• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2005.11a
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• pp.125-125
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• 2005

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2005.11a
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• pp.126-126
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• 2005

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.771-775
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• 2015

In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with $10{\mu}m$ linewidth are fabricated on $180mm{\times}180mm$ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with $10{\sim}20{\mu}m$, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.

• Journal of the Korean institute of surface engineering
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• v.5 no.1
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• pp.1-7
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• 1972

Copper -clad laminate(CCL) was fabricated and evaluated by bonding 35${\pm}$5${\mu}$ thick electroplated copper foils with a suitable adhesive to an insulating base such as phenolic resin laminate. In this study, electroplating methods and conditions were studied to produced good quality copper foils for printed circuit board applications. The electroplating bath solutions used were a copper-sulfate solution and a concentrated copper fluoborate solution. A surface roughening treatment that improved the adhesive strength of copper foils with an insulating laminate was also developed . A conventional copper sulfate solution containing sulfuric acid was used for the roughening treatment.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.193-195
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• 2006

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.171-171
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• 2013

2층 FCCL (연성회로기판, Flexible Copper Clad Laminate)에 있어서 폴리이미드 필름과 구리의 접착력을 향상 시키기 위해 기존에 사용되고 있는 Ni-Cr대신 박리강도가 높고 에칭성도 매우 뛰어난 Ni-Mo-Nb 박막을 Roll-to roll 스퍼터 장비를 이용하여 개발하였다. 새롭게 개발된 Ni-Mo-Nb 박막은 기존 연구되어진 Ni-Cr 물질 대비 고온 박리강도 약 1.5~2.0배, 에칭성 8배 이상의 매우 우수한 특성을 보였다. Ni-Mo-Nb 접착층의 두께가 7~40 nm로 증가함에 따라 상온 박리강도가 향상 되는 것을 확인하였다. Ni-Mo-Nb 박막을 증착 하기 전 폴리이미드 기판표면을 RF 플라즈마 전처리 하였을 때 0.67 kg f/cm의 우수한 상온 박리강도를 나타내었으며 FCCL 샘플을 $150^{\circ}C$에서 168시간동안 열처리 한 후 접착력을 측정하였을 때도 0.54 kg f/cm의 높은 고온 박리강도를 보였다. FCCL의 박리강도, 표면 거칠기, 원소들의 화학적 결합, 박막의 미세구조를 peel test, atomic force microscopy, X-ray photoelectron spectroscopy, transmission electron microscopy를 이용하여 폴리이미드 기판 플라즈마 전처리 효과를 확인하였다. 그 결과 플라즈마 전처리를 한 폴리이미드 기판의 경우 처리하지 않은 기판보다 상온과 고온에서 더 우수한 접착력을 가지는 것을 확인 할 수 있었는데 이것은 폴리이미드 기판의 표면 거칠기 증가에 의한 mechanical interlocking effect가 아닌 전처리를 통한 폴리이미드 표면 개질로 C-0, C-N와 같은 chemical functional group이 증가했기 때문인 것으로 확인되었다.

• Elastomers and Composites
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• v.43 no.2
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• pp.82-87
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• 2008

In this study, nine kinds of polyimides were synthesized from 1,2,4,5-benzenetetracarboxylic dianhydride (PMDA), 4,4'-(4,4'-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA), m-pheny lenediamine (m-PDA) and 4,4'-oxydianiline (ODA) by controlling molar ratio of monomers. Synthesized polyimides were used as insulator films for 2-layer Flexible Copper Clad Laminate(FCCL) which were manufactured by the casting method. Glass transition temperature and thermal degradation temperature for 5% weight loss of the polyimide film were improved by increasing contents of m-PDA and PMDA, respectively. Water absorption of polyimide film was reduced by increasing contents of ODA and BPADA which have relatively long structure, respectively. Peel strength of 2-layer FCCL was improved by increasing contents of ODA and BPADA.

• Korean Journal of Materials Research
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• v.17 no.10
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• pp.509-515
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• 2007

In order to fabricate adhesiveless 2-layer flexible copper clad laminate (FCCL) used for COF (chip on film) with high peel strength, polyimide (PI; Kapton-EN, $38\;{\mu}m$) surface was modified by reactive $O_2^+$ and $N_2O^+$ ion beam irradiation. 300 mm-long linear electron-Hall drift ion source was used for ion irradiation with ion current density (J) higher than $0.5\;mA/cm^2$ and energy lower than 200 eV. By vacuum web coating process, PI surface was modified by linear ion source and then 10-20 nm thick Ni-Cr and 200 nm thick Cu film were in-situ sputtered as a tie layer and seed layer, respectively. Above this sputtered layer, another $8-9{\mu}m$ thick Cu layer was grown by electroplating and subsequently acid and base resistance and thermal stability were tested for examining the change of peel strength. Peel strength for the FCCLs treated by both $O_2^+$ and $N_2O^+$ ion irradiation showed similar magnitudes and increased as the thickness of tie layer increased. FCCL with Cu (200 nm)/Ni-Cr (20 nm)/PI structure irradiated with $N_2O^+$ at $1{\times}10^{16}/cm^2$ ion fluence was proved to have a strong peel strength of 0.73 kgf/cm for as-received and 0.34 kgf/cm after thermal test.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.95-100
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• 2010

LED (Light Emitting Diode) is 85% of the applied energy is converted into heat that is already well known. Lately, LED chips increasing the capacity as result delivered to increase the heat of the LED products and module that directly related to life span and degradation. Thus, in industry the high-power LED chip to control the heat generated during the course of the study and the existing aluminum, copper adhesives, and uses MLC (Metal clad laminate) structures using low-cost FR4 and copper CCL (Copper Clad Laminate) to reduce costs by changing to a study being carried out. In this study, using low-cost CCL Class, mounted 1W LED chip to analyze changes in the thermal resistance. In addition, heat dissipation in the CCL to facilitate a variety of thermal via design outside of the heat generated by the LED chip to control and facilitate the optimal structure of the heat dissipation is suggested.

• Journal of the Korean Applied Science and Technology
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• v.32 no.3
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• pp.512-521
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• 2015

In this research, environmental friendly organic acid containing microetching system to improve adhesion strength between photoresist resin and Copper Clad Laminate(CCL) was developed without using strong oxidant $H_2O_2$. Etching rate and surface contamination on CCL were examined with various etching conditions with different etchants, organic acids and additives. to develope an optimum microetching condition. Etching solution with 0.04 M acetic acid showed the highest etching rate $0.4{\mu}m/min$. Etching solution with the higher concentration of APS showed the higher etching rate but surface contamination on CCL is very serious. In addition, stabilizer solution also played an important role to control the surface contamination. As a result of research, the etching solution containing 0.04 M of acetic acid, 0.1 M of APS with 4 g/L of stabilizer solution(ST-1) was best to improve adhesion between CCL and photoresist resin as well as showed the most clean and rough surface with the etching rate of $0.37{\mu}m/min$.