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http://dx.doi.org/10.3740/MRSK.2007.17.1.056

Effect of Pulse and Pulse-Reverse Current on Surface Morphology and Resistivity of Electrodeposited Copper  

Woo, Tae-Gyu (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University)
Park, Il-Song (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University)
Seol, Kyeong-Won (Division of Advanced Materials Engineering and Research Center of Industrial Technology, Chonbuk National University)
Publication Information
Korean Journal of Materials Research / v.17, no.1, 2007 , pp. 56-59 More about this Journal
Abstract
Recently, requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. In this study, we evaluated the surface morphology, crystal phase ana surface roughness of the copper film electrodeposited by pulse method without using additives. Homogeneous and dense copper crystals were formed on the titanium substrate, and the optimum condition was 25% duty cycle. Moreover, the surface roughness(Ra), $0.295{\mu}m$, is the smallest value in this condition. It is thought that this copper foil is good for electromigration inhibition due to the preferential crystal growth of Cu (111)
Keywords
Electrodeposition; Copper foil; Pulse mode; Pulse-Revers current mode;
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1 V. S. Donepudi, R. Venkatachalapathy, P. O. Ozernoyah, C.S. Johnson and J. Prakash, Electrochem. Solid-State. Lett., C13, 4 (2001)   DOI   ScienceOn
2 A. Kudelski, M. Janik-Czachor, J. Bukowska, M. Dolata and A. Szurnrner, J. Mol. Struct., 483, 245 (1999)   DOI   ScienceOn
3 N. Ikemiya, S. Miyaoko and S. Hara, Surf. Sci., 327, 261 (1995)   DOI   ScienceOn
4 D. S. Lashmore, L. H Bennett, H. E. Schone, P. Gustafson and R.E. Watson, Phys Rev. Lett., 48, 1760 (1982)   DOI
5 C. C. Hu and C. M. Wu, Surf. Coat. Technol., 176, 75 (2003)   DOI   ScienceOn
6 C. M. Whelan, M. R. Smyth and C. J. Barnes, J. Electroanal. Chem., 441, 109 (1998)   DOI   ScienceOn
7 A. I. Danilov, J. E. T. Andersen, E. B. Molodkina, Yu. M. Polukarov, P. Moller and J. Ulstrup., Electrochim. Acta, 43, 733 (1997)   DOI   ScienceOn
8 S. C. Chang, J. M. Shieh, K. C. Lin, B. T. Dai, T. C. Wang, C. F. Chen and M. S. Feng, J. Vac. Sci. Technol., B, 19(3), 767 (2001)   DOI   ScienceOn
9 N. Ibl, J. Cl. Puippe and H. F. Angerer, Surf. Technol., 6, 287 (1978)   DOI   ScienceOn
10 B. S. Min, W. S. Chung and I. G. Kim, J. Kor. Inst. Met. & Mater., 40, 1281 (2002)
11 W. Paatsch, Metallobrflache, 41, 39 (1987)
12 E. Budevski, G. Staikov and W. J. Lorenz, Electrochemical Phase Formation and Growth, VCH, 273 (1996)
13 R. T. C. Choo, J. M. Toguri, M. El-sherik and U. Erb, J. Appl. Electrochem., 25, 384 (1994)
14 H. S. Lee, H. S. Kim and C. M. Lee, J. Kor. Inst. Met. & Mater., 39, 920 (2001)
15 Y. K. Lee and T. J. O'keefe, JOM, April, 40 (2002)
16 O. Chene, G. Staikov and D. Landolt, Oberflache/Surface, 26, 45 (1985)