• 한국염색가공학회지
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• 제28권1호
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• pp.48-56
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• 2016

Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at $80^{\circ}C$ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.

• Nuclear Engineering and Technology
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• 제52권9호
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• pp.1939-1944
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• 2020

Pool boiling heat transfer of a copper microporous coating was experimentally studied in borated water with a concentration of boric acid from 0.0 to 5.0 vol percent (vol%) to determine the effect of boric acid on boiling heat transfer in water. A high-temperature, thermally conductive microporous coating (HTCMC) was created by sintering copper powder with an average particle size of 67 ㎛ onto a 1 cm × 1 cm plain copper surface with a coating thickness of ~300 ㎛ within a furnace in a vacuum environment. The tests showed that the nucleate boiling heat transfer coefficient (NBHT) of HTCMC became slightly less enhanced as the concentration of boric acid increased but the NBHT coefficient values were still significantly higher than those of the plain surface. The critical heat flux (CHF) values from 0 to 1.0 vol% were maintained at ~2,000 kW/㎡, and then, they gradually decreased down to ~1,700 kW/㎡ as the concentration increased further to 5.0 vol%. It is believed that the micro-scale pores of the HTCMC were partially blocked by the high boric acid concentration during the nucleate boiling such that the small bubbles were not effectively created using the HTCMC reentrant cavities as the boric acid concentration increased.

• Composites Research
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• 제31권3호
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• pp.111-116
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• 2018

본 논문에서는 그래핀 표면에 무전해 도금을 통해 FeCoNi 자성 나노입자를 환원 성장시킨 후 이를 다양한 계면 활성제로 분산시켜 고분자 복합필름을 제조하였다. Pyridine 계면 활성제로 분산 시킨 후 제조한 복합필름은 가장 높은 분산성과 낮은 표면저항 값(351 Ohm/sq) 및 10 GHz 주파수에서 90% 이상의 전자파 차폐 능력을 보였다. 특히, 건조과정에서 pyridine의 증발은 내부 전도체 네트워크 형성과 분산성이 높은 필름 형성을 형성 할 수 있는 것으로 확인되었다.

• Current Photovoltaic Research
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• 제2권4호
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• pp.173-176
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• 2014

We have investigated the seed layer formation of front side contact using the inkjet printing process. Conductive silver ink was printed on textured Si wafers with 80 nm thick $SiN_x$ anti reflection coating (ARC) layers and thickened by light induced plating (LIP). The inkjet printable sliver inks were specifically formulated for inkjet printing on these substrates. Also, a novel method to prepare nano-sized glass frits by the sol-gel process with particle sizes around 5 nm is presented. Furthermore, dispersion stability of the formulated ink was measured using a Turbiscan. By implementing these glass frits, it was found that a continuous and uniform seed layer with a line width of $40{\mu}m$ could be formed by a inkjet printing process. We also investigated the contact resistance between the front contact and emitter using the transfer length model (TLM). On an emitter with the sheet resistance of $60{\Omega}/sq$, a specific contact resistance (${\rho}_c$) below $10m{\Omega}{\cdot}cm^2$ could be achieved at a peak firing temperature around $700^{\circ}C$. In addition, the correlation between the contact resistance and interface microstructures were studied using scanning electron microscopy (SEM). We found that the added glass particles act as a very effective fire through agent, and Ag crystallites are formed along the interface glass layer.

• Korean Chemical Engineering Research
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• 제47권2호
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• pp.203-207
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• 2009

소형 반도체 접착에 쓰이는 비전도성 고분자 접착제에서 발생하는 문제점으로는 접착소재와 칩 또는 기판 간의 열 팽창계수 차이에 의한 박리, 크래킹 및 접착력 부족 등이 있다. 이러한 결점의 보완을 위하여 무기입자를 첨가한 고분자 복합소재를 통해 접착제의 열팽창계수를 낮추거나, 접착소재에 유연성 첨가제를 첨가하는 방법 등이 사용되고 있다. 본 연구에서는 양 말단에 아민기를 가지는 아미노 변성 실록산(AMS)의 함량을 1, 3, 5 phr로 변화시켜 실록산/에폭시 복합재를 제조하였다. 그 결과, 실록산의 첨가는 유리전이 온도를 $134^{\circ}C$에서 $122^{\circ}C$까지, 모듈러스를 2,425 MPa에서 2,143 MPa까지 감소시켰으며, 열팽창계수는 67 ppm/에서 71 ppm/까지 상승시켰다. 실록산은 유연성 부여에는 효과를 나타냈지만, 유리전이온도의 감소를 가져오는 것을 확인하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.913-918
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• 2005

It is expected that the inkjet technology offers prospect for reliable and low cost manufacturing of FPD (Flat Panel Display). This inkjet technology also offers a more simplified manufacturing process for various part of the FPD than conventional process. For example, recently the novel manufacturing processes of color filter (C/F) in LCD, or RGB patterning in OLED by inkjet printing method have been developed. This elaborates will be considered as the precious point of manufacturing process for the mass production of enlarged-display panel with a low price. On this point of view, we would like to review the status of inkjet technology in FPD, with some results on forming micro line by inkjet patterning of suspension type silver nano ink as below. We have studied the inkjet patterning of synthesized aqueous silver nano-sol on interface-controlled ITO glass substrate. Furthermore, we designed the conductive ink for direct inkjet patterning on bare ITO glass substrate. The first, the highly concentrated polymeric dispersant-assisted silver nano sol was prepared. The high concentration of batch-synthesized silver nano sol was possible to 40 wt%. At the same time the particle size of silver nanoparticles was below $10{\sim}20nm$. The second, the synthesized silver nano sol was inkjet - patterned on ITO glass substrate. The connectivity and width of fine line depended largely on the wettability of silver nano sol on ITO glass substrate, which was controlled by surfactant. The relationship was understood by wetting angle. The line of silver electrode as fine as $50{\sim}100\;{\mu}m$ was successfully formed on ITO glass substrate. The last, the direct inkjet-patternable silver nano sol on bare ITO glass substrate was designed also.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.125-133
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• 2016

도전 페이스트의 필러로 사용되기 위한 미세 Cu 입자를 제조하기 위하여 아산화동 분말과 황산간의 고속 화학 반응을 이용한 증류수 기반의 습식 공정으로 Cu 입자의 합성을 실시하였다. $7^{\circ}C$에서 48%의 황산과 30 g의 $Cu_2O$를 사용한 조건에서 미반응 $Cu_2O$ 입자들이 제거되면서 입자들간의 응집이 개선된 순수 Cu 나노입자들이 제조되었다. 이후 최적 첨가제의 선택을 통하여 입자들간의 응집이 가장 억제된 224 nm 크기의 Cu 입자들을 제조할 수 있었다. 이러한 미세 Cu 입자 시료에서는 응집된 형태의 조대 입자들이 다소 존재하였고 입자들간의 연결부도 일부 관찰되었으나, 삼본밀을 사용한 레진 포물레이션과의 혼합 후에는 응집된 형태의 조대 입자들이 파괴되고 입자들간의 연결부들이 탈착되어 입자들의 응집이 풀리는 거동을 관찰할 수 있었다.

• Journal of Electrochemical Science and Technology
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• 제9권3호
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• pp.220-228
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• 2018

This study introduced a carbon-free electrode for $Li-O_2$ cells with the aim of suppressing the side reactions activated by carbon material. Micro-particles of poly(3,4-ethylenedioxythiophene) (PEDOT), a conducting polymer, were used as the base material for the air electrode of $Li-O_2$cells. The PEDOT micro-particles were treated with $H_2SO_4$ to improve their electronic conductivity, and LiBr and CsBr were used as the redox mediators to facilitate the dissociation of there action products in the electrode and reduce the over-potential of the $Li-O_2$ cells. The capacity of the electrode employing PEDOT micro-particles was significantly enhanced via $H_2SO_4$ treatment, which is attributed to the increased electronic conductivity. The considerable capacity enhancement and relatively low over-potential of the electrode employing $H_2SO_4$-treated PEDOT micro-particles indicate that the treated PEDOT micro-particles can act as reaction sites and provide storage space for the reaction products. The cyclic performance of the electrode employing $H_2SO_4$-treated PEDOT micro-particles was superior to that of a carbon electrode. The results of the Fourier-transform infrared spectroscopic analysis showed that the accumulation of residual reaction products during cycling was significantly reduced by introducing the carbon-free electrode based on $H_2SO_4$-treated PEDOT micro-particles, compared with that of the carbon electrode. The cycle life was improved owing to the effect of the redox mediators. The refore, the use of the carbon -free electrode combined with redox mediators could realize excellent cyclic performance and low over-potential simultaneously.

• 한국재료학회지
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• 제12권12호
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• pp.941-946
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• 2002

Both Cu and Cu-oxide nanopowders have great potential as conductive paste, solid lubricant, effective catalysts and super conducting materials because of their unique properties compared with those of commercial micro-sized ones. In this study, Cu and Cu-oxide nanopowders were prepared by Pulsed Wire Evaporation (PWE) method which has been very useful for producing nanometer-sized metal, alloy and ceramic powders. In this process, the metal wire is explosively converted into ultrafine particles under high electric pulse current (between $10^4$ and $10^{ 6}$ $A/mm^2$) within a micro second time. To prevent full oxidations of Cu powder, the surface of powder has been slightly passivated with thin CuO layer. X-ray diffraction analysis has shown that pure Cu nanopowders were obtained at $N_2$ atmosphere. As the oxygen partial pressure increased in $N_2$ atmosphere, the gradual phase transformation occurred from Cu to $Cu_2$O and finally CuO nanopowders. The spherical Cu nanopowders had a uniform size distribution of about 100nm in diameter. The Cu-oxide nanopowders were less than 70nm with sphere-like shape and their mean particle size was 54nm. Smaller size of Cu-oxide nanopowders compared with that of the Cu nanopowders results from the secondary explosion of Cu nanopowders at oxygen atmosphere. Thin passivated oxygen layer on the Cu surface has been proved by XPS and HRPD.

• 공업화학
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• 제20권2호
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• pp.227-233
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• 2009

최근 태양전지에 대한 관심이 급증하면서 염료감응형 태양전지(Dye-Sensitized Solar Cell, DSSC)에 관한 연구가 활발히 진행되고 있다. 염료감응형 태양전지에 관한 연구는 크게 $TiO_2$ 나노 결정 소재, 염료, 전해질 및 전도성 기판 등 4가지 분야로 나눌 수 있다. 본 연구에서는 염료를 흡착할 수 있는 나노결정성 $TiO_2$를 합성한 후, 이를 광전극용 페이스트(paste)에 다양한 형광물질(phosphor)의 종류 및 함량을 조절하여 첨가함으로써 염료감응형 태양전지의 효율에 미치는 영향을 조사하였다. 실험결과 400 nm 입자크기의 YAG계 형광체 0.5%가 첨가된 페이스트를 사용할 경우, 에너지 변환효율이 최대 8.31%에 도달함을 확인할 수 있었다.