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Characteristics of copper/C films on PET substrate prepared by ECR-MOCVD at room temperature  

Lee, Joong-Kee (한국과학기술연구원)
Jeon, Bup-Ju (한국과학기술연구원)
Hyun, Jin (고려대학교)
Byun, Dong-Jin (고려대학교)
Publication Information
Journal of the Korea Institute of Military Science and Technology / v.6, no.3, 2003 , pp. 44-53 More about this Journal
Abstract
Cu/C films were prepared at room temperature under $Cu(hfac)_2-Ar-H_2$ atmosphere in order to obtain metallized polymer by using ECR-MOCVD(Electron Cyclotron Resonance Metal Organic Chemical Vapor Deposition) coupled with a DC bias system. The room temperature MOCVD on polymer substrate could be possible by collaboration of ECR and a DC bias. Structural analysis of the films by ECR was found that fine copper grains embedded in an amorphous polymer matrix with indistinctive interfacial layer. The increase in $H_2$ contents brought on copper-rich film formation with low electric resistance. On the other hand carbon-rich films with low sheet electric resistance were prepared in argon atmosphere. The electric sheet resistance of Cu/C films with good interfacial property were controlled at $10^8$~$10^0$ Ohm/sq. ranges by the $H_2$/Ar mole ratio and the shielding effectiveness of the film showed maximum up to 45dB in the our experimental range.
Keywords
ECR; MOCVD; DC bias; Electric Sheet Resistance; Shielding effectiveness;
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  • Reference
1 Kupfer, H., Wolf, G.K., 'Plasma and ion beam assisted metallization of polymers and their application', Nucl. Instr. and Meth. in Phys. Res. B116-167, 2000. pp.722-731
2 정연춘, '전자파장해 대책 부품의 종류와 특성', 한국통신학회지, 13, NO.1, 1996. pp.63-80
3 Pomposo, J.A., Rodriguez, J., and Grande, H., 'Polypyrrole-based conducting hot melt adhesives for EMI shielding applications', Synthetic c, 104, 1999. pp.107 -111
4 Kunilin, Z., Weimin, C., Yong, Z., and Weimin, L., 'Structure and tribological properties of plasma-polymerized nickel carbonyl films', Thin Solid Films, 303, 1997. pp.89-93
5 Yasufuku, S., 'Technical progress of EMI shielding materials in Japan', IEEE electrical insulation magazine, 6, NO.6, 1990. pp.21-30
6 Richard B. Schulz, V. C. Plantz, and D. R. Brush, 'Shielding theory and practice', IEEEE transactions on electromagnetic compatibility, 30, NO.3, 1988, pp.187-201
7 Olivero, D.A, Radford, D.W., 'Multiple percolation approach to EMI shielding composites incorporating conductive fillers', Journal of Reinforced Plastics and Composites 17, 1999. pp.674-690
8 하남규, '전도성 고분자를 이용한 전자파 차폐효과 연구', 석사학위논문, 고려 대학교, 2000. pp.1-2
9 Yoon, S. F., Tan, K. H., Zhang, Q., Rusli, M., Ahn, J., and Valeri, L., 'Effect of microwave power on the electron energy in an electron cyclotron resonance plasma', Vacuum, 61, 2001, pp.29-35
10 Kupfer, H., Hect, G. and Ostwald, R., 'Ecologically important metallization processes for high-performance polymers', Surface and coatings Technology, 112, 1999. pp.379-383