• 대한치과보철학회지
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• 제33권3호
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• pp.584-609
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• 1995

The purpose of this study was to evaluate the difference of the galvanic corrosion behaviour of the titanium in contact with gold alloy, silva-palladium alloy, and nickel-chromium alloy using the immersion and electrochemical method. And the effects of galvallit couples between titanium and the dental alloys were assessed for their usefulness as materials for superstructure. The immersion method was performed by measuring the amount of metal elementsreleased by Inductivey coupled plasma emission spectroscopy(ICPES) The specimen of fifteen titanium plates, the five gold alloy, five silver-palladium, five nickel-chromium plates, and twenty acrylic resin plates ware fabricated, and also the specimen of sixty titanium plugs, the thirty gold alloy, thirty silver-palladium, and nickelc-hromium plugs were made. Thereafter, each plug of gold alloy, silver-palladium, and nickel-chromium inserted into the the titanium and acrylic resin plate, and also titanium plug inserted into the acrylic resin plate. The combination specimens uf galvanic couples immersed in 70m1 artificial saliva solution, and also specimens of four type alloy(that is, titanium, gold, silver-palladium and nickel-chromium alloy) plugs were immersed solely in 70m1 artificial sativa solution. The amount of metal elements released was observed during 21 weeks in the interval of each seven week. The electrochemical method was performed using computer-controlled potentiosta(Autostat 251. Sycopel Sicentific Ltd., U.K). The wax patterns(diameter 11.0mm, thickness,in 1.5mm) of four dental casting alloys were casted by centrifugal method and embedded in self-curing acrylic resin to be about $1.0cm^2$ of exposed surface area. Embedded specimens were polished with silicone carbide paper to #2,000, and ultrasonically cleaned. The working electrode is the specimen of four dental casting alloys, the reference electrode is a saturated calmel electrode(SCE) and the ounter electrode is made of platinum plate. In the artificial saliva solution, the potential scanning was carried out starting from-700mV(SCE) TO +1,000mV(SCE) and the scan rate was 75mV/min. Each polarization curve of alloy was recorded automatically on a logrithmic graphic paper by XY recorder. From the polarization curves of each galvanic couple, corrosion potential and corrosion rates, that is, corrosion density were compared and order of corrosion tendency was determined. From the experiments, the following results were obtained : 1. In the case of immersing titanium, gold alloy, silver-palladium alloy, and nickel-chromium alloysolely in the artificial saliva solution(group 1, 2, 3, and 4), the total amount of metal elements released was that group 4 was greater about 2, 3 times than group 3, and about 7.8 times than group 2. In the case of group 1, the amount of titanium released was not found after 8 week(p<0.001). 2. In the case of galvanic couples of titanium in contact with alloy(group 5, 6), the total amount of metal elements released of group 5 and 6 was less than that of group 7, 8, 9, and 10(p<0.05). 3. In the case of galvanic couples of titanium in contact with silver-palladium alloy(group 7, 8), the total amount of metal elements released of group 7 was greater about twice than that of group 5, and that of group 8 was about 14 times than that of group 6(p<0.05). 4. In the case of galvanic couples of titanium in contact with nickel-chromium alloy(group 9, 10), the total amount of metal elements released of group 9 and 10 was greater about 1.8-3.2 times than that of group 7 and 8, and was greater about 4.3~25 times than that of group 5 and 6(p<0.05). 5. In the effect of galvanic corrosion according to the difference of the area ratio of cathode and anode, the total amount of metal elements released was that group 5 was greater about 4 times than group 6, group 8 was greater about twice than group 7, and group 10 was greater about 1.5 times than group 9(p<0.05). 6. In the effect of galvanic corrosion according to the elasped time during 21 week in the interval of each 7 week, the amount of metal elements released was decreased markedly in the case of galvanic couples of the titanium in contact with gold alloy and silver-palladium alloy but the total amount of nickel and beryllium released was not decreased markedly in the case of galvanic couples of the titanium in contact with nickel-chromium alloy(p<0.05). 7. In the case of galvanic couples of titanium in contact with gold alloy, galvanic current was lower than any other galvanic couple. 8. In the case of galvanic couples of titanium in contact with nickel-chromium alloy, galvanic current was highest among other galvanic couples.

• 한국터널지하공간학회 논문집
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• 제21권2호
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• pp.267-278
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• 2019

터널의 안정적인 시공을 위해 터널 굴진 도중 터널 전방의 이상영역을 확인할 수 있는 다양한 방법의 터널전방예측 기법들이 사용되고 있다. 터널전방예측 방법 중 하나인 2전극 전기비저항 탐사(Pole-Pole array)는 터널직경 5배 이내의 함수대, 연약대 등을 확인하기 위해 자주 사용되고 있다. 2전극 전기비저항 탐사 시 가장 중요한 것 중 하나는 원지반의 전기비저항값을 유추하는 것이며, 원지반의 전기비저항은 1) 지반과 전극의 접촉면적을 계산하고, 2) 그와 동일한 표면적을 가지는 반구형으로 가정하는 과정을 거쳐 얻어진다. 이러한 가정은 지반과 전극이 접촉하는 면적이 적고 충분한 거리가 떨어져야 한다. 하지만 전극의 크기, 형태 및 전극사이의 거리에 따라 실제 측정되는 저항이 달라지므로 이에 대한 정확한 평가가 필요하다. 따라서 본 연구에서는 전기비저항 탐사에서 주로 사용되는 원기둥형 전극의 크기와 전극사이의 거리에 따른 영향에 관한 이론식을 유도하고, 실험 연구를 통해 검증하였다. 이를 바탕으로 원기둥형 전극의 관입깊이가 반지름에 비해 큰 경우, 등가 반구형 전극의 가정을 사용하면 에러가 증가하므로 적용 시 주의해야 함을 확인하였다.

• 대한치과보철학회지
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• 제47권4호
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• pp.445-456
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• 2009

연구목적: 임플란트를 이용한 수복의 임상적인 성공에 중요한 역할을 하는 초기 골유착의 향상을 위해 티타늄의 표면 거칠기 조절과 함께 생체활성도를 가진 표면으로 변화시키는 방법에 관한 연구가 이루어지고 있다. 표면 거칠기의 적절한 증가는 조골세포의 활동을 증가시키고 골과 임플란트의 접촉과 유지를 촉진시킨다고 보고되고 있고 또한 알칼리와 열처리를 통하여 생체 활성 표면을 얻을 수 있는 것으로 보고되고 있다. 이에 본 연구에서는 알칼리 및 열을 이용한 티타늄 표면 처리가 골유착에 어떤 영향을 미치는지 알아보고자 하였다. 연구재료 및 방법: 기계절삭된 임플란트를 대조군으로 하여 (1군), 5 M NaOH 용액에 처리한 임플란트를 대기 중에서 열처리한 군 (2군)과 진공에서 열처리한 군 (3군)으로 분류하였다. 알칼리와 열처리를 시행한 임플란트들의 표면 특성을 관찰하고 가토에 식립하여 치유 기간에 따라서 조직학적 및 조직형태계측학적으로 비교하고 EPMA (Electron Probe Micro Analyzer)를 이용하여 치유 기간 별 골성분의 변화를 분석하였다. 결과 및 결론: 대기 중에서 열처리한 2군이 통계적으로 유의하게 (P<.05) 증가된 표면 거칠기를 보였다. 이렇게 만들어진 임플란트를 가토에 식립하여 조직 형태계측학적 분석을 시행한 결과 골-임플란트 접촉율은 전반적으로 치유기간이 경과하면서 증가하는 것으로 나타났으며 2군과 3군에서 통계적 분석결과 치유기간 간에 유의한 차이가 관찰되었고 (P<.05), 골-임플란트 면적율 (BA) 또한 골 임플란트 접촉율과 비슷한 양상을 보였으며 통계적 분석결과 2군에서만 치유기간별로 통계적으로 유의한 차이가 관찰되었다 (P<.05). 치유 기간별로 임플란트 주변 골에서 칼륨 (K), 인 (P), 칼슘 (Ca), 티타늄 (Ti)의 분포를 EPMA로 보았을 때 빈도의 편향은 관찰되지 않았으며 2군과 3군에서 초기에 칼슘과 인이 증가되는 것이 관찰되었다. 이상의 결과로 볼 때 알칼리 및 대기 중에서 열처리로 표면 처리된 임플란트의 사용은 초기에 안정된 골유착에 도움을 주며 임플란트 식립 후 기능까지의 시간을 감소시킬 것으로 사료된다.

• 마이크로전자및패키징학회지
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• 제15권4호
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• pp.31-39
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• 2008

캐비티 형성이 불필요한 MEMS 캡 본딩을 위해 전기도금법을 이용하여 Cu/Sn rim 구조를 형성하였으며, $25{\sim}400{\mu}m$ 범위의 rim 폭에 따른 본딩특성을 분석하였다. Cu/Sn rim의 폭이 증가함에 따라 rim 패키지 내부의 유효 실장면적비가 감소하는 반면에 파괴하중비가 증가하며, Cu/Sn rim 폭이 150 ${\mu}m$일 때 유효 실장면적비와 파괴하중비를 최적화할 수 있을 것으로 예측되었다. 폭 25 ${\mu}m$ 및 폭 50 ${\mu}m$인 Cu/Sn rim 접합부에서는 모든 계면에서 본딩이 이루어진 반면에, 100 ${\mu}m$ 이상의 폭을 갖는 rim 접합부에서는 Sn 도금표면의 거칠기에 의해 본딩이 이루어지지 않은 기공 부위가 관찰되었다.

• 전기학회논문지
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• 제67권10호
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• pp.1370-1374
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• 2018

A heterojunction $SnS_2/p-Si$ photodetector was fabricated by RF magnetron sputtering system. $SnS_2$ was formed with 2-inch $SnS_2$ target. Al was applied as the front and the back metal contacts. Rapid thermal process was conducted at $500^{\circ}C$ to enhance the contact quality. 2D material such as $SnS_2$, MoS2 is very attractive in various fields such as field effect transistors (FET), photovoltaic fields such as photovoltaic devices, optical sensors and gas sensors. 2D material can play a significant role in the development of high performance sensors, especially due to the advantages of large surface area, nanoscale thickness and easy surface treatment. Especially, $SnS_2$ has a indirect bandgap in the single and bulk states and its value is 2 eV-2.6 eV which is considerably larger than that of the other 2D material. The large bandgap of $SnS_2$ offers the advantage for the large on-off current ratio and low leakage current. The $SnS_2/p-Si$ photodetector clearly shows the current rectification when the thickness of $SnS_2$ is 80 nm compared to when it is 135 nm. The highest photocurrent is $19.73{\mu}A$ at the wavelength of 740 nm with $SnS_2$ thickness of 80 nm. The combination of 2D materials with Si may enhance the Si photoelectric device performance with controlling the thickness of 2D layer.

• International Journal of Precision Engineering and Manufacturing-Green Technology
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• 제5권5호
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• pp.583-591
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• 2018

Tool-chip adhesion impacts on cutting performance significantly, especially in finish cutting process. To promote cutting tools' anti-adhesion property, the concave micro-grooves texture (MGT) and convex volcano-like texture (VLT) were fabricated separately on lathe tools' rake faces by laser surface texturing (LST). Various orientations of MGT and different area densities (9% and 48%) and regions (partial and full) of VLT were considered in textured patterns designing. The following orthogonal cutting experiments, machining of aluminum alloy 5038, analyzed tools' performances including cutting force, cutting stability, chip shape, rake face adhesion and abrasion. It indicated that under dry finish cutting conditions, MGT contributed to cutting stability and low cutting forces, meanwhile friction and normal force reduced by around 15% and 10%, respectively with a weak correlation to the grooves' orientation. High density VLT tools, on the other hand, presented an obvious anti-adhesion property. A $5{\mu}m$ reduction of crater wear's depth can be observed on textured rake faces after long length cutting and textured rake faces presented half size of BUE regions comparing to the flat tool, however, once the texture morphologies were filled or worn, the anti-adhesion effect could be invalid. The bearing ratio curve was employed to analysis tool-chip contact and durability of textured surfaces contributing to a better understanding of anti-adhesion and enhanced durability of the textured tools.

• 대한기계학회논문집B
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• 제41권6호
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• pp.423-427
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• 2017

본 논문은 silicon-on-glass(SOG) 공정에서 접합력 균일도 향상을 위한 고정단 설계에 대한 내용을 다룬다. SOG 공정은 전극이 형성된 유리 기판층과 실리콘 구조층의 양극접합을 기반으로 하며, 가속도 센서와 공진형 센서를 비롯한 고종횡비 구조를 갖는 다양한 실리콘 센서들의 제작에 널리 사용된다. 본 논문에서는 전극과 유리 기판층의 표면 사이에 발생하는 단차로 인한 불균일한 접합을 방지하기 위해, 실리콘 구조층에서 유리 기판층과 접합되는 부분과 전극과 겹쳐지는 부분을 트렌치(trench)를 이용해 분리하는 새로운 형상의 고정단을 제안한다. 본 고정단은 추가적인 공정 없이 기존의 SOG 공정으로 제작되는 디바이스들에 손쉽게 적용이 가능하다.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.143-148
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• 2018

물유리 기반 실리카 에어로겔은 실리카 알콕사이드 기반 실리카 에어로겔에 비해 단가가 싸지만 기공률 및 비표면적과 같은 기공 특성이 상대적으로 열악하여 수요가 감소되고 있다. 이를 해결하기 위해 본 연구에서는 졸 상태에서 건조 제어 화학 첨가제(drying control chemical additive)인 아세토니트릴(acetonitrile)을 첨가하여 물성을 향상시키고자 하였다. 상압 건조 물유리 기반 실리카 에어로겔은 졸-겔 공정을 통해 제조되었으며, 졸 상태에서 물유리와 0, 0.05, 0.1, 0.15, 0.2의 몰 비율로 아세토니트릴을 첨가하여 실험을 수행하였다. 최종 생성물의 물성은 퓨리에 분광기(Fourier transform infrared), 접촉각측정기(contact angle measurement), Brunauer-Emmett-Teller 및 Barrett-Joyner-Halenda 분석기와 전계방사형 주사전자현미경(field emission scanning electron microscopy)를 이용하여 분석하였다. 졸 상태에서 물유리와의 몰 비율이 0.15인 아세토니트릴을 첨가한 샘플의 경우, 높은 비표면적 ($577m^2/g$), 높은 기공 부피 (3.29 cc/g), 높은 기공률 (93%)을 보유하여 실리카 알콕사이드 기반 실리카 에어로겔과 유사한 기공구조를 나타낼 수 있음을 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.344-344
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• 2014

Transparent amorphous oxide semiconductors such as a In-Ga-Zn-O (a-IGZO) have advantages for large area electronic devices; e.g., uniform deposition at a large area, optical transparency, a smooth surface, and large electron mobility >10 cm2/Vs, which is more than an order of magnitude larger than that of hydrogen amorphous silicon (a-Si;H).1) Thin film transistors (TFTs) that employ amorphous oxide semiconductors such as ZnO, In-Ga-Zn-O, or Hf-In-Zn-O (HIZO) are currently subject of intensive study owing to their high potential for application in flat panel displays. The device fabrication process involves a series of thin film deposition and photolithographic patterning steps. In order to minimize contamination, the substrates usually undergo a cleaning procedure using deionized water, before and after the growth of thin films by sputtering methods. The devices structure were fabricated top-contact gate TFTs using the a-IGZO films on the plastic substrates. The channel width and length were 80 and 20 um, respectively. The source and drain electrode regions were defined by photolithography and wet etching process. The electrodes consisting of Ti(15 nm)/Al(120 nm)/Ti(15nm) trilayers were deposited by direct current sputtering. The 30 nm thickness active IGZO layer deposited by rf magnetron sputtering at room temperature. The deposition condition is as follows: a rf power 200 W, a pressure of 5 mtorr, 10% of oxygen [O2/(O2+Ar)=0.1], and room temperature. A 9-nm-thick Al2O3 layer was formed as a first, third gate insulator by ALD deposition. A 290-nm-thick SS6908 organic dielectrics formed as second gate insulator by spin-coating. The schematic structure of the IGZO TFT is top gate contact geometry device structure for typical TFTs fabricated in this study. Drain current (IDS) versus drain-source voltage (VDS) output characteristics curve of a IGZO TFTs fabricated using the 3-layer gate insulator on a plastic substrate and log(IDS)-gate voltage (VG) characteristics for typical IGZO TFTs. The TFTs device has a channel width (W) of $80{\mu}m$ and a channel length (L) of $20{\mu}m$. The IDS-VDS curves showed well-defined transistor characteristics with saturation effects at VG>-10 V and VDS>-20 V for the inkjet printing IGZO device. The carrier charge mobility was determined to be 15.18 cm^2 V-1s-1 with FET threshold voltage of -3 V and on/off current ratio 10^9.

• 소성∙가공
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• 제25권6호
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• pp.379-389
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• 2016

As a stator for steam turbine diaphragm, hollow-type nozzle stator to substitute for conventional solid one is introduced in this study. This hollowed stator can be separated into two parts such as upper and lower plates with large and curved surface area. This study focuses on thick plate forming process for the upper plate of the hollow-partitioned nozzle stator. First, to reduce forming defects such as under-cut and localized thinning of the deformed plate, and to avoid tool interruption between forming punch and lower die, tool design including the position determination of forming surfaces is performed. Uni-axial tensile tests are carried out using SUS409L steel plate with initial thickness of 5.00mm, and plastic strain ratio (r-value) is also obtained. Due to the asymmetric curved configuration of the upper plate, it is hard to adopt a series of blank holder or draw-bead, so the initial plate during this thick plate forming experiences unstable and non-uniform contact. To easy this forming difficulty and find suitable tool geometry without sliding behavior of the workpiece in the die cavity, two geometric parameters with respect to each shoulder angle of the lower die and the upper punch are adopted. FE models with consideration of 21 combinations for the geometric parameters are built-up, and numerical simulations are performed. From the simulated and predicted results, it is shown that the geometric parameter combinations with ($30^{\circ}$, $90^{\circ}$) and ($45^{\circ}$, $90^{\circ}$) for the shoulder angle of the lower die and the upper punch are suitably applied to this upper plate forming of the hollow-partitioned nozzle stator used for the turbine diaphragm.