• Journal of the Korean Society for Precision Engineering
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• v.20 no.8
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• pp.101-107
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• 2003

A new mechanical probe for 3-D feature measurement on coordinate measuring machines (CMMs) is presented. The probe is composed of the contact stylus and the three-component force sensor. With the stylus mounted on the force sensor, the probe can not only measure 3-D features, but also detect contact force acting on the stylus tip. Furthermore, the probing direction and the actual contact position can be determined by the relationship among three components of contact force to be detected. In this paper, transformation matrix representing the relationship between the external force acting on the stylus tip and the output voltages of measurement gauges is derived and calibrated. The prototype of probe is developed and its availability is investigated through the experimental setup for calibration test of the probe. A series of experimental results show that the proposed probe can be an effective means of improving the accuracy of touch probing on CMM.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.2
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• pp.26-31
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• 2007

A novel scanning probe measurement system was developed to enable precise profile measurements of microaspheric surfaces. An air-bearing stylus with a microprobe was used to perform the surface profile scanning. The new system worked in a contact mode and had the capability of measuring micro-aspheric surfaces with large tilt angles and complex profiles. Due to limitations resulting from the contact mode, such as possible damage caused by the contact force and lateral resolution restrictions from the curvature of the probe tip, several system improvements were implemented. An air bearing was used to suspend the shaft of the probe to reduce the contact force, enabling fine adjustments of the contact force by changing the air pressure. The movement of the shaft was measured by a linear encoder with a scale attached to the actual shaft to avoid Abbe errors. A $50-{\mu}m-diameter$ glass sphere was bonded to the tip of the probe to improve the lateral resolution of the system. The maximum contact force of the probe was 10 mN. The shaft was capable of holding the probe continuously if the contact force was less than 40 mN, and the resolution of the probe could be as high as 10 nm, The performance of the new scanning probe measurement system was verified by experimental data.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.12
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• pp.1087-1091
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• 2005

Four-probe device of single ZnO nanowire was fabricated by electron beam lithography. Electrical characterizations in a two-probe and a four-probe configuration with a back-gate were carried out to clarify the relative contribution of the contact and the intrinsic part in a ZnO nanowire. I-V characteristic in four-probe measurement showed an ohmic behavior with a high conductivity, 100 S/cm, which was better than those of two-probe measurement by 10 times. At the same values of the current between two-probe and four-probe, the net voltage applied inside the nanowire were extracted with calculated voltages at the contact. Four-probe current-gate voltage characteristics showed bigger tendencies than those of two-probe measurement at low temperatures, indicating the reduced gate dependence in two-Probe measurements by the existence of the contact resistance.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• ETRI Journal
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• v.27 no.4
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• pp.433-438
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• 2005

We present a new type of silicon micro-probe card using a three-dimensional probe beam of the cantilever type. It was fabricated using KOH and dry etching, a porous silicon micromachining technique, and an Au electroplating process. The cantilever-type probe beam had a thickness of $5 {\mu}m$, and a width of $50{\mu}$ and a length of $800 {\mu}m$. The probe beam for pad contact was formed by the thermal expansion coefficient difference between the films. The maximum height of the curled probe beam was $170 {\mu}m$, and an annealing process was performed for 20 min at $500^{\circ}C$. The contact resistance of the newly fabricated probe card was less than $2{\Omega}$, and its lifetime was more than 20,000 turns.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.10
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• pp.324-329
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• 2018

This study examined the effects of the contact position and structure of the test probe on its signal transmission characteristics. The contact position in the operating of the test probe was considered and then divided into the plunger inner contact and barrel inlet contact. The high frequency performance of the test probes was investigated for both contact positions. The signal transmission characteristics of the test probes with the structures of double, single, and out-spring was also analyzed. The insertion and return losses were calculated using the HFSS and the characteristic impedance of the test probes was analyzed using a Q3D simulation. The insertion loss of the barrel inlet contact was smaller than that of the plunger inner contact. The contact position of the test probe may result in a change in the high frequency performance. The out-spring probe has better frequency characteristics at -1 dB insertion loss and -10 dB return loss. The double probe and single probe have the same characteristic impedance with $30.8{\Omega}$. On the other hand, the out-spring probe has an impedance of $47.1{\Omega}$. The out-spring probe is closer to $50{\Omega}$ than the other probes and then shows higher signal transmission characteristics. The out-spring probe has superior high-frequency characteristics and is expected to be suitable for high-speed applications.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1730-1733
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• 2007

As semiconductor and MEMS devices become smaller, testing process during their production should follow such a high density trend. A circuit inspection tool "probe card" makes contact with electrode pads of the device under test (DUT). Nowadays, electrode pads are irregularly arranged and have height difference. In order to absorb variations in the heights of electrode pads and to generate contact loads, contact probes must have some levels of mechanical spring properties. Contact probes must also yield a force to break the surface native oxide layer or contamination layer on the electrodes to make electric contact. In this research, new vertical micro contact probe with bellows shape is developed to overcome shortage of prior work. Especially, novel bellows shape is used to reduce stress concentration in this design and stopper is used to change the stiffness of micro contact probe. Variable stiffness can be one solution to overcome the height difference of electrode pads.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.501-505
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• 1996

In CMM system, a contact probe is not applicable to very small, or flexible elements. There is need to develop non-contact probes of CCD camera. But non-contact probes have some technical problems, including distortion, user interface and time delay. This development gives the foundation of the non-contact probe system and some useful solutions for the problems. The results can be useful for industry application.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.3
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• pp.56-61
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• 2003

This paper described about on-machine profile measurement of aspheric surfaces using contact probing technique in ultra precision machine. A contact probe has been designed as a sensing device to obtain measuring resolutions in nanometer regime using a circle leaf spring mechanism and a capacitive-type sensor. The contact probe which is installed on the z-axis is In touch with the aspheric objects which is fixed on the spindle of the diamond turning machine(DTM) during the measuring procedure. The x, z-axis motions of the machine are monitored by a set of two orthogonal plane mirror type laser interferometers. As a results, the developed contact probe on-machine measurement system showed 10 nanometers repeatability with a ${\pm}2{\sigma}$ and uncertainty of 200 nmPv.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1265-1266
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• 2013