• Bulletin of the Korean Chemical Society
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• v.23 no.3
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• pp.404-412
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• 2002

Nine copper(Ⅱ) oxyanion, and mixed oxyanion complexes that have four- or five-coordinate geometries around copper(Ⅱ) centers were derived from sparteine copper(Ⅱ) dinitrate precursor [Cu($C_{15}$$H_{26}$N2)(NO3)2]. The precursor complex undergoes an anion exchange with various oxyanions, and an interchange reaction with other sparteine copper(Ⅱ) complexes. The [Cu($C_{15}$$H_{26}$N2)(CH3CO2)2] also undergoes "halogen atom abstraction" reaction with CCl4 to produce the mixed anion complex [Cu($C_{15}$$H_{26}$N2)(CH3CO2)Cl]. The whole set of prepared complexes has been used for the comparative electrochemical and spectroscopic studies.

• Journal of the Korean institute of surface engineering
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• v.5 no.1
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• pp.1-7
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• 1972

Copper -clad laminate(CCL) was fabricated and evaluated by bonding 35${\pm}$5${\mu}$ thick electroplated copper foils with a suitable adhesive to an insulating base such as phenolic resin laminate. In this study, electroplating methods and conditions were studied to produced good quality copper foils for printed circuit board applications. The electroplating bath solutions used were a copper-sulfate solution and a concentrated copper fluoborate solution. A surface roughening treatment that improved the adhesive strength of copper foils with an insulating laminate was also developed . A conventional copper sulfate solution containing sulfuric acid was used for the roughening treatment.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.812-813
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• 2006

Dimensional change of compact made from (Fe-Cu) prealloyed powder and copper powder compared to that of compact made from iron-copper elemental powder. The compact made from the prealloyed powder with a copper content of 7.18mass% which is nearly equal to its solution limit and copper powder showed only the large contraction in spite of penetration of liquid copper into grain boundary of the prealloyed powder. But the compact made from iron-copper elemental powder showed the large expansion in spite of same chemical composition with former case.

• Journal of the Korean institute of surface engineering
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• v.41 no.1
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• pp.23-27
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• 2008

The effect of solution agitation on the copper electroless deposition process of ULSI (ultra large scale integration) interconnections was investigated by using physical, electrochemical and electrical techniques. It was found that proper solution agitation was effective to obtain superconformal copper configuration within the trenches of $130{\sim}80nm$ width. The transition of open potential during electroless deposition process showed that solution agitation induced compact structure of copper deposits by suppressing mass transfer of cuprous ions toward substrate. Also, the specific resistivity of copper layers was lowered by increasing agitation speed, which made the deposited copper particles smaller. Considering both copper deposit configuration and electric property, around 500 rpm of solution agitation was the most suitable for the homogeneous electroless copper filling within the ultra-fine patterns.

• KSBB Journal
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• v.13 no.4
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• pp.391-398
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• 1998

The effect of culture medium copper availability on the specific growth rate(${\mu}$) and carbon conversion efficiency (CCE) was sutided for an obligatory methanotroph Methylosinus trichosporium OB3b under various combinations of carbon and nitrogen sources. Methane or methanol was used as a carbon source, and nitrate or ammonium was used as a nitrogen source. Medium copper availability determined the intracellular location or kind of methane monooxygenase (MMO), cell-membrane (particulate or pMMO) when copper was present and cytoplasm (soluble or sMMO) when copper was deficient. When methane was used as a carbon source, copper-containing medium exhibited higher ${\mu}$ and CCE than copper-free medium regardless of the kind of nitrogen source. When methanol was used as a carbon source, however, the effect of copper disappeared. Ammonium gave the higher ${\mu}$ and CCE than nitrate for both methane and methanol. Those observation suggest that there exist an important difference in energy utilization efficiency for methane assimilation between sMMO and pMMO.

• Archives of Pharmacal Research
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• v.11 no.2
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• pp.81-86
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• 1988

The transfer of cupric sulfate across the rat small intestine in vitro was studied by perfusion method using the segments of everted rat small intestine. Copper transport was approximately propotional to the metal concentration in the mucosal solution and no difference was observed in the metal transport among rat duodenum, jejunum and ileum. It was suggested from these results that copper transport across the rat small intestine would occur by passive diffusion. The effect of various chelating agents on copper transport across the rat small intestine n vitro and its uptake by the intestine were also studied. Copper transport was greatly enhanced in the presence of EDTA and NTA. Copper uptake decreased to a greater extent in the presence of EPTA and NTA.

• Journal of Auto-vehicle Safety Association
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• v.13 no.3
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• pp.20-25
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• 2021

Flexural resistance evaluation of FFC (Flexible Flat Cable) was performed according to the grain size of rolled copper foil by adding 0.1wt% silver (Ag) and electrodeposited copper foil by slitting method after heat-treatment. These methods are aimed at enhancing the flexural durability of the FFC by growing the grain size of copper foil. By increasing the grain size of the copper foil and minimizing the miss-orientation at grain boundaries, the residual stress at the grain boundaries of the copper foil is reduced and the durability of the FFC is improved. Maximizing an average grain size of copper foil can be got a good solution in order to enhance the durability of the FFC or FPCB (Flexible Printed Circuit Board).

• Journal of Korean Society on Water Environment
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• v.27 no.1
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• pp.54-60
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• 2011

To evaluate the feasibility of electrodialysis for copper removal from industrial wastewater, the effect of operating parameters on the removal of copper was experimentally estimated. The limiting current density (LCD) linearly increased with the copper concentration and the flow rate. The time when the copper concentration of diluate reaches to 3 mg/L was linearly proportional to initial concentration of diluate, and the concentration of concentrate did not affect the removal rate. Increase in the flow rate gave a positive effect on the removal rate and became insignificant at flow rates greater than 2.4 L/min. The removal rate increased with the applied voltage. From the operation of the electrodialysis module used in this research, the flow rate of 2.4 L/min and the voltage corresponding to the 80~90% of LCD were found be the optimum operating condition for the copper removal from highly concentrated copper solutions.

• The Korean Journal of Pesticide Science
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• v.7 no.1
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• pp.12-17
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• 2003

Potato blackleg disease caused by Erwinia carotovora subsp. atroseptica (Eca) has been a serious problem in Korea. Bactericidal activities of twelve bactericides including antibiotics, copper compounds and oxolinic acid were examined in vitro. Streptomycin, streptomycin sulfate, and oxolinic acid effectively controlled the pathogen at 0.02 mM. However, the pathogen developed resistance to the applied bactericides after 72 hours of incubation. Activity of copper compounds such as copper hydroxide, copper oxide and copper sulfate was lower than that of antibiotics. However, the pathogen did not develop resistant to them. Combinations of streptomycin (0.016 mM, 9.3 ppm) + copper oxide (1.2 mM, 171.6 ppm)/copper hydroxide (1.5 mM, 146.3 ppm); streptomycin sulfate (0.005 mM, 7.0 ppm) + copper oxide (1.2 mM, 171.6ppm)/copper hydroxide (1.5 mM, 146.3 ppm) were found to be effective for the control of E. carotovora subsp. atroseptica.

• Resources Recycling
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• v.16 no.3 s.77
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• pp.27-33
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• 2007

It is very important in the view point of resource recycling to recover valuable metals such as copper and tin from waste electric and electronic scrap. The waste electric and electronic scrap contains significant amounts of copper, tin, and so on. In this study, a new process for extracting copper and tin contained in the waste electric and electronic scrap using waste copper slag which is generated from the melting furnace of copper smelter was presented. Advantage of the proposed process is to reuse waste copper slag instead of new fluxes as slag formatives. In each experiment, the waste electric and electronic scrap and waste copper slag were melted inputting suitable amount of CaO as an additional flux. Up to 95% of copper and 85% of tin in the raw material were extracted in a Cu-Fe-Sn alloy phase.