• 한국재료학회지
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• 제25권3호
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• pp.132-137
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• 2015

The effects of the mixing of an active material and a conductive additive on the electrochemical performance of an electric double layer capacitor (EDLC) electrode were investigated. Coin-type EDLC cells with an organic electrolyte were fabricated using the electrode samples with different ball-milling times for the mixing of an active material and a conductive additive. The ball-milling time had a strong influence on the electrochemical performance of the EDLC electrode. The homogeneous mixing of the active material and the conductive additive by ball-milling was very important to obtain an efficient EDLC electrode. However, an EDLC electrode with an excessive ball-milling time displayed low electrical conductivity due to the characteristic change of a conductive additive, leading to poor electrochemical performance. The mixing of an active material and a conductive additive played a crucial role in determining the electrochemical performance of EDLC electrode. The optimal ball-milling time contributed to a homogeneous mixing of an active material and a conductive additive, leading to good electrochemical performance of the EDLC electrode.

• Current Photovoltaic Research
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• 제4권4호
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• pp.140-144
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• 2016

In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.154-154
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• 2008

Although the screen printing technology using photosensitive carbon nanotube (CNT) paste has many advantages such as low cost, simple process, uniform emission, and capability of mass production, the CNT paste needs to be improved further in CNT dispersion, printability, adhesion, electrical conductivity, population of CNT emitters, etc. Ball milling has been frequently employed to prepare the CNT paste as ball milling can mix its ingredients very well and easily cut the long, entangled CNTs. This study carried out a parametric approach to fabricating the CNT paste in terms of low-energy ball milling and a paste composition. Field emission properties of the CNT paste was characterized with CNT dispersion and electrical conductivity which were measured by a UV-Vis spectrophotometer and a 4-point probe method, respectively. Main variables in formulating the CNT paste include a length of milling time, and amounts of CNTs and conductive inorganic fillers. In particular, we varied not only the contents of conductive fillers but also used two different sizes of filler particles of ${\mu}m$ and nm ranges. Among many variations of conductive fillers, the best field emission characteristics occurred at the 5 wt% fillers with the mixing ratio of 3:1 for ${\mu}m$-and nm-sizes. The amount and size of fillers has a great effect on the morphology, processing stability, and field emission characteristics of CNT emitter dots. The addition a small amount of nm-size fillers considerably improved the field emission characteristics of the photosensitive CNT paste.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1277-1282
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• 2008

Recently LCD panels have becom very important components for portable electronics. In the high density interconnection material, ACF's are used to connect the outer lead of the tape automated bonding to the transparent indium tin oxide electrodes of the LCD panel. ACF consists of an adhesive polymer matrix and randomly dispersed conductive balls. In this study, we analyzed Failure Mode / Mechanism of ACF which is identified Conductive ball Corrsion, Delamination, Crack and Polymer Expansion / Swelling. In ALT(Accelerated Life Test), we select primary stress factors as temperature and humidity. As time passes by, an increase of connection resistance was observed. In conclusion, we have found that high temperature / humidity affects the adhesion.

• 센서학회지
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• 제14권6호
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• pp.374-380
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• 2005

Vibration sensors have a wide scope of applications in the field of monitoring systems that needs to perceive an undesirable physical vibration before a critical failure occurs in a system, and then costly unplanned repairs can be avoided. The conventional vibration sensors developed so far have many disadvantages, such as complex manufacturing process, bulkiness, high cost, less reliability and so on. This paper reports a simple-structured vibration sensor, which has been developed using a commercialized conductive ball and silicon bulk-micromachining technology. The sensor consists of a conductive ball placed in $600{\mu}m$-deep micromachined silicon groove, in which Au thin film has been patterned using a shadow mask technique. Prior to the formation of the Au thin film, the sharp convex corner was rounded for smooth meatl deposition on the non-planar surface at the edge of the groove. The measurement results of the fabricated vibration sensor demonstrate a stable response characteristic to low-frequency vibration range ($1{\sim}30{\;}Hz$).

• ETRI Journal
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• 제32권3호
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• pp.414-421
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• 2010

The interconnection mechanisms of a smart anisotropic conductive adhesive (ACA) during processing have been characterized. For an understanding of chemorheological mechanisms between the fluxing polymer and solder powder, a thermal analysis as well as solder wetting and coalescence experiments were conducted. The compatibility between the viscosity of the fluxing polymer and melting temperature of solder was characterized to optimize the processing cycle. A fluxing agent was also used to remove the oxide layer performed on the surface of the solder. Based on these chemorheological phenomena of the fluxing polymer and solder, an optimum polymer system and its processing cycle were designed for high performance and reliability in an electrical interconnection system. In the present research, a bonding mechanism of the smart ACA with a polymer spacer ball to control the gap between both substrates is newly proposed and investigated. The solder powder was used as a conductive material instead of polymer-based spherical conductive particles in a conventional anisotropic conductive film.

• 한국분말재료학회지
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• 제16권6호
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• pp.424-430
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• 2009

Electromagnetic wave energies are consumed in the form of thermal energy, which is mainly caused by magnetic loss, dielectric loss and conductive loss. In this study, CNT was added to the nanocrystalline soft magnetic materials inducing a high magnetic loss, in order to improve the dielectric loss of the EM wave absorption sheet. Generally, the aspect ratio and the dispersion state of CNT can be changed by the pre-ball milling process, which affects the absorbing properties. After the various ball-milling processes, 1wt% of CNTs were mixed with the nanocrystalline $Fe_{73}Si_{16}B_7Nb_{3}Cu_1$ base powder, and then further processed to make EM absorption sheets. As a result, the addition of CNT to Fe-based nanocrystalline materials improved the absorption properties. However, the increase of ball-milling time for more than 1h was not desirable for the powder mixture, because the ballmilling caused the shortening of CNT length and the agglomeration of the CNT flakes.

• 한국분말재료학회지
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• 제25권4호
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• pp.291-295
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• 2018

A conductive additive is prepared by dispersing multi-walled carbon nanotubes (MWCNTs) on Cu powder by mechanical milling and is distributed in epoxy to enhance its electrical conductivity. During milling, the MWCNTs are dispersed and partially embedded on the surface of the Cu powder to provide electrically conductive pathways within the epoxy-based composite. The degree of dispersion of the MWCNTs is controlled by varying the milling medium and the milling time. The MWCNTs are found to be more homogeneously dispersed when solvents (particularly, non-polar solvent, i.e., NMP) are used. MWCNTs gradually disperse on the surface of Cu powder because of the plastic deformation of the ductile Cu powder. However, long-time milling is found to destroy the molecular structure of MWCNTs, instead of effectively dispersing the MWCNTs more uniformly. Thus, the epoxy composite film fabricated in this study exhibits a higher electrical conductivity than 1.1 S/cm.

• Korean Chemical Engineering Research
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• 제54권1호
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• pp.44-51
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• 2016

전도성 물질인 철 입자(iron particles)를 절연체로 코팅하여 제작한 압분자심(powder core)은 비저항이 작기 때문에 고주파 영역에서 와전류 손실이 크다. 이 결함을 해결하기 위해서는 압분자심의 비저항을 증가시킬 필요가 있다. 이 연구에서는 압분자심의 비저항을 증가시키기 위하여 유성볼밀을 사용하여 전기전도성 철 입자에 산화제2구리를 코팅하였다. 반응표면분석법을 사용하여 코팅변수를 최적화하였다. 최적화 시 인자는 CuO 질량분율, 밀 회전 수, 코팅시간, 볼 크기, 볼 질량, 시료 질량이며, 반응변수는 비저항이었다. 6인자-일부요인배치법에 의하면 주된 인자는 CuO 질량분율, 밀 회전 수, 코팅시간이었다. 3-인자 완전요인배치법과 최대경사법을 사용하여 3개 인자의 수준을 선정하였다. 최대경사법을 사용하여 최고의 비저항을 갖는 영역에 접근하였다. 최종적으로 Box-Behnken법을 사용하여 스크린한 인자들의 반응표면을 분석하였다. Box-Behnken법 결과에 의하면 CuO 질량분율과 밀 회전 수가 코팅공정 효율에 영향을 주는 주요 인자이었다. CuO 질량분율이 증가함에 따라 비저항은 증가하였다. 그에 반해서 밀 회전 수가 감소함에 따라 비저항은 증가하였다. 코팅공정을 최적화한 모델로부터 계산한 예측값과 실험값과는 통계적으로 유의하게 일치하였다($Adj-R^2=0.944$). 비저항의 최고값을 갖는 코팅조건은 CuO 질량분율은 0.4, 밀 회전 수는 200 rpm, 코팅시간은 15분이었다. 이 조건에서 코팅한 정제의 비저항 측정값은 $530k{\Omega}{\cdot}cm$이었다.

• Tribology and Lubricants
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• 제12권4호
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• pp.52-59
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• 1996

The results of the electrical contact conductivity of multi-contact spots accounting the surface roughness and the non-conductive films of different origins such as air, water, cutting oil, and machining oil are presented. The array of metal spheres compressed between two flat plates has been used for simulation of the contact behavior of multiple contact of solids, under normal loading. Measurement of electrical contact resistance has been made using the equipment providing the adequate accuracy in the range of micro Ohms. The data on electrical contact resistance have been compared with theoretical predictions using the multiple contact model of constriction resistance. The effect of single spot number and array on conductivity of contact has been evaluated. The results of the experiments show that the contact resistance are closely related to the number of loading cycles, form of surface roughness, and presence of non-conductive films that reduce the size of the real electrical contact spots.