Development of BGA Interconnection Process Using Solderable Anisotropic Conductive Adhesives |
Yim, Byung-Seung
(School of Mechanical Engineering, Chung-Ang University)
Lee, Jeong Il (School of Mechanical Engineering, Chung-Ang University) Oh, Seung Hoon (School of Mechanical Engineering, Chung-Ang University) Chae, Jong-Yi (School of Mechanical Engineering, Chung-Ang University) Hwang, Min Sub (School of Mechanical Engineering, Chung-Ang University) Kim, Jong-Min (School of Mechanical Engineering, Chung-Ang University) |
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