• 마이크로전자및패키징학회지
• /
• 제16권4호
• /
• pp.9-15
• /
• 2009

Cu pillar 범프를 사용한 플립칩 기술은 솔더범프를 사용한 플립칩 공정에 비해 칩과 기판 사이의 거리를 감소시키지 않으면서 미세피치 접속이 가능하다는 장점이 있다. Cu pillar 범프를 사용한 플립칩 공정은 미세피치화와 더불어 기생 캐패시턴스를 억제하기 위해 칩과 기판 사이에 큰 거리가 요구되는 RF 패키지에서도 유용한 칩 접속공정이다. 본 연구에서는 Sn 캡을 형성한 Cu pillar 범프와 Sn 캡이 없는 Cu pillar 범프를 전기도금으로 형성한 후 플립칩 접속하여 Cu-Sn-Cu 샌드위치 접속구조를 형성하였다. Cu pillar 범프 상에 Sn 캡의 높이를 변화시키며 전기도금한 후, Sn 캡의 높이에 따른 Cu-Sn-Cu 샌드위치 접속구조의 접속저항과 칩 전단하중을 분석하였다. 직경 $25\;{\mu}m$, 높이 $20\;{\mu}m$인 Cu pillar 범프들을 사용하여 형성한 Cu-Sn-Cu 샌드위치 접속구조에서 $10{\sim}25\;{\mu}m$ 범위의 Sn 캡 높이에 무관하게 칩과 기판 사이의 거리는 $44\;{\mu}m$으로 유지되었으며, 접속부당 $14\;m{\Omega}$의 평균 접속저항을 나타내었다.

• Journal of Welding and Joining
• /
• 제24권3호
• /
• pp.34-41
• /
• 2006

The CD (Capacitor Discharge) stud welding utilizes the arc heat and pressure to attach the stud to the workpiece, which consists of the arc. ignition, arcing and pressure welding stages. In order to predict the dynamic behavior of the CD stud welding process, mechanical and electrical models are employed in this work. While the mechanical model estimates the duration of each stage, the electrical model predicts the voltage and current waveforms using the RLC circuit. Effects of process parameters such as the electric components and spring force are analyzed through simulation. It is found that the contact resistance and gap between the stud and base metal influence the tip fusing and arcing duration. The calculated results showed reasonably good agreements with the experiment results.

• Journal of Welding and Joining
• /
• 제25권3호
• /
• pp.45-50
• /
• 2007

The present study is devoted to investigate the transient flow and to estimate the filling time fur underfill process by using the numerical model established on the fluid momentum equation. For optimization of the design and selection of process parameters, this study extensively presents an estimation of the filling time in the view points of some important factors related to underfill materials and flip-chip geometry. From the results, we conclude that the filling time changes with respect to the under fill materials because of different viscosity, surface tension coefficient and contact angle. It reveals that, as the gap height increases, the filling time decreases substantially, and goes to the saturated values.

• 전력전자학회:학술대회논문집
• /
• 전력전자학회 2004년도 추계학술대회 논문집
• /
• pp.45-48
• /
• 2004

To improve the efficiency characteristics in the resonant converter using the contact-less power supply with the large air-gap and the long primary winding, this paper suggests the three-level series-parallel resonant converter(SPRC). The voltage gain characteristics of the proposed converter have the unit gain in a resonance frequency point of the series and parallel, and input voltage and current in the primary of SPRC are always In phase for the all equivalent load resistance because of the parallel resonant tank of the high impedance. The results are verified on the simulation based on the theoretical analysis and the 4kW experimental prototype.

• 전기학회논문지
• /
• 제63권9호
• /
• pp.1180-1185
• /
• 2014

This paper describes the effects on SUS tube of power optical fiber composite cable on underground transmission lines. The effects on grounding, air gap between SUS tube and metal sheath, contact resistance between outer semi-conducting layer and metal sheath and grounding of SUS tube application or not are variously analysed using EMTP in normal operating condition as well as single line to ground fault. From these results, in this paper, the scheme for protecting the electrically abnormal phenomena will be established on power-optical fiber composite cable of underground transmission lines. This paper can contribute to specification of grounding reference of SUS tube of optical fiber composite power cable system.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2011년도 제42회 하계학술대회
• /
• pp.531-532
• /
• 2011

This paper describes the characteristics analysis of power-optical fiber composite cable on underground transmission lines. The effects on grounding, air gap and contact resistance are variously analysed using EMTP in normal operating condition. From these results, in this paper, the scheme for protecting the electrically abnormal phenomena will be established on power-optical fiber composite cable of underground transmission lines.

• 한국반도체및디스플레이장비학회:학술대회논문집
• /
• 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
• /
• pp.193-198
• /
• 2007

The NiSi is very promising candidate for the metallization in 60nm CMOS process such as FUSI(fully silicided) gate and source/drain contact because it exhibits non-size dependent resistance, low silicon consumption and mid-gap workfunction. Ni film was first deposited by using ALD (atomic layer deposition) technique with Bis-Ni precursor and $H_2$ reactant gas at $220^{\circ}C$ with deposition rate of $1.25{\AA}/cycle$. The as-deposited Ni film exhibited a sheet resistance of $5{\Omega}/{\square}$. RTP (repaid thermal process) was then performed by varying temperature from $400^{\circ}C$ to $900^{\circ}C$ in $N_2$ ambient for the formation of NiSi. The process window temperature for the formation of low-resistance NiSi was estimated from $600^{\circ}C$ to $800^{\circ}C$ and from $700^{\circ}C$ to $800^{\circ}C$ with and without Ti capping layer. The respective sheet resistance of the films was changed to $2.5{\Omega}/{\square}$ and $3{\Omega}/{\square}$ after silicidation. This is because Ti capping layer increases reaction between Ni and Si and suppresses the oxidation and impurity incorporation into Ni film during silicidation process. The NiSi films were treated by additional thermal stress in a resistively heated furnace for test of thermal stability, showing that the film heat-treated at $800^{\circ}C$ was more stable than that at $700^{\circ}C$ due to better crystallinity.

• 한국산림과학회지
• /
• 제82권4호
• /
• pp.337-346
• /
• 1993

본(本) 연구(硏究)는 상수리나무(Quercus acutissima)와 은행나무(Ginkgo biloba) 유묘(幼苗)를 대상으로, 12주간 pH 4.0 또는 pH 2.5의 인공산성우(人工酸性雨)(Simulated acid rain ; SAR)에 노출(露出)시켜 기공저항성(氣孔抵抗性)과 엽(葉)의 Wettability 및 해부학적(解剖學的) 변화(變化)를 파악(把握)하고자 실행(實行)하였다. 대조구로는 pH 6.5의 증류수를 살포(撒布)하였다. 상수리나무와 은행나무의 기공저항성(氣孔抵抗性)은 두 수종(樹種) 모두 SAR처리에 의하여 높아졌으며, 색소(色素)(Water blue solution)의 부착정도 측정(測定)에 의한 상수리나무 엽(葉)의 Wettability는 SAR처리에 의하여 증가(增加)하였고, Contact angle측정(測定)에 의한 은행나무 엽(葉)의 Wettability 역시 SAR처리에 의하여 증가(增加)하였다. SAR을 처리(處理)한 상수리나무 엽조직(葉組織)에서 표피세포, 책상조직 및 해면상조직의 부분적(部分的)인 피해(被害)가 관찰되었고, 모용(毛茸)(Trichome)의 현저한 감소(減少)와 Wax층(層)의 침식이 SEM을 통해 관찰(觀察)되었다. 은행나무의 엽조직(葉組織)은 pH 4.0처리에서는 피해(被害)를 관찰(觀察)할 수 없었으나, pH 2.5처리에서는 표피세포 및 통도조직의 붕괴가 관찰(觀察)되었고, SEM에 의한 엽(葉) 표면조직(表面組織)의 관찰(觀察)에서는 현저한 변화(變化)를 찾아볼 수 없었다.

• 대한전자공학회논문지SD
• /
• 제47권8호
• /
• pp.1-6
• /
• 2010

본 논문에서는 무분극 GaN층에서 관찰되는 성장축의 방향성에 따른 전기적 비등방성에 대한 연구를 수행하였다. 본 연구를 위해 $\gamma$-plane 사파이어 기판 상에 유기화학기상증착법 (Metal-organic chemical vapor deposition)을 이용하여 600 nm 두께의 ${\alpha}$-plane n-type GaN층을 성장시킨 후, Ti/Al/Ni/Au (20 nm/ 150 nm/ 30 nm/ 100 nm) 오믹 전극을 증착하여 transfer length method (TLM)로 접촉저항을 측정하였다. 그 결과, ${\alpha}$-plane GaN층이 갖는 축의 방향성에 의한 접촉저항이 차이는 없는 것을 확인하였고, 면저항 측정 시에는 m-축 방향에 비해 c-축 방향에서 발생하는 면저항 값이 약 25%~75% 정도 크게 발생하는 것을 확인할 수 있었다. 이러한 전기적 특성의 비등방성은 c-축 성장방향에 대해 수직방향을 갖는 기저적층결함 (basal stacking faults)의 생성으로 인한 전자들의 거동 저하에 의한 것으로 사료된다.

• 한국의류산업학회지
• /
• 제17권3호
• /
• pp.462-475
• /
• 2015

This paper investigated the characteristics of the physical properties of woven fabrics according to the yarn structure and fibre property. It was found that wicking property of woven fabrics made of sheath/core hybrid yarn were better than those of siro spun and siro-fil hybrid yarns, which was caused by platform for transport of moisture vapor by filaments on the core part of sheath core hybrid yarns. In drying property, the fabric specimen woven by PP/Tencel sheath core hybrid yarns as a warp and Coolmax/Tencel spun yarn as a weft showed quick drying property, which was caused by the sheath core hybrid yarn structure as drainage of water moisture and coolmax fibre characteristics as quick dry material. Concerning to breathability and thermal conductivity as heat transport phenomena, it was observed that breathability of fabrics woven with hybrid yarns such as sheath core and siro-fil in the warp and hi-multi filaments in the weft showed the lowest water vapor resistance, which was explained as due to for air gap in the fibres of the spun yarns to restrict the wet heat transport from perspiration vapor. Thermal conductivities of the fabrics woven with PET/Tencel siro-fil yarns in the weft and hybrid yarns such as sheath core and siro-fil in the warp revealed the highest values, which was observed as due to higher thermal conductivity of PET than PP and more contact point between fibres in the siro-fil and sheath core hybrid yarns.