• Proceedings of the KSME Conference
• /
• 2007.05b
• /
• pp.2488-2493
• /
• 2007

A gap conductance is very important factor which can affect nuclear fuel temperature. Especially, in case of an annular fuel, a gap conductance effect can lead an unexpected heat split phenomena which is caused by a large difference of an inner and outer gap conductance. The gap conductance mechanism is very complicated behavior due to the its strong dependency on microscopic factors such as a contact surface roughness, local contact pressure and local temperature. In this paper, for the decision of test temperature and pressure range, a procedure and calculation results of in-reactor fuel temperature and pressure analysis are summarized which can be applied to test equipment design and determination of test matrix. Based upon analysis results, it is concluded that the minimum and maximum test temperature are $300^{\circ}C$ and $530^{\circ}C$ respectively, and the maximum pellet/cladding interfacial contact pressure should be observed up to 45MPa.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.6
• /
• pp.1008-1012
• /
• 2012

Injection molds are fabricated by assembling a number of plates in which mold core and cavity components are inserted. The assembled structure causes a number of contact interfaces between each component where the heat transfer is affected by the thermal contact resistance. However, the mold assembly has been treated as a one body in numerical analyses of injection molding, which has a limitation in predicting the mold temperature distribution during the molding cycle. In this study, a numerical approach that considers the thermal contact effect is proposed to predict the heat transfer characteristics of an injection mold assembly. To find the thermal contact conductance between the mold core and plate, a number of finite element (FE) simulations were performed with the design of experiment (DOE) and statistical analysis. Thus, the heat transfer analyses using the obtained conductance values can provide more reliable results than conventional one-body simulations.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1996.04a
• /
• pp.629-634
• /
• 1996

Heat generation in machine operating condition makes thermal deformation and thermalstress in the structure, which results in the change the contact characteristics of machine joint such s change of shrinkage fit, contact heat conductance and contact pressure. As the change of contact pressure is related to variation of static, dynamic and thermalcharacteristics, the prediction of transient contact perssure is strongly required. This paper presents some analytical results which will be effective to predict static and dynamic characteristics of the compound cylindrical structure.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.32 no.2
• /
• pp.149-157
• /
• 2008

During CVD process of semiconductor wafer fabrication, maintaining the uniformity of temperature distribution at wafer top surface is one of the key factors affecting the quality of final products. Effect of contact conductance between wafer and hot plate on predicted temperature of wafer was investigated. The validity of opaque wafer assumption was also examined by comparing the predicted results with Discrete Ordinate solutions accounting for semitransparent radiative characteristics of silicon. As the contact conductance increases predicted wafer temperature increases and the differences between maximum and minimum temperatures within wafer and between wafer and hot plate top surface temperatures decrease. The opaque assumption always overpredicted the wafer temperature compared to semitransparent calculation. The influences of surrounding reactor inner wall temperature and hot plate configuration are then discussed.

• International Journal of Korean Welding Society
• /
• v.2 no.1
• /
• pp.1-10
• /
• 2002

The thermal contact conductance at different temperatures and with different electrode forces and zinc coating morphology was measured by monitoring the infrared emissions from the one dimensionally simulated contact heat transfer experiments. The contact heat transfer coefficients were presented as a function of the harmonic mean temperature of the two contacting surfaces. Using these contact heat transfer coefficients and experimentally measured temperature profiles, the electrical contact resistivities both for the faying interface and electrode-workpiece interface were deduced from the numerical analyses of the one dimension simulation welding. It was found that the average value of the contact heat transfer coefficients for the material with zinc coating (coating weight from 0 g/$mm^2$to 100 g/$mm^2$) ranges from 0.05 W/$mm^2$$^{\circ}C$ to 2.0 W/$mm^2$$^{\circ}C$ in the temperature range above 5$0^{\circ}C$ harmonic mean temperature of the two contacting surfaces. The electrical contact resistivity deduced from the one dimension simulation welding and numerical analyses showed that the ratio of electrical contact resistivity at the laying interface to the electrical contact resistivity at the electrode interface is smaller than one far both bare steel and zinc coated steel.

• Electrical & Electronic Materials
• /
• v.10 no.9
• /
• pp.895-900
• /
• 1997

A Quench in cable-in-conduit (CIC) conductors is often initiated by a disturbance such as strand motion that generates a highly localized normal zone in a strand or a few strands of the CIC conductors. The localized normal zone causes current and heat transfer between a disturbed strand and neighboring strands. Electrical and thermal contact characteristics between strands thus have an effect on the transient stability of the CIC conductors. In this paper the effect of contact characteristics between strands on the CIC conductor stability is presented based on the measured heat transfer characteristics of supercritical helium (SHe) for the local heating. The quench and recovery processes of the strands for the abrupt and highly localized disturbance are analyzed at the boundary between quench and recovery.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.40 no.1
• /
• pp.41-51
• /
• 2016

Friction generated from balls and grooves incurs temperature rise in the ballscrew system. Thermal deformation due to the heat degrades positioning accuracy of the feed drive system. To compensate for the thermal error, accurate prediction of the temperature distribution is required first. In this paper, to predict the temperature distribution according to the rotational speed, solid and hollow cylinders are applied for analysis of the ballscrew shaft and nut, respectively. Boundary conditions such as the convective heat transfer coefficient, friction torque, and thermal contact conductance (TCC) between balls and grooves are formulated according to operating and fabrication conditions of the ballscrew. Explicit FDM (finite difference method) is studied for development of a temperature prediction simulator. Its effectiveness is verified through numerical analysis.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2005.05a
• /
• pp.219-222
• /
• 2005

The temperature difference between die and workpiece has frequently caused various surface defects. The non-homogeneous temperature distribution of forged part should be analyzed to prevent the generation of various defects related with the temperature. The surface temperatures were mainly affected by the coefficient of thermal contact conductance. The precise coefficient is necessary to predict accurately the temperature changes of die and workpiece. The experiment is preformed to measure the temperature distribution of die and workpiece in closed die upsetting. And then, the coefficient is classified into function of pressure and confirmed by the comparison between experiments and FE analyses using the other model. The FE analysis to predict the temperature distribution is performed by commercial software $DEFORM-3D^{TM}$. However, it might be impossible to measure directly the temperature distribution of forged part. Therefore, the comparisons between measured temperature and predicted values are performed with the hardness of Al6061-forged part.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.24 no.9
• /
• pp.1219-1226
• /
• 2000

An efficient method is developed for plunger thermal cycle analysis in repeated forming process of the TV glass. The plunger undergoes temperature fluctuation during a cycle due to the repeated contact and separation from the glass, which attains a cyclic steady state having same temperature history at every cycle. Straightforward analysis of this problem brings about more than 80 cycles to get reasonable solution, and yet hard to setup stopping criteria due to extremely slow convergence. An exponential fitting method is proposed to overcome the difficulty, which finds exponential function to best approximate temperature values of 3 consecutive cycles, and new cycle is restarted with the fitted value at infinite time. Numerical implementation shows that it reduces the number of cycles dramatically to only 6-18 cycles to reach convergence within 10 accuracy. A system for the analysis is constructed, in which the thermal analysis is performed by commercial software ANSYS, and the fitting of the result is done by IMSL library. From the parametric studies, one reveals some important facts that although the plunger cooling or the glass thickness is increased, its counter part in contact is not much affected, duo to the low thermal conductance of the glass.