• Korean Journal of Materials Research
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• v.34 no.3
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• pp.163-169
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• 2024

As the limitations of Moore's Law become evident, there has been growing interest in advanced packaging technologies. Among various 3D packaging techniques, Cu-SiO₂ hybrid bonding has gained attention in heterogeneous devices. However, certain issues, such as its high-temperature processing conditions and copper oxidation, can affect electrical properties and mechanical reliability. Therefore, we studied depositing only a heterometal on top of the Cu in Cu-SiO₂ composite substrates to prevent copper surface oxidation and to lower bonding process temperature. The heterometal needs to be deposited as an ultra-thin layer of less than 10 nm, for copper diffusion. We established the process conditions for depositing a Co film using a Co(EtCp)₂ precursor and utilizing plasma-enhanced atomic layer deposition (PEALD), which allows for precise atomic level thickness control. In addition, we attempted to use a growth inhibitor by growing a self-assembled monolayer (SAM) material, octadecyltrichlorosilane (ODTS), on a SiO₂ substrate to selectively suppress the growth of Co film. We compared the growth behavior of the Co film under various PEALD process conditions and examined their selectivity based on the ODTS growth time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.67-68
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• 2012

• Bulletin of the Korean Chemical Society
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• v.32 no.4
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• pp.1129-1130
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• 2011

• Korean Journal of Materials Research
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• v.11 no.7
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• pp.569-574
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• 2001

The crystal structure, surface morphology and preferred orientation of the copper electrodeposit were investigated by the using sulfate bath with $SiO_2$suspensions and the cathode substrate Au sputtered. As by the addition of colloidal silica in copper electrolytic bath and Au pre-coating on substrate, the crystal particles of deposits was fined-down, made uniform and the account of particles were increased. Hardness of copper electrodeposits with colloidal silica increased about 15% in comparison with that of pure copper deposit film and (111), (200) and (311) plane of X-ray diffraction patterns were almost swept away, so preferred orientation of the copper deposits changed from (111) to (110) plane by codeposit $SiO_2$ and precoating the substrate.

• Journal of the Korean Electrochemical Society
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• v.2 no.4
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• pp.237-241
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• 1999

The characteristics of copper thin films and via hole filling capability were investigated by pulsed electrodeposition method. Especially, the effects of additives on the properties of copper thin films were studied. Copper films, which were deposited by pulsed electrodeposition using commercial additives, had low tensile stress value under 83.4 MPa and high preferred Cu (111) texture. Via holes with $0.25{\mu}m$ in diameter and 6 : 1 aspect ratio were successfully filled without any defects by superfilling. It was observed that copper microstructure deformed by twining. After heat treatment at $500^{\circ}C$ for 1 k in vacuum furnace, grain size was 1 or 2 times as large as film thickness and the bamboo structure was formed. Heat treated copper films showed good resistivities of $1.8\~2.0{\mu}{\Omega}{\cdot}cm$.

• Korean Journal of Materials Research
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• v.17 no.1
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• pp.56-59
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• 2007

Recently, requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. In this study, we evaluated the surface morphology, crystal phase ana surface roughness of the copper film electrodeposited by pulse method without using additives. Homogeneous and dense copper crystals were formed on the titanium substrate, and the optimum condition was 25% duty cycle. Moreover, the surface roughness(Ra), $0.295{\mu}m$, is the smallest value in this condition. It is thought that this copper foil is good for electromigration inhibition due to the preferential crystal growth of Cu (111)

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.10
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• pp.108-113
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• 1994

The characteristics of the oxidation prevention layers for the copper metallization were investigated. The thin films such as Cr, TiN and Al were used as the oxidation prevention layers for copper. Ultra thin aluminum films were found to prevent the oxidation of copper up to the highest oxidation annealing temperature among the barrier layers examined in this study. It was found that oxygen did not diffuse into copper through aluminum films because of the aluminum oxide layer formed on the aluminum surface and the ultra thin aluminum film could be a good oxidation barrier layer for the copper metallization.

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2006.06a
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• pp.283-284
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• 2006

The ship performs heat exchange using seawater to keep main engine and auxiliary machinery at optimum temperature. In heat exchanger, refrigerant located outside of copper tube is cooled by seawater flowing through inside of copper tube. On the other hand, seawater erosion and corrosion nay occasionally cause the corrosion of the copper tube in A/C(Air Conditioner) condenser. This corrosion of copper tube makes seawater and refrigerant mixed, seriously damaging A/C system. In this study, accordingly, the exact ive mechanism of the corrosion on the condenser entailing serious problems occasional is investigated through the electrochemical polarization experiments on the condenser's component materials. According to the experiments, the corrosive procedures on the copper tube was verified by the fact that passive film of the copper tube surface which is destroyed by the pressure of sucked seawater, is damaged by the corrosive ingredients in the seawater.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.228-231
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• 1995

Phthalocyanine have a good sensitivity to the toxic gases like NO$_2$. Also its properties of good chemical and thermal suability give a potential to superiors gas sensing system. Depositioni of Octa(2-ethyhexyloxy) Copper Phthalocyanine is confirmed by transfers ratio, UB/visible spectra and current-voltage (I-V) characteristics.

• Imaging Science in Dentistry
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• v.31 no.3
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• pp.129-133
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• 2001

Purpose: To compare the copper equivalent values measured at premolar and molar areas in the copper equivalent images of panoramic and intraoral radiographs and to evaluate the possibility of the copper equivalent images of panorama for the assessment the bone density. Materials and Methods : Intraoral radiograms at mandibular premolar and molar area and panoramas of 6 human dry skulls were taken with copper-step wedge by Heliodent MD (Siemens Co., Germany) and by Planmeca (PM 2002 CC, Planmeca, Helsinki, Finland) were used for experiment. The copper equivalent values measured at premolar and molar areas in the copper equivalent im ages of panorama and intraoral film were compared. Results: The copper equivalent values were ranged 0.20 mmCu-0.44 mmCu at the molar areas, 0.05 mmCu-0.31 mmCu at the premolar areas on panoramic images. There were no significant differences (p>0.5) between the copper equivalent values on intraoral images and those on panoramic images measured at premolar areas and molar areas respectively. The correlation coefficient between the copper equivalent values on intraoral images and those on panoramic images was respectively 0.8495 at molar areas and 0.6184 at premolar areas. Conclusions : The copper equivalent images of panorama for the assessment the bone density appeared to be significant at molar area compared with the one of intraoral radiograph.