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Development of BGA Interconnection Process Using Solderable Anisotropic Conductive Adhesives  

Yim, Byung-Seung (School of Mechanical Engineering, Chung-Ang University)
Lee, Jeong Il (School of Mechanical Engineering, Chung-Ang University)
Oh, Seung Hoon (School of Mechanical Engineering, Chung-Ang University)
Chae, Jong-Yi (School of Mechanical Engineering, Chung-Ang University)
Hwang, Min Sub (School of Mechanical Engineering, Chung-Ang University)
Kim, Jong-Min (School of Mechanical Engineering, Chung-Ang University)
Publication Information
Journal of the Semiconductor & Display Technology / v.15, no.4, 2016 , pp. 10-15 More about this Journal
Abstract
In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.
Keywords
BGA interconnection process; Electrically conductive adhesive; Low-melting-point alloy; Polymer composite; Reduction capability; Underfill materials;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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