• Korean Journal of Materials Research
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• v.20 no.10
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• pp.555-558
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• 2010

This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/$cm^2$. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/$cm^2$. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/$cm^2$ considering the productivity and mechanical properties of copper foil.

• Korean Journal of Materials Research
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• v.28 no.9
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• pp.516-521
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• 2018

Copper oxide thin films are deposited using an ultrasonic-assisted spray pyrolysis deposition (SPD) system. To investigate the effect of substrate temperature and incorporation of a chelating agent on the growth of copper oxide thin films, the structural and optical properites of the copper oxide thin films are analyzed by X-ray diffraction (XRD), field-emssion scanning electron microscopy (FE-SEM), and UV-Vis spectrophotometry. At a temperature of less than $350^{\circ}C$, three-dimensional structures consisting of cube-shaped $Cu_2O$ are formed, while spherical small particles of the CuO phase are formed at a temperature higher than $400^{\circ}C$ due to a Volmer-Weber growth mode on the silicon substrate. As a chelating agent was added to the source solutions, two-dimensional $Cu_2O$ thin films are preferentially deposited at a temperature less than $300^{\circ}C$, and the CuO thin film is formed even at a temperature less than $350^{\circ}C$. Therefore the structure and crystalline phase of the copper oxide is shown to be controllable.

• Journal of the Korean institute of surface engineering
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• v.39 no.5
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• pp.215-222
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• 2006

The passivity behavior of copper anode containing impurities in copper sulfate solution for electrorefining process was studied at several different levels of impurities such as As, Sb, Bi and Pb. The passivity behavior was investigated by electrochemical techniques (galvanostatic, potentiodynamic and cyclic voltammetry tests) and surface analysis (optical microscopy, electron probe microanalysis, scanning electron microscopy). The results were that arsenic, antimony inhibited passivation and bismuth accelerated it and lead containing anode showed different passivity behavior from above anodes. The improved passivity characteristics could be explained by decrease in oxygen content in passivity film which resulted from a reaction among the impurities, oxygen and copper in the anode. The SEM image revealed that arsenic or antimony containing anode exhibited a porous passivity film and bismuth containing anode showed the compact passivity film and lead containing anode had loose passivity film on anode.

• Korean Journal of Materials Research
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• v.17 no.5
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• pp.283-288
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• 2007

This study aimed to investigate the effects of the seed layer with copper electroplating on the surface morphology of copper foil. Three kinds of seed metal such as platinum, palladium, Pt-Pd alloy were used in this study. Electrodeposition was carried out with the constant current density of 200 $mA/cm^2$ for 68 seconds. Electrochemical experiments, in conjunction with SEM, XRD, AFM and four-point probe, were performed to characterize the morphology and mechanical characteristics of copper foil. Large particles were observed on the surface of the copper deposition layer when a copper foil was electroplated on the 130 nm thickness of Pd, Pt-Pd seed layer. However, a homogeneous surface, low resistivity was obtained when the 260 nm thickness of Pt, Pt-Pd alloy seed layer was used. The minimum value of resistivity was 2.216 ${\mu}{\Omega}-cm$ at the 260 nm thickness of Pt-Pd seed layer.

• Journal of the Korean institute of surface engineering
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• v.54 no.3
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• pp.124-132
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• 2021

Graphene which grown on the cobalt or nickel sputtered copper foil depending on the annealing time was studied. Graphene on the copper foil grown by chemical vapor deposition was compared to those on cobalt or nickel sputtered copper foil by using a RF (Radio Frequency) magnetron sputtering at room temperature. FLG(few-layer graphene) was identified independent of substrates by Raman and X-Ray Photoelectron Spectroscopy analyses. On copper foil, size and area fraction of the graphene growth increased until 30 minutes annealing and then didn't changed. Comparing to that, graphene on the cobalt refined till 50 minutes annealing, after then the effect disappeared which means a similar shape to that on copper foil. On nickel the graphene refined irrespective of annealing time that is possibly because of the complete solid solution of nickel with copper.

• Journal of the Korean GEO-environmental Society
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• v.3 no.1
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• pp.27-36
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• 2002

This study is about the applicability of copper slag as the ground improvement material. By the geo-technical characteristics of the copper slag and by the effect of consolidation and under drainage condition, it is proved that the copper slag can be used for ground improvement material as substitution for sand. As a result of laboratory tests, it was shown that the permeability of the copper slag was similar to that of sands under the vertical drainage condition. In addition, the copper slag showed higher critical hydraulic gradient than that of sand under up-ward vertical flow state. The copper slag has potential safety against piping and it has internal stability of particles. The conclusion is that the copper slag is suitable for drainage and filter material.

• Restorative Dentistry and Endodontics
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• v.15 no.2
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• pp.1-16
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• 1990

This study was to evaluate the cytotoxic effect in vitro and the tissue response within the rat peritoneal cavity to high copper amalgam and glass ionomer-silver cement, suggested for use as a retrograde endodontic filling material. In the cytotoxicity experiment, the radioactively ($^{51}Cr$) labeled L929 mouse fibroblasts were employed to determine the relative cytotoxicity of two experimental materials. Those materials were evaluated immediately after set and after one and seven days setting. In the tissue response experiment, two experimental materials were to evaluate mean peritoneal cellular count, differential cell count and the content of silver and copper in pooled packed cells and eluate samples taken by peritoneal lavage technique, and compared with surgical control after one day. two, four and six weeks of implantation. The results were as following: 1. High copper amalgam exhibited significant cytotoxicity immediately after set but showed no sign of toxicity after one day and seven days setting materials. 2. Glass ionomer-silver cement showed no sign of toxicity immediately after set and after one day and seven days setting. 3. High copper amalgam and glass ionomer-silver cement groups produce no significant difference in the mean peritoneal cell count when compared with the surgical control group after one day, two and four weeks of implantation. Surgical control group exhibited significantly a greater cell count when compared with the High copper amalgam group after six weeks. 4. High copper amalgam group increased significantly in the percentage macrophages after four and six weeks of implantation when compared with surgical control group. 5. The trace metal analysis involved an increased silver content in the elutes and an increased copper content in the packed cells of high copper amalgam group, and an increased silver content in the packed cells and elutes of glass ionomer-silver cement group.

• Journal of Life Science
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• v.33 no.9
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• pp.724-729
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• 2023

In this experiment, we aimed to investigate the role of copper in regulating the biosynthesis of a myokine called apelin in mammalian skeletal muscle cells. Our approach involved culturing skeletal muscle cells and subjecting them to treatments with copper sulfate or a copper chelator known as bathocuproinedisulfonic acid (BCS). We employed standard techniques, such as reverse transcription-polymerase chain reaction (RT-PCR) and Western blotting, to assess the synthesis of apelin at different stages, including transcription, translation, and post-translational modifications. Our findings demonstrated that copper had an inhibitory effect on apelin biosynthesis at all three stages: transcription, translation, and post-translation. However, when we treated the cells with BCS, the biosynthesis of apelin was restored to its original state. This finding suggests that copper is required for the synthesis of apelin in mammalian skeletal muscle cells. This study represents the first documented evidence of the inorganic copper-dependent regulation of apelin biosynthesis, shedding light on potential strategies for the prevention and treatment of sarcopenia induced by copper imbalances.

• Advances in materials Research
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• v.4 no.3
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• pp.165-178
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• 2015

Friction coefficient of epoxy metal matrix composites were investigated. The main objective was to increase the friction coefficient through rubber sole sliding against the epoxy floor coating providing appropriate level of resistance. This was to avoid the excessive movement and slip accidents. Epoxy metal matrix composites were reinforced by different copper wire diameters. The epoxy metal matrix composites were experimentally conducted at different conditions namely dry, water and detergent wetted sliding, were the friction coefficient increased as the number of wires increased. When the wires were closer to the sliding surface, the friction coefficient was found to increase. The friction coefficient was found to increase with the increase of the copper wire diameter in epoxy metal matrix composites. This behavior was attributed to the fact that as the diameter and the number of wires increased, the intensity of the electric field, generated from electric static charge increased causing an adhesion increase between the two sliding surfaces. At water wetted sliding conditions, the effect of changing number of wires on friction coefficient was less than the effect of wire diameter. The presence of water and detergent on the sliding surfaces decreased friction coefficient compared to the dry sliding. When the surfaces were detergent wetted, the friction coefficient values were found to be lower than that observed when sliding in water or dry condition.

• Korean Journal of Materials Research
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• v.29 no.12
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• pp.764-773
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• 2019

The gas response characteristic toward C₂H₅OH has been demonstrated in terms of copper-vacancy concentration, hole density, and microstructural factors for undoped/Li(I)-doped CuO thin films prepared by sol-gel method. For the films, both concentrations of intrinsic copper vacancies and electronic holes decrease with increasing calcination temperature from 400 to 500 to 600 ℃. Li(I) doping into CuO leads to the reduction of copper-vacancy concentration and the enhancement of hole density. The increase of calcination temperature or Li(I) doping concentration in the film increases both optical band gap energy and Cu2p binding energy, which are characterized by UV-vis-NIR and X-ray photoelectron spectroscopy, respectively. The overall hole density of the film is determined by the offset effect of intrinsic and extrinsic hole densities, which depend on the calcination temperature and the Li(I) doping amount, respectively. The apparent resistance of the film is determined by the concentration of the structural defects such as copper vacancies, Li(I) dopants, and grain boundaries, as well as by the hole density. As a result, it is found that the gas response value of the film sensor is directly proportional to the apparent sensor resistance.