• 한국재료학회:학술대회논문집
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• 한국재료학회 2008년도 추계학술발표대회 및 제15회 신소재 심포지엄
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• pp.33.2-33.2
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• 2008

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.232-234
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• 2007

This study conducts numerical simulations of Isotropic conductive adhesives using low melting point alloy fillers during the reflow process. The CIP method and predictor-corrector method are used to simulate more accurately on free surface flow of low melting point alloy fillers. For finding out optical conditions to obtain reliable conduction paths, the present study conducts extensive numerical simulations.

• 대한기계학회논문집A
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• 제33권3호
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• pp.201-209
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• 2009

The objective of present research work is to design the heat conductive mould to improve cooling characteristics of the injection mould for a mouse. In order to obtain the high cooling rate of the mould, a heat conductive mould with three different materials was designed. The materials of the base structure, the mid-layer and the molding part of the heat conductive mould were chosen as Cu-Ni alloy (Ampcoloy 940) to improve the heat conductivity of the mould, Ni-Cu alloy (Monel 400) to reduce a thermal stress, injection tool steel (P21), respectively. Through the three-dimensional transient heat transfer analysis and the thermal stress analysis, the effects of the geometrical arrangement of each material on the cooling characteristics and the thermal stress distribution were examined. From the results of the analyses, a proper design of the thermal conductive mould was obtained.

• 한국공작기계학회논문집
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• 제17권2호
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• pp.97-103
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• 2008

In this investigation, conductivity of conductive inks was measured. A particular attention has been given to the effect of metal powders with various conductivity on the overall conductivity of the bulk ink. The conductivity of various solutions simulating conductive inks consisting of copper and silver was measured and the results have been discussed in relation to various applications of conductive inks in practice. A conductivity model simulating systems consisting of various materials has been introduced and the results were discussed. Materials of good conductivity are adversely affected by mixing with materials of poor conductivity simply through serial connection. However, parallel connection has rather little effect on the overall conductivity. The practical implication of various mixtures of materials on conductive inks has been discussed.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2006년도 추계학술대회
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• pp.324-324
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• 2006

Nb and Ti were added to 316 stainless steel, and then heat-treatments and surface treatments were performed on the 316 stainless steel and the Nb- and Ti-added alloys. All samples indicated enhanced electrical conductivity after surface treatments, whereas they showed low electrical conductivity before surface treatments due to the existence of non-conductive passive film on the alloy surface. In particular, the Hb- and Ti-added alloys showed remarkable enhancement of electrical conductivity compared to the original alloy, 316 stainless steel. Surface characterization revealed that small carbide particles formed on the alloy surface after surface treatments, while the alloys indicated flat surface structure before surface treatments. $Cr_{23}C_6$ mainly formed on the 316 stainless steel, and NbC and TiC mainly formed on the Nb- and Ti-added alloys, respectively. We attribute the enhanced electrical conductivity after surface treatments to the formation of these carbide particles, possibly acting as a means of electro-conductive channel through the passive film. Furthermore, NbC and TiC are supposed to be more effective carbides than $Cr_{23}C_6$ as electro-conductive channels of stainless steel

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.621-622
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• 2011

• ETRI Journal
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• 제41권6호
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• Journal of Welding and Joining
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• 제35권3호
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• pp.15-20
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• 2017

In this paper, two types of assemblies using CNT-filled SACAs (with 0.03 wt% CNTs and without CNT) were prepared to investigate the influence of carbon nanotubes (CNTs) on the reliability properties of solderable anisotropic conductive adhesives (SACAs) with a low-melting-point alloy (LMPA). Two types of reliability test including thermal shock (TS: -55 to $125^{\circ}C$, 1000 cycles) and high-temperature and high-humidity (HTHH: $85^{\circ}C$, 85% RH, 1000 h) tests were conducted. The SACA assemblies with and without CNTs showed stable electrical reliability properties due to the formation of wide and stable metallurgical interconnection between corresponding metallizations by the molten LMPA fillers. Although the mechanical pull strength of CNT-filled SACA assemblies was decreased after thermal aging (because of the excessive layer growth and planarization of the IMCs), the CNT-filled SACA with 0.03wt% CNTs showed enhanced mechanical reliability properties compared with the SACA assemblies no CNTs. This enhancement in mechanical performance was due to the reinforcement effect of the CNTs. These results demonstrate that CNTs within the CNT-filled SACAs can improve the reliability properties of CNT-filled SACAs joints due to their superior physical properties.

• Journal of Welding and Joining
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• 제27권3호
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• pp.23-31
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• 2009

• 대한금속재료학회지
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• 제46권12호
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• pp.817-822
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• 2008

Metal matrix composite (MMC) materials having low electrical contact resistance based on 316L stainless steel (STS) matrix alloy with $ZrB_2$ particles were fabricated for PEMFC (Polymer Electrolyte Membrane Fuel Cell) separator by powder metallurgy (PM). The effects of the boride particle addition into the matrix alloy on microstructure, surface morphology, and interfacial contact resistance (ICR) between the samples and gas diffusion layer (GDL) were investigated. Both conventional and PM 316L STS samples showed high ICR due to the existence of non-conductive passive film on the alloy surface. The addition of the boride particles, however, remarkably reduced ICR of the samples. SEM observation revealed that the boride particles were protruded out of the matrix surface and particle density existing on the surface increased with increasing the boride content, causing increase of the total contact area between the conductive particles and GDL. ICR of the samples also decreased with increasing the boride content resulted from the increased contact area.