient temperature without lubrication and with a differential speed ratio of 2.0:1. For comparison, conventional rolling (CR), in which the rolling speeds of the upper and lower rolls is 2.0 m/min, was also performed under the same rolling conditions. The shear strain of the sample processed by CR showed positive values at the positions of the upper roll side and negative values at the positions of the lower roll side. On the other hand, the sample processed by the DSR showed zero or positive shear strain values at all positions. However, the microstructure and mechanical properties of the as-rolled copper alloys did not show such significant differences between the CR and the DSR. The samples rolled by the CR and the DSR exhibited a typical deformation structure. In addition, the DSR processed samples showed a typical rolling texture in which {112}<111>, {011}<211> and {123}<634> components were developed at all positions. Therefore, it is concluded that the DSR was very effective for the introduction of a uniform microstructure throughout the thickness of the copper alloy.

• 한국산학기술학회논문지
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• 제22권5호
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• pp.530-536
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• 2021

본 논문에서는 전자기기 등에서 전자파 차폐 및 방열소재로 많이 채택되는 동 메쉬 시트와 천연그라파이트 시트를 감압 접착제없이 합지시켜 개발된 차폐 및 방열의 기능을 동시에 가지는 하이브리드시트의 성능 측정결과를 제시하였다. 객관적인 방열 성능을 확인하기 위해 2개의 다른 제품들과 수직 및 수평 열전도도를 각각 측정하여 결과를 비교하였으며, 전자파 차폐 성능은 CISPR 11규격에 따른 복사방출시험을 3m 전자파 무향실에서 진행하여 확인하였다. 수직 열전도도의 경우 제안된 하이브리드 시트가 방열코팅이 된 알루미늄 시트 대비 약 8.63배, 감압 접착제로 인조 그라파이트를 합지시킨 구리 시트에 비해 18.7배 높은 수준이였으며, 수평 열전도도는 인조 그라파이트를 합지시킨 구리 시트에 비해 약 0.64배, 방열 코팅된 알루미늄 시트에 대해서는 약 1.76배로 나타났다. 동일한 열원에서 각 시트들을 적용 후 측정한 결과에서는 제안된 하이브리드 시트가 열방출 기능이 가장 우수하였고 복사방출시험에서는 방사노이즈들이 상당 부분 제거되는 결과를 얻었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.2067_2068
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, $Cu_6Sn_5({\mu})$ and $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface. $Cu_6Sn_5({\mu})$ intermetallics layer gradually changed $Cu_3Sn({\varepsilon})$. Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• 전기학회논문지
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• 제58권8호
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• pp.1559-1565
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(${\mu}$) and Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(${\mu}$) intermetallics layer gradually changed Cu3Sn(${\varepsilon}$). Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• 마이크로전자및패키징학회지
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• 제6권3호
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• pp.45-50
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• 1999

동(CU)은 전기전자부품에 널리 사용되어 왔는데, 특히 점 저항용접된 동은 콘덴서나 저항의 리드부분에 사용되고 있다. 그러나 일반적으로 동은 전기 저항이 낮아 저항용접이 어렵다. 본 연구에서는 동의 점 용접성을 개선하기 위하여, 상대적으로 전기 저항이 높은 Sn-37%Pb 솔더를 동 표면에 도금하였다. 실험변수로, 가 압력은 100kgf에서 200kgf, 용접시간은 20ms에서 50ms, 용접전류는 100A에서 2500A까지 변화시켰다. 실험결과, 솔더 도금된 동박판은 용접전류 400~2200A, 가압력 100~200kgf, 용접시간 20~50ms범위에서 저항용접이 가능하였다. 점 용접부의 인장전단 강도는 임계 전류값까지는 용접전류가 증가함에 따라 증가하고, 임계 전류값 이후부터는 용접전류에 따라 인장전단 강도가 감소하였다.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2007년도 춘계학술논문 발표대회
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• pp.5-8
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• 2007

Selection of proper root barrier as destination part of greening is very important in Root penetration resistance plan. To select proper root barrier, it need to understand composition of greening part, size, kind of plant, connection with waterproofing layer. In this point of view, we have establish greening on the roof or concrete structure, not been understand the structural mechanism. It means that we misunderstood about purpose of greening and using it. So, chosen materials and construction method was not proper for greening, it caused water leakage and decrease performance of concrete structure. Therefore, we examine the practical use of copper sheet considering environmental condition for green roof. Watertightness by water of greening part, root penetration resistance test by root penetration, bacteria resistance by must or bacteria in soil, chemical resistance by rain and chemical agent of fertilizer, and load resistance by soil depth, sire of plant. These suggested test methods could be referred as guideline to test in green roof system because of not exist any performance appraisal guideline or standard. Consequently, it should be analysis as technical and institutional subdividing test methods and it need to study constantly as varied angles.

• 한국군사과학기술학회지
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• 제6권3호
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• pp.44-53
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• 2003

Cu/C films were prepared at room temperature under $Cu(hfac)_2-Ar-H_2$ atmosphere in order to obtain metallized polymer by using ECR-MOCVD(Electron Cyclotron Resonance Metal Organic Chemical Vapor Deposition) coupled with a DC bias system. The room temperature MOCVD on polymer substrate could be possible by collaboration of ECR and a DC bias. Structural analysis of the films by ECR was found that fine copper grains embedded in an amorphous polymer matrix with indistinctive interfacial layer. The increase in $H_2$ contents brought on copper-rich film formation with low electric resistance. On the other hand carbon-rich films with low sheet electric resistance were prepared in argon atmosphere. The electric sheet resistance of Cu/C films with good interfacial property were controlled at $10^8$~$10^0$ Ohm/sq. ranges by the $H_2$/Ar mole ratio and the shielding effectiveness of the film showed maximum up to 45dB in the our experimental range.