• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.03a
• /
• pp.86-86
• /
• 2003

Copper has attracted much attention in the deep submicron ULSI metallization process as a replacement for aluminum due to its lower resistivity and higher electromigration resistance. Electroless copper deposition method is appealing because it yields conformal, high quality copper at relatively low cost and a low processing temperature. In this work, it was investigated that effect of the microstructure of the substrate on the electroless deposition. The mechanism of the nucleation and growth of the palladium nuclei during palladium activation was proposed. Electroless copper deposition on TiN barriers using glyoxylic acid as a reducing agent was also investigated to replace toxic formaldehyde. Furthermore, electroless copper deposition on TaN$\sub$x/ barriers was examined at various nitrogen flow rate during TaN$\sub$x/ deposition. Finally, it was investigated that the effect of plasma treatment of as-deposited TaN$\sub$x/ harriers on the electroless copper deposition.

• Journal of the Korean Wood Science and Technology
• /
• v.37 no.5
• /
• pp.421-425
• /
• 2009

This research investigates the effect of copper retention on copper leaching in wood treated with copper-based preservatives. Radiata pine (Pinus radiata D. Don) sapwood samples were ground in a Wiley mill equipped with a 20-mesh screen. The ground wood was vacuum-treated with various concentrations of alkaline copper quat (ACQ), bis-(N-cyclohexyl-diazeniumdioxy)-copper (CB-HDO), and copper azole (CUAZ). The treated samples were conditioned at $70^{\circ}C$ and 100% RH for 72 hours. The samples were leached by using the distilled water for four weeks, and the copper contents in each sample were measured by X-ray spectroscopy. As expected, the copper leaching was increased with increasing of copper retention. The copper leaching from the ACQ and CB-HDO treated samples were gradually decreased with increasing copper retention: however, the copper losses from the CUAZ treated samples appeared to be proportionally increased with the increase in copper retention in all retention levels tested. The results indicate that at the conditions of the same copper retention ACQ and CB-HDO treated wood have a better leaching resistance compared to CUAZ treated wood.

• Journal of Korean Society of Environmental Engineers
• /
• v.35 no.7
• /
• pp.479-484
• /
• 2013

This study was performed to examine the effect of copper on the biodegradability, nitrification, denitrification and oxygen uptake rate (OUR) using batch reactor and continuous flow stirred tank reactor (CSTR) of anaerobic/anoxic/oxic ($A_2/O$). The results of this study can be summarized as follows. In the case of the effect of copper on organic treatment, the bad effect initiated when it was above 4.5 mg/L copper with batch reactor and above 2.0 mg/L copper with CSTR. Concerning the case on nitrification and removal of nitrogen, it showed bad effect when copper was above 4.5 mg/L with batch reactor for nitrification and 1.0 mg/L with CSTR for the removal of nitrogen. The bad effect on the removal of phosphorus began when it was 4.5 mg/L copper with batch reactor and 2 mg/L copper with CSTR. In the case of OUR, it decreased as microbial activity was affected when copper concentration was above 1.5 mg/L in both case of batch reactor and CSTR.

• Journal of Korean Society on Water Environment
• /
• v.27 no.1
• /
• pp.54-60
• /
• 2011

To evaluate the feasibility of electrodialysis for copper removal from industrial wastewater, the effect of operating parameters on the removal of copper was experimentally estimated. The limiting current density (LCD) linearly increased with the copper concentration and the flow rate. The time when the copper concentration of diluate reaches to 3 mg/L was linearly proportional to initial concentration of diluate, and the concentration of concentrate did not affect the removal rate. Increase in the flow rate gave a positive effect on the removal rate and became insignificant at flow rates greater than 2.4 L/min. The removal rate increased with the applied voltage. From the operation of the electrodialysis module used in this research, the flow rate of 2.4 L/min and the voltage corresponding to the 80~90% of LCD were found be the optimum operating condition for the copper removal from highly concentrated copper solutions.

• Journal of Environmental Science International
• /
• v.11 no.4
• /
• pp.319-325
• /
• 2002

This experiment was carried out to investigate the effects of heavy metals (copper, cadmium, lead and chrome) on the growth of plant and seed germination of Arabidopsis thaliana treated with various concentrations of heavy metals. Cadmium and chrome among the 4 heavy metals had no effect on the growth of stem even in the concentration fifty times higher than the official standard concentration of pollutant exhaust notified by the Ministry of Environment. The official standard concentration of cadmium, however, stimulated the growth of stem in general, increasing leaf size and surface area, although it had no effect on the length of stem. But the growth of stem was decreased about 18% in the official standard concentration of pollutant exhaust of lead and copper. There was no growth of root in the concentration of lead and copper ten times higher than the official standard concentration. Cadmium and chrome had no effect on the seed germination, but lead and copper decreased the rate of seed germination. Seeds were not germinated in the concentration of copper ten times higher than the official standard concentration and in the concentration of lead fifty times higher than the official standard concentration. From this research three peculiar results were obtained. Chrome in the soil did not have much effect on the plant growth and seed germination of Arabidopsis thaliana. Cadmium stimulated the stem growth in an optimum concentration. But lead and copper reduced the plant growth and seed germination even in a small concentration, especially copper had the worse effect.

• Journal of Nutrition and Health
• /
• v.23 no.6
• /
• pp.443-450
• /
• 1990

Pregnant rats were fed liquid diet to determine the influence of maternal ethanol intake on maternal and pup liver copper when dietary copper was low. The diets, which contained either 0.75(low) or 3.75(control)mg copper/1 with or without 30% of kcal from ethanol, were fed throughout gestation and the first 15 days of lactation. maternal calorie intake and body weight were unaffected by dietary treatment. Ethanol intake depressed maternal liver copper concentration only when diet copper was low(interactive effect P<0.05). Although ethanol intake depressed total pup liver copper concentration regardless of dietary copper level, the interactive effect observed in maternal liver was reflected incopper content of the pup liver metallothionein fraction eluted from a Sephadex G-75 column. The zinc content of metallothionein was inversely related to copper content of metallothionein. Results suggest that pregnancy and lactation is a special period to develop a copper deficiency when low copper intake and ethanol ingestion are combined not only in mothers but also in their offspring.

• Journal of Plant Biology
• /
• v.30 no.3
• /
• pp.181-187
• /
• 1987

Copper inhibited PSII-mediated O2 evolution (H2OlongrightarrowDCIP, H2OlongrightarrowSiMo) but not PSImediated O2 uptake(DCIP. Asc.longrightarrowMV) in isolated Chinese cabbage chloroplasts. Copper toxicity on PSII-mediated O2 evolution was higher at alkaline condition than at acidic condition and was inhanced by light illumination after copper treatment. The increased toxicity by light illumination was not recovered by subsequent dark treatment. The inhibitory effect of copper on H2OlongrightarrowDCIP reaction was higher than that on H2OlongrightarrowSiMo reaction. This result suggests that there may be another inhibitory site of copper on PSII other than water oxidizing side of PSII.

• Journal of the Korean institute of surface engineering
• /
• v.49 no.5
• /
• pp.401-407
• /
• 2016

In this work, effect of zincate treatment of AZ91 Mg alloy on the following electrodeposition of copper was examined in a non-cyanide bath containing pyrophosphate ions in view of surface morphology and adhesion of the electrodeposited copper layer. Without zincate treatment, the electrodeposited copper layer showed very porous structure and poor adhesion. On the other hand, the copper layer electrodeposited on the zincate-treated surface showed dense structure and good adhesion. The dissolution rate of AZ91 Mg alloy after the zincate treatment appeared to decrease about 40 times in the copper pyrophosphate bath, as compared to that of the surface without zincate treatment. The porous morphology and poor adhesion of a copper layer on the AZ91 Mg alloy surface without zincate treatment were attributed to small number of nucleation sites of copper because of rapid dissolution of the magnesium substrate in the pyrophosphate bath. Based on the experimental results, it is concluded that the zincate treatment to form a conducting and protecting layer on the AZ91 Mg alloy surface is essential for successful electrodeposition of a copper layer on AZ91 Mg alloy with good adhesion and dense structure in the copper pyrophosphate bath.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.414-417
• /
• 2003

A copper-clad aluminium composite bar is lighter and less expressive than a commercial copper alloy bar. Copper-clad aluminium composite bar can be fabricated by hot hydrostatic extrusion process. In this work, the effect of die angle on the compressive properties of copper-clad aluminium composites fabricated using hydrostatic extrusion process was investigated experimentally. The results showed that optimum half die angle was in the range of 40$^{\circ}$ to 50$^{\circ}$ for an extrusion ratio of 19. The results also showed that the half die angle had little influence on the compressive strength of copper-clad aluminium composites. A diffusion layer increased with increasing die angle.

• Journal of the Korean institute of surface engineering
• /
• v.41 no.1
• /
• pp.23-27
• /
• 2008

The effect of solution agitation on the copper electroless deposition process of ULSI (ultra large scale integration) interconnections was investigated by using physical, electrochemical and electrical techniques. It was found that proper solution agitation was effective to obtain superconformal copper configuration within the trenches of $130{\sim}80nm$ width. The transition of open potential during electroless deposition process showed that solution agitation induced compact structure of copper deposits by suppressing mass transfer of cuprous ions toward substrate. Also, the specific resistivity of copper layers was lowered by increasing agitation speed, which made the deposited copper particles smaller. Considering both copper deposit configuration and electric property, around 500 rpm of solution agitation was the most suitable for the homogeneous electroless copper filling within the ultra-fine patterns.