• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.510-514
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• 1997

The thin film that is electrically conductive and optically transparent is called conductive transparent thin film. ITO(Indium-Tin Oxide) which is a kind of conductive transparent thin film has been widely used in solar cell, transparent electrical heater, selective optical filter, FDP(Flat Display Panel) such as LCD(Liquid Crystal Display), PDP(Plasma Display Panel) and so on. Especially in PDP, ITO films is used as a transparent electrode in order to maintain discharge and decrease consumption power through the improvement of cell structure. In this study, we prepared ITO by reactive r.f. sputtering with indium-tin(Sn 10wt%) alloy target instead of indium-tin oxide target. The ITO films deposited at low temperature 15$0^{\circ}C$ and 8% $O_2$. Partial pressure showed about 3.6 Ω/$\square$. At the end of firing, the resistance of ITO was decreased, the optical transparence was improved above 90%.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.917-918
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• 2009

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.5
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• pp.532-537
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• 2004

FEF(Focused Electromagnetic Field) technique was newly developed that is based on the induction principle exciting electromagnetic field. The technique consists of an induction wire and a sensor for detecting electromagnetic field, and is applied in a non-contact mode. In this study, the technique was applied to the evaluation of EDM slits in some conductive materials - aluminum alloy, stainless steel and Inconel alloy. The voltage in the non-defect region is depended upon the measurement lift-off. The voltage signals on defects are measured with peak values, and the peak values changed with the depth of defects. The voltage distributions for all conductive materials are the same trend.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.10-15
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• 2016

In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.6
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• pp.380-385
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• 2016

Thermal characteristics of 20 W LED module on light thermal conductive plastic (TCP) heat sink were investigated in comparison with that on aluminum die casting alloy (ADC-12). Thermal simulations of the heat sinks were conducted by using flow simulation of SolidWorks with the following input parameters: density is 1.70 and $2.82kg/m^2$, thermal conductivity is 20 and $92W/(m{\cdot}K)$ for TCP and ADC-12, respectively. The simulated and measured temperatures of the LED modules on TCP heat sink were consistent with its measured temperature, which was $3^{\circ}C$ higher that on ADC-12. The fabricated LED module on TCP heat sink with a weight of 120.5 g was 30% lighter in weight than that of the ADC-12 reference with 171.0 g.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.9
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• pp.2866-2874
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• 1996

In the grinding of difficult-to-materials, the major problmes of conventional grinding are grinding burn, wheel wear, grinding surface crack, loading and glazing, When a conventioanl grinding wheel is used, wheel wear and grinding surface crack easily occur in low heat conductive material and annealed steel. Intermittent grinding is suitable for diffcult-to-matrical such as stainless steel, titanium alloy, aluminum alloy and copper alloy. The purpose of this paper is to develop a new type intermittent wheel of the grinding system for improving the problem of stainless steel grinding, to observe the effect of intermittent grinding on surface quality and grinding characteristics of stainless steel grinding using intermittent grinding wheel. The characteristics of intermittent grinding system improve surface quality, low grinding temperature and low loading.

• Journal of Electrochemical Science and Technology
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• v.10 no.1
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• pp.82-88
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• 2019

Here, we report on nanocrystalline Si-Al-M (M = Fe, Cu, Ni, Zr) alloys for use as an anode for lithium-ion batteries, which were fabricated via a melt-spinning method. Based on the XRD and TEM analyses, it was found that the Si-Al-M alloys consist of nanocrystalline Si grains surrounded by an amorphous matrix phase. Among the Si-Al-M alloys with different metal composition, Ni-incorporated Si-Al-M alloy electrode retained the high discharge capacity of 2492 mAh/g and exhibited improved cyclability. The superior $Li^+$ storage performance of Si-Al-M alloy with Ni component is mainly responsible for the incorporated Ni, which induces the formation of ductile and conductive inactive matrix with crystalline Al phase, in addition to the grain size reduction of active Si phase.

• Metals and materials international
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• v.24 no.6
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• pp.1275-1284
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• 2018

A rotating magnetic field (RMF) was applied in the solidification process of Cu-8Fe alloy. Focus on the mechanism of RMF on the solid solution Fe(Cu) atoms in Cu-8Fe alloy, the influences of RMF on solidification structure, solute distribution, and material properties were discussed. Results show that the solidification behavior of Cu-Fe alloy have influenced through the change of temperature and solute fields in the presence of an applied RMF. The Fe dendrites were refined and transformed to rosettes or spherical grains under forced convection. The solute distribution in Cu-rich phase and Fe-rich phase were changed because of the variation of the supercooling degree and the solidification rate. Further, the variation in solute distribution was impacted the strengthening mechanism and conductive mechanism of the material.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1411-1413
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• 1997

The thin film that is electrically conductive and optically transparent is called conductive transparent thin film. ITO(Indium-Tin Oxide) which is a kind of conductive transparent thin film has been widely used in solar cell, transparent electrical heater, selective optical filter, FDP(Flat Display Panel) such as LCD (Liquid Crystal Display), PDP(Plasma Display Panel) and so on. Especially in PDP, ITO films is used as a transparent electrode in order to maintain discharge and decrease consumption power through the improvement of cell structure. In this study, we prepared ITO by reactive r.f. sputtering with indium-tin(Sn wt 10%) alloy target instead of indium-tin oxide target. The ITO films deposited at low temperature $150^{\circ}C$ and 8% $O_2$ partial pressure showed about $3.6{\Omega}/{\square}$. At the end of firing, the resistance of ITO was decreased, the optical transparence was improved above 90%.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.37-42
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• 2011

In this paper, novel carbon nanotube (CNT)-filled Solderable electrically conductive adhesive (ECA) and joining process have been developed. To investigate the bonding characteristics of CNT-filled Solderable ECA, three types of Solderable ECAs with different CNT weight percent (0, 0.1, 1wt%) were formulated. For a joining process, the quad flat package (QFP) chip was used. The QFP chip had a size of $14{\times}14{\times}2.7$ mm and a 1 mm lead pitch. The test board had a Cu daisy-chained pattern with 18 ${\mu}m$ thick. After the bonding process, the bonding characteristics such as morphology of conduction path, electrical resistance and pull strength were measured for each formulated ECAs. As a result, the electrical and mechanical bonding characteristics for a QFP joints using CNT-filled ECA were improved about 10% compared to those of QFP joints using ECA without CNT.