Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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Characteristics of Conductive Adhesives Using Low-Melting-Point Alloy Fillers

저융점 합금 필러를 이용한 도전성 접착제의 유동해석

  • 이진운 (중앙대학교 공과대학 기계공학부) ;
  • 이성혁 (중앙대학교 공과대학 기계공학부) ;
  • 김종민 (중앙대학교 공과대학 기계공학부)
  • Published : 2007.11.15
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Abstract

This study conducts numerical simulations of Isotropic conductive adhesives using low melting point alloy fillers during the reflow process. The CIP method and predictor-corrector method are used to simulate more accurately on free surface flow of low melting point alloy fillers. For finding out optical conditions to obtain reliable conduction paths, the present study conducts extensive numerical simulations.

Keywords