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http://dx.doi.org/10.4313/JKEM.2002.15.10.851

Effects of Diluted Silica Slurry and Abrasives on the CMP Characteristics  

박창준 (대불대학교 전기공학과)
김상용 (아남반도체 FAB사업부)
서용진 (대불대학교 전기공학과)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.15, no.10, 2002 , pp. 851-857 More about this Journal
Abstract
CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi~level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40%. So, we focused how to reduce the consumption of raw slurry In this paper, we presented the pH changes of diluted slurry and pH control as a function of KOH contents. Also, the removal rates of slurry with different dilution ratio were investigated. Finally, the CMP characteristics were discussed as a function of silica (SiO$_2$) abrasive contents.
Keywords
CMP(chemical mechanical polishing); DIW(do-ionized water); Dilution ratio; Abrasive;
Citations & Related Records
Times Cited By KSCI : 5  (Citation Analysis)
연도 인용수 순위
1 An optimization of tungsten plug chemical mechanical polishing(CMP) using different consumables /
[ W. S. Lee;S. Y. Kim;Y. J. Seo;J. K. Lee ] / Journal of Materials Science : Materials in Electronics   DOI   ScienceOn
2 CMP 공정에 사용되는 연마 소모자재의 기술의 이해 /
[ 정해도 ] / 전기전자재료   과학기술학회마을
3 Chemical Mechanical Polishing 공정 기술의 이해 /
[ 장의구 ] / 전기전자재료   과학기술학회마을
4 Study of micro-defect on oxide CMP in VLSI circuits /
[ S. Y. Kim;Y. J. Seo;W. S. Lee;E. G. Chang ] / Electrochem. Soc. Proc.
5 Optimization of chemical mechanical polishing from the viewpoint of consumable effect /
[ J. Luo;D. Dorfeld ] / Proceeding of VMIC
6 /
[ J. M. Steigerwald;S. P. Murarka;R. J. Getmann ] / Chemical Mechanical Planarization of Microelectronic Materials
7 Application of chemical mechanical polishing to the fabrication of VLSI circuit interconnection /
[ William J. Patrick ] / Journal of Electrochemical Society
8 CMP(Chemical Mechanical Polishing) 공정 /
[ 김종필;백운규 ] / Trends in Materials, Information Center for Materials
9 Chemical Mechanical Polishing 공정 변수의 이해 /
[ 김상용 ] / 전기전자재료   과학기술학회마을