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http://dx.doi.org/10.4218/etrij.10.0109.0400

Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder  

Eom, Yong-Sung (Convergence Components & Materials Research Laboratory, ETRI)
Jang, Keon-Soo (Department of Polymer Science and Engineering, Sungkyunkwan University)
Moon, Jong-Tae (Convergence Components & Materials Research Laboratory, ETRI)
Nam, Jae-Do (Department of Polymer Science and Engineering, Sungkyunkwan University)
Publication Information
ETRI Journal / v.32, no.3, 2010 , pp. 414-421 More about this Journal
Abstract
The interconnection mechanisms of a smart anisotropic conductive adhesive (ACA) during processing have been characterized. For an understanding of chemorheological mechanisms between the fluxing polymer and solder powder, a thermal analysis as well as solder wetting and coalescence experiments were conducted. The compatibility between the viscosity of the fluxing polymer and melting temperature of solder was characterized to optimize the processing cycle. A fluxing agent was also used to remove the oxide layer performed on the surface of the solder. Based on these chemorheological phenomena of the fluxing polymer and solder, an optimum polymer system and its processing cycle were designed for high performance and reliability in an electrical interconnection system. In the present research, a bonding mechanism of the smart ACA with a polymer spacer ball to control the gap between both substrates is newly proposed and investigated. The solder powder was used as a conductive material instead of polymer-based spherical conductive particles in a conventional anisotropic conductive film.
Keywords
Smart ACA; anisotropic conductive adhesive; fluxing polymer; solder powder; electrical interconnection;
Citations & Related Records

Times Cited By Web Of Science : 5  (Related Records In Web of Science)
Times Cited By SCOPUS : 9
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