• 제목/요약/키워드: Copper

검색결과 6,589건 처리시간 0.035초

Copper(II) Oxyanion Complexes Derived from Sparteine Copper(II) Dinitrate: Synthesis and Characterization of 4- and 5-Coordinate Copper(II) Complexes

  • Lee, Yong-Min;Kim, Yong-Kyu;Jung, Hee-Cheul;Kim, Young-Inn;Choi, Sung-Nak
    • Bulletin of the Korean Chemical Society
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    • 제23권3호
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    • pp.404-412
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    • 2002
  • Nine copper(Ⅱ) oxyanion, and mixed oxyanion complexes that have four- or five-coordinate geometries around copper(Ⅱ) centers were derived from sparteine copper(Ⅱ) dinitrate precursor [Cu($C_{15}$$H_{26}$N2)(NO3)2]. The precursor complex undergoes an anion exchange with various oxyanions, and an interchange reaction with other sparteine copper(Ⅱ) complexes. The [Cu($C_{15}$$H_{26}$N2)(CH3CO2)2] also undergoes "halogen atom abstraction" reaction with CCl4 to produce the mixed anion complex [Cu($C_{15}$$H_{26}$N2)(CH3CO2)Cl]. The whole set of prepared complexes has been used for the comparative electrochemical and spectroscopic studies.

인쇄 배선용 전해동박의 제조에 관한 연구 (Fabrication & Evaluation of electroplated Copper Foils for Printed Circuit Board Applications)

  • 윤용구;이진형
    • 한국표면공학회지
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    • 제5권1호
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    • pp.1-7
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    • 1972
  • Copper -clad laminate(CCL) was fabricated and evaluated by bonding 35${\pm}$5${\mu}$ thick electroplated copper foils with a suitable adhesive to an insulating base such as phenolic resin laminate. In this study, electroplating methods and conditions were studied to produced good quality copper foils for printed circuit board applications. The electroplating bath solutions used were a copper-sulfate solution and a concentrated copper fluoborate solution. A surface roughening treatment that improved the adhesive strength of copper foils with an insulating laminate was also developed . A conventional copper sulfate solution containing sulfuric acid was used for the roughening treatment.

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Expansion Behavior of Iron-copper Compact Made from (Fe-Cu) Prealloyed Powder

  • Kim, Youn-Che;Suk, Myung-Jin
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.812-813
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    • 2006
  • Dimensional change of compact made from (Fe-Cu) prealloyed powder and copper powder compared to that of compact made from iron-copper elemental powder. The compact made from the prealloyed powder with a copper content of 7.18mass% which is nearly equal to its solution limit and copper powder showed only the large contraction in spite of penetration of liquid copper into grain boundary of the prealloyed powder. But the compact made from iron-copper elemental powder showed the large expansion in spite of same chemical composition with former case.

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용액 교반이 미세 패턴 내 무전해 구리 도금에 미치는 영향 (The Effect of Solution Agitation on the Electroless Cu Deposition Within Nano-patterns)

  • 이주열;김만;김덕진
    • 한국표면공학회지
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    • 제41권1호
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    • pp.23-27
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    • 2008
  • The effect of solution agitation on the copper electroless deposition process of ULSI (ultra large scale integration) interconnections was investigated by using physical, electrochemical and electrical techniques. It was found that proper solution agitation was effective to obtain superconformal copper configuration within the trenches of $130{\sim}80nm$ width. The transition of open potential during electroless deposition process showed that solution agitation induced compact structure of copper deposits by suppressing mass transfer of cuprous ions toward substrate. Also, the specific resistivity of copper layers was lowered by increasing agitation speed, which made the deposited copper particles smaller. Considering both copper deposit configuration and electric property, around 500 rpm of solution agitation was the most suitable for the homogeneous electroless copper filling within the ultra-fine patterns.

메탄자화균 Methylosinus trichosporium OB3b의 성장 속도와 수율 : I. 실험적 고찰 (Growth Rate and Yield of a Methanotrophic Bacterium Methylosinus Trichosporium OB3b : I. Experimental Measurements)

  • 황재웅;송효학;박성훈
    • KSBB Journal
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    • 제13권4호
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    • pp.391-398
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    • 1998
  • The effect of culture medium copper availability on the specific growth rate(${\mu}$) and carbon conversion efficiency (CCE) was sutided for an obligatory methanotroph Methylosinus trichosporium OB3b under various combinations of carbon and nitrogen sources. Methane or methanol was used as a carbon source, and nitrate or ammonium was used as a nitrogen source. Medium copper availability determined the intracellular location or kind of methane monooxygenase (MMO), cell-membrane (particulate or pMMO) when copper was present and cytoplasm (soluble or sMMO) when copper was deficient. When methane was used as a carbon source, copper-containing medium exhibited higher ${\mu}$ and CCE than copper-free medium regardless of the kind of nitrogen source. When methanol was used as a carbon source, however, the effect of copper disappeared. Ammonium gave the higher ${\mu}$ and CCE than nitrate for both methane and methanol. Those observation suggest that there exist an important difference in energy utilization efficiency for methane assimilation between sMMO and pMMO.

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Transfer of Cupric Sulfate across Rat Small Intestine, in Vitro and Effect of Chelating Agents on It's Transfer

  • Kim, Chong-Kil;Choi, Seung-Gi;Rho, Young-Soo
    • Archives of Pharmacal Research
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    • 제11권2호
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    • pp.81-86
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    • 1988
  • The transfer of cupric sulfate across the rat small intestine in vitro was studied by perfusion method using the segments of everted rat small intestine. Copper transport was approximately propotional to the metal concentration in the mucosal solution and no difference was observed in the metal transport among rat duodenum, jejunum and ileum. It was suggested from these results that copper transport across the rat small intestine would occur by passive diffusion. The effect of various chelating agents on copper transport across the rat small intestine n vitro and its uptake by the intestine were also studied. Copper transport was greatly enhanced in the presence of EDTA and NTA. Copper uptake decreased to a greater extent in the presence of EPTA and NTA.

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결정립 제어 기술을 이용한 클락스프링 케이블용 고내구 동박 소재 개발 (A Development of High-Durability Copper Foil Materials for Clock Spring Cable Using Grain Size Control Techniques)

  • 채을용;이호승
    • 자동차안전학회지
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    • 제13권3호
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    • pp.20-25
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    • 2021
  • Flexural resistance evaluation of FFC (Flexible Flat Cable) was performed according to the grain size of rolled copper foil by adding 0.1wt% silver (Ag) and electrodeposited copper foil by slitting method after heat-treatment. These methods are aimed at enhancing the flexural durability of the FFC by growing the grain size of copper foil. By increasing the grain size of the copper foil and minimizing the miss-orientation at grain boundaries, the residual stress at the grain boundaries of the copper foil is reduced and the durability of the FFC is improved. Maximizing an average grain size of copper foil can be got a good solution in order to enhance the durability of the FFC or FPCB (Flexible Printed Circuit Board).

전기투석을 이용한 구리이온의 제거 시 운전인자의 영향 (Effect of Operating Parameters on the Removal Performance of Copper Ion by Electrodialysis)

  • 정효상;이강춘
    • 한국물환경학회지
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    • 제27권1호
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    • pp.54-60
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    • 2011
  • To evaluate the feasibility of electrodialysis for copper removal from industrial wastewater, the effect of operating parameters on the removal of copper was experimentally estimated. The limiting current density (LCD) linearly increased with the copper concentration and the flow rate. The time when the copper concentration of diluate reaches to 3 mg/L was linearly proportional to initial concentration of diluate, and the concentration of concentrate did not affect the removal rate. Increase in the flow rate gave a positive effect on the removal rate and became insignificant at flow rates greater than 2.4 L/min. The removal rate increased with the applied voltage. From the operation of the electrodialysis module used in this research, the flow rate of 2.4 L/min and the voltage corresponding to the 80~90% of LCD were found be the optimum operating condition for the copper removal from highly concentrated copper solutions.

감자 흑각병원균 Erwinia carotovora subsp. atroseptica의 화학적 방제 (Chemical control of potato Blackleg disease caused by Erwinia carotovora subsp. atroseptica in Korea)

  • 유용만;;배후남;김성문;임춘근;허장현
    • 농약과학회지
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    • 제7권1호
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    • pp.12-17
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    • 2003
  • 감자 생산에 치명적인 흑각병을 유발하는 흑각병원균 (Erwinia carotovora subsp. atroseptica) 을 방제할 수 있는 화학적 방제제를 선발하기 위하여 7 종의 항생제와 oxolinic acid, 그리고 4 종의 구리제를 대상으로 병원균에 대한 억제효과와 저항성을 in vitro에서 조사하였다. Streptomycin, streptomycin sulfate, oxolinic acid는 0.02 mM 처리 24 시간 후, 그리고 구리제인 copper hydroxide, copper oxide, copper sulfate 는 3 mM 처리 24 시간 후 완전히 억제되었다. 약제들에 대한 병원균의 저항성을 조사하고자 최소 억제농도의 1.3 배를 처리하고 72 시간 후에 생존율을 조사한 결과, 항생제 및 oxolinic acid 처리구에서는 저항성균이 관찰되었으나, 구리제 처리구에서는 관찰되지 않았다. 저농도 처리로 병원균을 방제할 수 있는 2 종의 항생제 및 oxolinic acid 와 저항성균 유발 가능성이 낮은 구리제 3 종을 혼합처리였을 경우, streptomycin + copper oxide(0.016 + 1.2 mM, 9.3 + 171.6 ppm), streptomycin + copper hydroxide(0.016 + 1.5 mM, 9.3 + 146.3 ppm), streptomycin sulfate+copper oxide(0.005 + 1.2 mM, 7.0 + 171.6 ppm), streptomycin sulfate+copper hydroxide(0.005 + 1.5 mM, 7.0+146.3 ppm) 처리 24 시간 후 병원균의 생장은 완전 억제되었고, 72 시간 후 저항성균이 전혀 관찰되지 않았다. 그러나 oxolinic acid+구리제 혼합처리의 경우와 2 종의 항생제 및 oxolinic acid + copper sulfate 혼합처리의 경우 공히 균생장 억제효과가 나타나지 않았다. 본 실험의 결과는 효과적인 감자흑각병의 방제를 위하여 약제의 단일 사용보다는 혼합 사용하는 경우 더 높은 방제효과와 낮은 저항성균 유발효과가 있다는 것 을 보여주고 있다.

폐동(廢銅)슬래그를 활용(活用)한 폐전기전자(廢電氣電子) 스크랩으로부터 유가금속(有價金屬) 고온용융추출(高溫鎔融抽出) 공정(工程) 개발(開發) (A Novel Process for Extracting Valuable Metals from Waste Electric and Electronic Scrap Using Waste Copper Slag by a High temperature Melting Method)

  • 김병수;이재천;이광호
    • 자원리싸이클링
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    • 제16권3호
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    • pp.27-33
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    • 2007
  • 구리, 주석 등의 유가금속을 다량 함유하고 있는 폐전기전자 스크랩으로부터 유가금속을 회수하는 것은 자원 재활용 측면에서 매우 중요하다. 본 연구에서는 폐동슬래그를 슬래그 형성제로 활용하여 폐전기전자 스크랩으로부터 유가금속을 추출하기 위한 새로운 공정이 제시되었다. 제안된 공정은 슬래그 형성제로 동 제련소에서 배출되는 폐동슬래그를 재활용한다는 장점이 있다. 각 실험에서는 일정한 비율로 혼합된 폐전기전자 스크랩과 폐동슬래그의 혼합시료를 보조 슬래그 형성제인 CaO와 함께 고온 용융되었다. 실험 결과 폐전기전자 스크랩에 함유된 구리와 주석이 Cu-Fe-Sn 합금상으로 각각 95% 이상, 85% 이상 추출되었다.