• Proceedings of the KWS Conference
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• 2006.10a
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• pp.128-129
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• 2006

To investigate impact property characteristics on the low temperature plate weld metal, the two different plates of the same steel grade were welded and evaluated by Mo bearing and no Mo containing welding consumables. The results are summarized as follows; 1) Multi pass welded Mo bearing weldment was not satisfied with the requirement of tensile strength, while no Mo containing one was satisfied with it 2) In the plate butt weldment, the impact property of weld metal was highly affected by both the welding consumable and plate.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.851-857
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• 2002

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi~level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40%. So, we focused how to reduce the consumption of raw slurry In this paper, we presented the pH changes of diluted slurry and pH control as a function of KOH contents. Also, the removal rates of slurry with different dilution ratio were investigated. Finally, the CMP characteristics were discussed as a function of silica (SiO$_2$) abrasive contents.

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.203-205
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• 2004

Welding sometimes should be done inside-hull after launching. The opposite side is contacted sea-water In this case, it should be a concern that the cooling rate expected very rapid may deteriorate microstructures, and hence these microstructures are hardened, cracking happens, or toughness would be impaired. Therefore, a test program simulating the situation has been planned and welded using the ship class materials (AH32, EH36) with the related welding consumables (E71Tl-1, E81Tl-K2) and then carried out to investigate the effect of cooling rate on weldments quality. Based on the test results, it could be concluded that the welds of which the opposite side of arc is exposed to wet or flowing water are not affected by rapid cooling.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.378-381
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• 2003

The chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.18-22
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• 2002

CMP(chemical mechanical polishing) process has attracted as an essential technology of multilevel interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40%. So, we focused that it has how to reduce the consumption of raw slurry. In this paper, we presented the pH changes of diluted slurry and pH control as a function of KOH contents. Also, the removal rates of slurry with different dilution ratio was investigated. Finally, CMP the characteristics as a function of silica($SiO_2$) abrasive contents were discussed.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.65-66
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• 2005

In order to evaluate disbonding properties caused by hydrogen on the Electro Slag Strip Welding for 1.25Cr-0.5Mo steel, two kinds of welding consumables were selected and tested under the disbonding condition of $97.2kgf/cm^{2}$ at $425^{\circ}C$. Chemical composition of the welds showed that they have similar chemical compositions. The microsturucture investigation, however, indicated that 'A' weld has high ratio of coarse grain area, while B weld has low. Disbonding results showed that high ratio coarse grain welds showed unacceptable, while low ratio coarse grain welds showed acceptable.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.127-128
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• 2007

To investigate mechanical property on the low temperature plate weld metal, the two different plates of the same steel grade were welded and evaluated on the multiple pass welds and both side one run welds with different Mo contents welding consumables. The results are summarized as follows; 1) Welds made by no Mo containing wire showed very low impact values for type of material company. 2) Welds made by 0.25%Mo containing wire showed good impact value regardless of both side one run welds and multiple pass welds. 3) Welds made by 0.5%Mo containing wire showed good impact value for both side one run welds, while it was not acceptable value for multiple pass welds.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.178-181
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• 2002

We studied the characteristics of polishing pad, which can apply W CMP process for global planarization of multilevel interconnection structure. Also we investigated the effects of different sets of polishing pad. The purpose of this experiment is the cost reduction by the increase of pad life time and decrease of cycle time and slurry usage with new pad. Especially we studied the effect of polishing pad for CMP process by this experiment of polishing pad that is consumables material during CMP process. We expecting the increase of process throughput and improvement of device manufacturing yield because we can choose optimum polishing pad through this result.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.1267-1268
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry (MAS). In order to save the costs of slurry, the original silica slurry was diluted by do-ionized water (DIW). And then, $ZrO_2,CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.1271-1272
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• 2006

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40%. So, we focused how to reduce the consumption of raw slurry. In this paper, $ZrO_2$, $CeO_2$, and $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. We have investigate the possibility of new abrasive for the oxide CMP application.