Browse > Article

Effect of Amino Modified Siloxane on the Properties of Epoxy Composites for MEMS Adhesives  

Lee, Donghyun (Department of Chemical Engineering., Kwangwoon University)
Yu, Kihwan (Department of Chemical Engineering., Kwangwoon University)
Kim, Daeheum (Department of Chemical Engineering., Kwangwoon University)
Publication Information
Korean Chemical Engineering Research / v.47, no.2, 2009 , pp. 203-207 More about this Journal
Abstract
In the NCAs(non-conductive adhesive) for adhesion of Micro Electro Mechanical System(MEMS), there are some problems such as delamination and cracking, because of the differences of CTE(coefficients of thermal expansion) between NCAs and substrates. Addition of inorganic particle or flexibilizer have been performed to solve those problems. In this study, to improve the flexibility of epoxy adhesive, epoxy/siloxane composites were prepared by adding 1, 3, or 5 phr of amino modified siloxane(AMS). Glass transition temperatures(Tg), moduli and CTE of those composites were measured to confirm effects of siloxane on thermal/mechanical properties of siloxane/epoxy-composites. Tg of AMS/epoxy-composites decreased from $134^{\circ}C$ to $122^{\circ}C$ with increasing AMS contents and moduli decreased from 2,425 MPa to 2,143 MPa with increasing AMS contents. But CTE of AMS/epoxy-composites increased from $67ppm/^{\circ}C$ to $71ppm/^{\circ}C$ with increasing AMS contents. In short, the addition of siloxane is effective for enhancing the flexibility of epoxy but leads to the decrease of Tg.
Keywords
MEMS Adhesives; Epoxy Composites; Amino Modified Siloxane; Flexibility;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Matejka, L., Dukh, O. and Kolarik, J., "Reinforcement of Crosslinked Rubbery Epoxies by in-situ Formed Silica," Polymer, 41, 1449 (2000)   DOI   ScienceOn
2 Haas, K. H. and Wolter, H., "Synthesis, Properties and Applications of Inorganic–organic Copolymers," Curr. Opin. Solid St. M., 4, 571(1999)   DOI   ScienceOn
3 Min, B. K., 'The Concept of Composite Material and It's Appli-cation,' Polymer (Korea), 12, 599(1988)
4 Morita, Y., Tajima, S., Suzuki, H. and Sugino, H., "Thermally Initiated Cationic Polymerization and Properties of Epoxy Siloxane," Journal of Applied Polymer Science, 100, 2010-2019(2006)   DOI   ScienceOn
5 Nagendiran, S., Premkumar, S. and Alagar, M., "Mechanical and Morphological Properties of Organic-inorganic, Hybrid, Clay-filled, and Cyanate Ester/siloxane Toughened Epoxy Nanocomposites," Journal of Applied Polymer Science, 106, 1263-1273 (2007)   DOI   ScienceOn
6 Yeh, J. M., Huang, H. Y., Chen, C. L., Su, W. F. and Yu, Y. H., 'Siloxane-modified Epoxy Resin–clay Nanocomposite Coatings with Advanced Anticorrosive Properties Prepared by a Solution Dispersion Approach," Surface & Coatings Technology, 200, 2753-2763(2006)   DOI   ScienceOn
7 Lee, J. W. and Yoo, J. Y., "Die Attach Adhesive Films for Semiconductor Chip Stacking Process," 2006 TCI Report, 1-60(2006)
8 Kim, J. M., 'Recent Advances on Conductive Adhesives in Electronic Packaging,' Journal of KWJS, 25, 133-138(2007)
9 Matejka, L., Dusek, K., Kriz, J. and Lednicky, F., "Formation and Structure of the Epoxy-silica Hybrids," Polymer, 40, 171(1998)   DOI   ScienceOn
10 Li, Y. and Wong, C. P., "Recent Advances of Conductive Adhesives as a Lead-free Alternative in Electronic Packaging: Materials, Processing, Reliability and Applications", Materials Science and Engineering R: Reports, 51, 1-35(2006)   DOI   ScienceOn
11 Salahuddin, N., Moet, A., Hiltner, A. and Baer, E., "Nanoscale Highly Filled Epoxy Nanocomposite," Eur. Polym. J., 38, 1477 (2002)   DOI   ScienceOn
12 Gong, H. J. and Kim, W., 'Properties of Epoxy Adhesive Modified with Siloxane-imide,' Elastomer, 43, 39-48(2008)
13 Wang, M. W., Wu, H. and Lin, M. S., "Synthesis, Curing Behavior and Properties of Siloxane and Imide-containing Tetrafunctional Epoxy," Journal of Polymer Research, 15, 1-9(2008)   DOI   ScienceOn
14 Ahmad, S., Gupta, A. P., Sharmin, E., Alam, M. and Pandey, S. K., "Synthesis, Characterization and Development of High Performance Siloxane-modified Epoxy Paints," Progress in Organic Coatings, 54, 248-255(2005)   DOI   ScienceOn
15 Marimuthu, S., Madurai, S. L. and Boreddy, S. R. R., "Chemistry of Siloxane Amide as a New Curing Agent for Epoxy Resins: Material Characterization and Properties," Macromol. Chem. Phys. 206, 2501-2511(2005)   DOI   ScienceOn
16 Lee, H., Fasulo, P. D., Rodgers, W. R. and Paul, D. R., "TPO Based Nanocomposites. Part 2. Thermal Expansion Behavior," Polymer, 47, 3528-3539(2006)   DOI   ScienceOn
17 Li, H. T., Lin, M. S., Chuang, H. R. and Wang, M. W., "Siloxaneand Imide-modified Epoxy Resin Cured with Siloxane-containing Dianhydride," Journal of Polymer Research, 12, 385-391(2005)   DOI   ScienceOn
18 Park, S. J., Jin, F. L., Park, J. H. and Kim, K. S., "Synthesis of a Novel Siloxane-containing Diamine for Increasing Flexibility of Epoxy Resins," Materials Science and Engineering: A, 399, 377-381(2005)   DOI   ScienceOn