• 한국정밀공학회지
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• 제20권8호
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• pp.101-107
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• 2003

A new mechanical probe for 3-D feature measurement on coordinate measuring machines (CMMs) is presented. The probe is composed of the contact stylus and the three-component force sensor. With the stylus mounted on the force sensor, the probe can not only measure 3-D features, but also detect contact force acting on the stylus tip. Furthermore, the probing direction and the actual contact position can be determined by the relationship among three components of contact force to be detected. In this paper, transformation matrix representing the relationship between the external force acting on the stylus tip and the output voltages of measurement gauges is derived and calibrated. The prototype of probe is developed and its availability is investigated through the experimental setup for calibration test of the probe. A series of experimental results show that the proposed probe can be an effective means of improving the accuracy of touch probing on CMM.

• International Journal of Precision Engineering and Manufacturing
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• 제8권2호
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• pp.26-31
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• 2007

A novel scanning probe measurement system was developed to enable precise profile measurements of microaspheric surfaces. An air-bearing stylus with a microprobe was used to perform the surface profile scanning. The new system worked in a contact mode and had the capability of measuring micro-aspheric surfaces with large tilt angles and complex profiles. Due to limitations resulting from the contact mode, such as possible damage caused by the contact force and lateral resolution restrictions from the curvature of the probe tip, several system improvements were implemented. An air bearing was used to suspend the shaft of the probe to reduce the contact force, enabling fine adjustments of the contact force by changing the air pressure. The movement of the shaft was measured by a linear encoder with a scale attached to the actual shaft to avoid Abbe errors. A $50-{\mu}m-diameter$ glass sphere was bonded to the tip of the probe to improve the lateral resolution of the system. The maximum contact force of the probe was 10 mN. The shaft was capable of holding the probe continuously if the contact force was less than 40 mN, and the resolution of the probe could be as high as 10 nm, The performance of the new scanning probe measurement system was verified by experimental data.

• 한국전기전자재료학회논문지
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• 제18권12호
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• pp.1087-1091
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• 2005

Four-probe device of single ZnO nanowire was fabricated by electron beam lithography. Electrical characterizations in a two-probe and a four-probe configuration with a back-gate were carried out to clarify the relative contribution of the contact and the intrinsic part in a ZnO nanowire. I-V characteristic in four-probe measurement showed an ohmic behavior with a high conductivity, 100 S/cm, which was better than those of two-probe measurement by 10 times. At the same values of the current between two-probe and four-probe, the net voltage applied inside the nanowire were extracted with calculated voltages at the contact. Four-probe current-gate voltage characteristics showed bigger tendencies than those of two-probe measurement at low temperatures, indicating the reduced gate dependence in two-Probe measurements by the existence of the contact resistance.

• 한국전기전자재료학회논문지
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• 제19권9호
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• ETRI Journal
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• 제27권4호
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• pp.433-438
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• 2005

We present a new type of silicon micro-probe card using a three-dimensional probe beam of the cantilever type. It was fabricated using KOH and dry etching, a porous silicon micromachining technique, and an Au electroplating process. The cantilever-type probe beam had a thickness of $5 {\mu}m$, and a width of $50{\mu}$ and a length of $800 {\mu}m$. The probe beam for pad contact was formed by the thermal expansion coefficient difference between the films. The maximum height of the curled probe beam was $170 {\mu}m$, and an annealing process was performed for 20 min at $500^{\circ}C$. The contact resistance of the newly fabricated probe card was less than $2{\Omega}$, and its lifetime was more than 20,000 turns.

• 한국산학기술학회논문지
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• 제19권10호
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• pp.324-329
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• 2018

본 논문은 테스트 프로브의 플런저 접점 위치와 구조에 따른 신호 전달 특성 변화를 분석하였다. 플런저 접점 위치는 실제 동작 상황을 고려하였으며, 플런저 내부 접점과 바렐 입구 접점으로 나누어 테스트 프로브의 고주파 성능 변화를 조사하였다. 또한 테스트 프로브는 더블, 싱글, 아웃스프링의 3 가지 구조로 나누고 구조 차이에 따른 신호 전달 특성 변화를 분석하였다. 고주파 전자기 해석 툴 HFSS를 사용하여 삽입손실과 반사손실을 계산하고, Q3D 시뮬레이션을 이용하여 테스트 프로브의 임피던스를 분석한다. 접점 위치에 따른 계산 결과, 바렐 입구 접점의 삽입손실이 플런저 내부 접점보다 감소하였다. 이를 통해 테스트 프로브의 접점 위치에 따라 테스트 프로브의 고주파 성능이 달라질 수 있음을 확인하였다. 구조에 따른 신호 전달 특성의 비교 분석에서는 아웃스프링 프로브가 보다 우수한 삽입손실과 반사손실 주파수 특성을 보여주었다. 테스트 프로브 구조별로 특성 임피던스를 계산하였으며 더블 프로브와 싱글 프로브는 $30.8{\Omega}$으로 동일한 결과를 보여주었다. 반면에 아웃스프링 프로브는 $47.1{\Omega}$의 결과가 나타났다. 아웃스프링 프로브의 특성 임피던스가 $50{\Omega}$에 보다 근접하여 높은 신호 전달 특성을 보인 것으로 분석된다. 아웃스프링 프로브가 높은 삽입손실과 반사손실 특성을 보여 고속 동작 제품의 성능 검사에 적합한 것으로 예상한다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1730-1733
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• 2007

As semiconductor and MEMS devices become smaller, testing process during their production should follow such a high density trend. A circuit inspection tool "probe card" makes contact with electrode pads of the device under test (DUT). Nowadays, electrode pads are irregularly arranged and have height difference. In order to absorb variations in the heights of electrode pads and to generate contact loads, contact probes must have some levels of mechanical spring properties. Contact probes must also yield a force to break the surface native oxide layer or contamination layer on the electrodes to make electric contact. In this research, new vertical micro contact probe with bellows shape is developed to overcome shortage of prior work. Especially, novel bellows shape is used to reduce stress concentration in this design and stopper is used to change the stiffness of micro contact probe. Variable stiffness can be one solution to overcome the height difference of electrode pads.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.501-505
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• 1996

In CMM system, a contact probe is not applicable to very small, or flexible elements. There is need to develop non-contact probes of CCD camera. But non-contact probes have some technical problems, including distortion, user interface and time delay. This development gives the foundation of the non-contact probe system and some useful solutions for the problems. The results can be useful for industry application.

• 한국기계가공학회지
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• 제2권3호
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• pp.56-61
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• 2003

This paper described about on-machine profile measurement of aspheric surfaces using contact probing technique in ultra precision machine. A contact probe has been designed as a sensing device to obtain measuring resolutions in nanometer regime using a circle leaf spring mechanism and a capacitive-type sensor. The contact probe which is installed on the z-axis is In touch with the aspheric objects which is fixed on the spindle of the diamond turning machine(DTM) during the measuring procedure. The x, z-axis motions of the machine are monitored by a set of two orthogonal plane mirror type laser interferometers. As a results, the developed contact probe on-machine measurement system showed 10 nanometers repeatability with a ${\pm}2{\sigma}$ and uncertainty of 200 nmPv.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.1265-1266
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• 2013